JPH0457474B2 - - Google Patents

Info

Publication number
JPH0457474B2
JPH0457474B2 JP58178099A JP17809983A JPH0457474B2 JP H0457474 B2 JPH0457474 B2 JP H0457474B2 JP 58178099 A JP58178099 A JP 58178099A JP 17809983 A JP17809983 A JP 17809983A JP H0457474 B2 JPH0457474 B2 JP H0457474B2
Authority
JP
Japan
Prior art keywords
wafer
holding
rod
fulcrum
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58178099A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6072240A (ja
Inventor
Hideo Nagashima
Tadao Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP17809983A priority Critical patent/JPS6072240A/ja
Publication of JPS6072240A publication Critical patent/JPS6072240A/ja
Publication of JPH0457474B2 publication Critical patent/JPH0457474B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
JP17809983A 1983-09-28 1983-09-28 ウエ−ハ保持具 Granted JPS6072240A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17809983A JPS6072240A (ja) 1983-09-28 1983-09-28 ウエ−ハ保持具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17809983A JPS6072240A (ja) 1983-09-28 1983-09-28 ウエ−ハ保持具

Publications (2)

Publication Number Publication Date
JPS6072240A JPS6072240A (ja) 1985-04-24
JPH0457474B2 true JPH0457474B2 (enrdf_load_stackoverflow) 1992-09-11

Family

ID=16042620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17809983A Granted JPS6072240A (ja) 1983-09-28 1983-09-28 ウエ−ハ保持具

Country Status (1)

Country Link
JP (1) JPS6072240A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100958100B1 (ko) 2008-05-27 2010-05-17 영진전문대학 산학협력단 다점식 멀티 지그
CN103600954B (zh) * 2013-10-11 2015-10-07 京东方科技集团股份有限公司 一种掩模板搬运治具
JP2021039964A (ja) * 2019-08-30 2021-03-11 株式会社ディスコ ウェーハピンセット

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924852U (enrdf_load_stackoverflow) * 1972-06-10 1974-03-02
JPS5540208Y2 (enrdf_load_stackoverflow) * 1975-01-14 1980-09-19

Also Published As

Publication number Publication date
JPS6072240A (ja) 1985-04-24

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