JPH0464467B2 - - Google Patents

Info

Publication number
JPH0464467B2
JPH0464467B2 JP60154515A JP15451585A JPH0464467B2 JP H0464467 B2 JPH0464467 B2 JP H0464467B2 JP 60154515 A JP60154515 A JP 60154515A JP 15451585 A JP15451585 A JP 15451585A JP H0464467 B2 JPH0464467 B2 JP H0464467B2
Authority
JP
Japan
Prior art keywords
oxide film
silicon
substrate
silicon oxide
chip package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60154515A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6215850A (ja
Inventor
Katsuzo Uenishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP60154515A priority Critical patent/JPS6215850A/ja
Publication of JPS6215850A publication Critical patent/JPS6215850A/ja
Publication of JPH0464467B2 publication Critical patent/JPH0464467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/698—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H10W72/536—
    • H10W72/5363—
    • H10W90/722—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Waveguides (AREA)
JP60154515A 1985-07-13 1985-07-13 マルチチツプパツケ−ジ基板 Granted JPS6215850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60154515A JPS6215850A (ja) 1985-07-13 1985-07-13 マルチチツプパツケ−ジ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60154515A JPS6215850A (ja) 1985-07-13 1985-07-13 マルチチツプパツケ−ジ基板

Publications (2)

Publication Number Publication Date
JPS6215850A JPS6215850A (ja) 1987-01-24
JPH0464467B2 true JPH0464467B2 (cg-RX-API-DMAC10.html) 1992-10-15

Family

ID=15585939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60154515A Granted JPS6215850A (ja) 1985-07-13 1985-07-13 マルチチツプパツケ−ジ基板

Country Status (1)

Country Link
JP (1) JPS6215850A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535623B2 (ja) * 1989-10-17 1996-09-18 株式会社東芝 樹脂封止半導体装置
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
GB2290913B (en) * 1994-06-30 1998-03-11 Plessey Semiconductors Ltd Multi-chip module inductor structure
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components

Also Published As

Publication number Publication date
JPS6215850A (ja) 1987-01-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term