JPS6062131A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6062131A
JPS6062131A JP58169875A JP16987583A JPS6062131A JP S6062131 A JPS6062131 A JP S6062131A JP 58169875 A JP58169875 A JP 58169875A JP 16987583 A JP16987583 A JP 16987583A JP S6062131 A JPS6062131 A JP S6062131A
Authority
JP
Japan
Prior art keywords
leads
manufacturing process
positions
serial number
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58169875A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04594B2 (enExample
Inventor
Kenji Miyajima
宮島　賢治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58169875A priority Critical patent/JPS6062131A/ja
Publication of JPS6062131A publication Critical patent/JPS6062131A/ja
Publication of JPH04594B2 publication Critical patent/JPH04594B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP58169875A 1983-09-14 1983-09-14 半導体装置 Granted JPS6062131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58169875A JPS6062131A (ja) 1983-09-14 1983-09-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58169875A JPS6062131A (ja) 1983-09-14 1983-09-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS6062131A true JPS6062131A (ja) 1985-04-10
JPH04594B2 JPH04594B2 (enExample) 1992-01-08

Family

ID=15894573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58169875A Granted JPS6062131A (ja) 1983-09-14 1983-09-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS6062131A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231432A (en) * 1991-12-03 1993-07-27 Florida Atlantic University Projector utilizing liquid crystal light-valve and color selection by diffraction
US5500692A (en) * 1992-12-28 1996-03-19 Sony Corporation Image projecting apparatus for producing an image for display on a projection screen
US5680186A (en) * 1990-02-26 1997-10-21 Sharp Kabushiki Kaisha Liquid crystal display device with microlenses having a focal point between a cover layer and the liquid crystal layer's center
JP2009212461A (ja) * 2008-03-06 2009-09-17 Powertech Technology Inc 識別コードの形成方法
TWI381463B (zh) * 2008-01-04 2013-01-01 力成科技股份有限公司 打線機台辨識編碼之形成方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5680186A (en) * 1990-02-26 1997-10-21 Sharp Kabushiki Kaisha Liquid crystal display device with microlenses having a focal point between a cover layer and the liquid crystal layer's center
US5231432A (en) * 1991-12-03 1993-07-27 Florida Atlantic University Projector utilizing liquid crystal light-valve and color selection by diffraction
US5500692A (en) * 1992-12-28 1996-03-19 Sony Corporation Image projecting apparatus for producing an image for display on a projection screen
TWI381463B (zh) * 2008-01-04 2013-01-01 力成科技股份有限公司 打線機台辨識編碼之形成方法
JP2009212461A (ja) * 2008-03-06 2009-09-17 Powertech Technology Inc 識別コードの形成方法

Also Published As

Publication number Publication date
JPH04594B2 (enExample) 1992-01-08

Similar Documents

Publication Publication Date Title
JPS6062131A (ja) 半導体装置
JPS5860529A (ja) 半導体チツプの識別方法
JP2595962B2 (ja) 半導体装置
JPH06163642A (ja) 導電膜の貼着状態の良否判定方法
JPH0425194A (ja) 基板の識別方法
JP2536326B2 (ja) Ｌｓｉチップ設計装置
JPS5817640A (ja) 半導体装置
KR100400699B1 (ko) 와이어 본딩 방법 및 장치
JPH03148153A (ja) 半導体素子のトリミング方法
JPS62291126A (ja) パタ−ン認識マ−ク
JPH056659Y2 (enExample)
US7360716B2 (en) Method of determining at least one marking element on a substrate
JP2832618B2 (ja) プリント配線板の配線経路を形成するための各データの表示方法
JPH067401Y2 (ja) チップマウンタ用データ作成装置
JPS61234555A (ja) 半導体装置
KR950010017Y1 (ko) 디바이스의 라트넘버 표시장치
KR100224708B1 (ko) 조립된 칩의 웨이퍼 상의 위치 확인방법
JPH05114009A (ja) ワイヤボンデイング位置座標作成方法
JPH0817248A (ja) 品番表示テープを備えたワイヤハーネス及びワイヤハーネスの品番検査方法
JPS60224257A (ja) 厚膜ｉｃに於ける抵抗体トリミング方法
JPS61156839A (ja) 半導体装置
JPH01238030A (ja) 半導体集積回路の端子番号表示方法
JPH03268498A (ja) 部品の実装位置入力方法および実装位置入力装置およびそれらを用いたｎｃデータ作成方法
JPS61234025A (ja) 半導体装置
JPH08178645A (ja) Ｃｎｃ測定機におけるエラースキップ方法