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Priority to JP6206185ApriorityCriticalpatent/JPS61221235A/ja
Publication of JPS61221235ApublicationCriticalpatent/JPS61221235A/ja
Publication of JPH048461B2publicationCriticalpatent/JPH048461B2/ja
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0313—Organic insulating material
H05K1/032—Organic insulating material consisting of one material
H05K1/0326—Organic insulating material consisting of one material containing O
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates