JPH04594B2 - - Google Patents

Info

Publication number
JPH04594B2
JPH04594B2 JP58169875A JP16987583A JPH04594B2 JP H04594 B2 JPH04594 B2 JP H04594B2 JP 58169875 A JP58169875 A JP 58169875A JP 16987583 A JP16987583 A JP 16987583A JP H04594 B2 JPH04594 B2 JP H04594B2
Authority
JP
Japan
Prior art keywords
serial number
semiconductor device
bonding
manufacturing process
displayed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58169875A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6062131A (ja
Inventor
Kenji Myajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58169875A priority Critical patent/JPS6062131A/ja
Publication of JPS6062131A publication Critical patent/JPS6062131A/ja
Publication of JPH04594B2 publication Critical patent/JPH04594B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP58169875A 1983-09-14 1983-09-14 半導体装置 Granted JPS6062131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58169875A JPS6062131A (ja) 1983-09-14 1983-09-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58169875A JPS6062131A (ja) 1983-09-14 1983-09-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS6062131A JPS6062131A (ja) 1985-04-10
JPH04594B2 true JPH04594B2 (enExample) 1992-01-08

Family

ID=15894573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58169875A Granted JPS6062131A (ja) 1983-09-14 1983-09-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS6062131A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248125A (ja) * 1990-02-26 1991-11-06 Sharp Corp 液晶表示素子
US5231432A (en) * 1991-12-03 1993-07-27 Florida Atlantic University Projector utilizing liquid crystal light-valve and color selection by diffraction
JPH06202096A (ja) * 1992-12-28 1994-07-22 Sony Corp 映像プロジェクタ装置
TWI381463B (zh) * 2008-01-04 2013-01-01 力成科技股份有限公司 打線機台辨識編碼之形成方法
JP4787854B2 (ja) * 2008-03-06 2011-10-05 力成科技股▲分▼有限公司 識別コードの形成方法

Also Published As

Publication number Publication date
JPS6062131A (ja) 1985-04-10

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