JPS6227725B2 - - Google Patents
Info
- Publication number
- JPS6227725B2 JPS6227725B2 JP6981780A JP6981780A JPS6227725B2 JP S6227725 B2 JPS6227725 B2 JP S6227725B2 JP 6981780 A JP6981780 A JP 6981780A JP 6981780 A JP6981780 A JP 6981780A JP S6227725 B2 JPS6227725 B2 JP S6227725B2
- Authority
- JP
- Japan
- Prior art keywords
- core tube
- furnace core
- holding jig
- substrate holding
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6981780A JPS56165317A (en) | 1980-05-26 | 1980-05-26 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6981780A JPS56165317A (en) | 1980-05-26 | 1980-05-26 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56165317A JPS56165317A (en) | 1981-12-18 |
JPS6227725B2 true JPS6227725B2 (enrdf_load_stackoverflow) | 1987-06-16 |
Family
ID=13413684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6981780A Granted JPS56165317A (en) | 1980-05-26 | 1980-05-26 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56165317A (enrdf_load_stackoverflow) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0650756B2 (ja) * | 1982-08-27 | 1994-06-29 | 東京応化工業株式会社 | 薄板状被処理物の加熱処理装置 |
JPS58110034A (ja) * | 1981-12-24 | 1983-06-30 | Fujitsu Ltd | 縦型気相エピタキシヤル装置 |
JPS60140817A (ja) * | 1983-12-28 | 1985-07-25 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS61111524A (ja) * | 1984-11-06 | 1986-05-29 | Denkoo:Kk | 縦形半導体熱処理炉 |
JPS60182728A (ja) * | 1984-02-29 | 1985-09-18 | Fujitsu Ltd | 縦型炉 |
JPS60213022A (ja) * | 1984-04-09 | 1985-10-25 | Tekunisuko:Kk | 縦型支持具 |
JPS6112024A (ja) * | 1984-06-27 | 1986-01-20 | Fujitsu Ltd | 縦型加熱炉 |
JPH0220830Y2 (enrdf_load_stackoverflow) * | 1985-11-05 | 1990-06-06 | ||
JPS62122123A (ja) * | 1985-11-21 | 1987-06-03 | Toshiba Corp | 縦型熱処理装置 |
JPS62130534A (ja) * | 1985-12-02 | 1987-06-12 | Deisuko Saiyaa Japan:Kk | 縦型ウエ−ハ処理装置のためのウエ−ハ搬送装置 |
JPH0610674Y2 (ja) * | 1988-11-28 | 1994-03-16 | 株式会社福井信越石英 | ウエーハ支持装置 |
-
1980
- 1980-05-26 JP JP6981780A patent/JPS56165317A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56165317A (en) | 1981-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6227725B2 (enrdf_load_stackoverflow) | ||
JPS6221229A (ja) | 処理装置 | |
JPS58108735A (ja) | 縦型反応管用バスケツト | |
JPH03272132A (ja) | 加熱炉 | |
JPS5878423A (ja) | 半導体物品の熱処理方法及びその装置 | |
JPH08107079A (ja) | 縦型ウェ−ハボ−ト及び縦型熱処理炉 | |
JP2507771B2 (ja) | 熱処理炉への反応管の挿入及び取出し方法 | |
JPS63178519A (ja) | 半導体熱処理装置 | |
JPS633155Y2 (enrdf_load_stackoverflow) | ||
JP7238943B1 (ja) | 横型熱処理炉、熱処理方法及びシリコンウェーハの製造方法 | |
JP2742938B2 (ja) | 半導体ウェーハ熱処理装置 | |
JP3137141B2 (ja) | フッ化物光ファイバ線引き炉 | |
JPH07221022A (ja) | バレル型気相成長装置 | |
JP2506408B2 (ja) | ウェ―ハ熱処理用治具 | |
JPS6127626A (ja) | 半導体ウエハの熱処理方法及びこれに使用するウエハ支持具 | |
JPS61161711A (ja) | 半導体の熱処理方法及び熱処理装置 | |
JPS63136529A (ja) | 半導体製造装置 | |
JPH0222535B2 (enrdf_load_stackoverflow) | ||
JPS6295819A (ja) | 半導体素子の熱処理方法 | |
JP2763893B2 (ja) | 縦型熱処理炉 | |
JP2777643B2 (ja) | 半導体ウエハ熱処理装置のウエハ支持装置及び半導体ウエハ熱処理装置 | |
JPH0648827Y2 (ja) | 縦型気相成長装置 | |
JP2005019748A (ja) | ウエーハの熱処理用治具及び熱処理方法 | |
JPS6112026A (ja) | 縦型加熱炉 | |
JP2001118802A (ja) | 縦型ウエハボート及び縦型熱処理装置 |