JPS6227725B2 - - Google Patents

Info

Publication number
JPS6227725B2
JPS6227725B2 JP6981780A JP6981780A JPS6227725B2 JP S6227725 B2 JPS6227725 B2 JP S6227725B2 JP 6981780 A JP6981780 A JP 6981780A JP 6981780 A JP6981780 A JP 6981780A JP S6227725 B2 JPS6227725 B2 JP S6227725B2
Authority
JP
Japan
Prior art keywords
core tube
furnace core
holding jig
substrate holding
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6981780A
Other languages
Japanese (ja)
Other versions
JPS56165317A (en
Inventor
Kyoshi Izumida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6981780A priority Critical patent/JPS56165317A/en
Publication of JPS56165317A publication Critical patent/JPS56165317A/en
Publication of JPS6227725B2 publication Critical patent/JPS6227725B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【発明の詳細な説明】 〔概 要〕 縦型加熱炉を用い、該加熱炉の炉芯管内に被処
理基板を水平に搭載した基板保持治具を、該炉芯
管の内壁に触れずに挿入し、該基板保持治具を該
炉芯管の中心部にその内壁に触れずにほぼ垂直に
固定して被処理基板の高温反応処理を行う装置
で、出し入れに際して基板保持治具が炉芯管の内
壁を摩擦することがないので炉芯管及び治具材料
の摩擦粉の発生が防止され、該摩擦粉の焼き着き
による高温反応処理の歩留り低下が防止される。
[Detailed Description of the Invention] [Summary] A vertical heating furnace is used, and a substrate holding jig with a substrate to be processed horizontally mounted inside the furnace core tube of the heating furnace is held without touching the inner wall of the furnace core tube. A device that performs high-temperature reaction processing of the substrate to be processed by inserting the substrate holding jig into the center of the furnace core tube and fixing it almost vertically without touching the inner wall of the furnace core tube. Since the inner wall of the tube is not rubbed, generation of friction powder on the furnace core tube and jig material is prevented, and a decrease in yield in high temperature reaction treatment due to burning of the friction powder is prevented.

〔産業上の利用分野〕[Industrial application field]

本発明は高温反応処理装置に係り、詳しくは半
導体装置の製造工程に用いる半導体基板の高温反
応処理装置に関する。
The present invention relates to a high-temperature reaction processing apparatus, and more particularly to a high-temperature reaction processing apparatus for semiconductor substrates used in the manufacturing process of semiconductor devices.

半導体装置の製造工程においては、酸化、拡
散、気相成長等種々の高温反応処理が行われる。
In the manufacturing process of semiconductor devices, various high-temperature reaction treatments such as oxidation, diffusion, and vapor phase growth are performed.

〔従来の技術〕[Conventional technology]

従来これらの高温反応処理には横型の加熱装置
を使用し、該横型加熱装置にほぼ水平に配設され
ている透明石英等からなる炉芯管内へ、該炉芯管
の管軸に対して垂直に複数枚の被処理半導体基板
を搭載した透明石英等からなる基板保持治具を、
透明石英等からなるボートローダに載置して挿入
し、加熱する方法が一般に行われている。
Conventionally, a horizontal heating device is used for these high-temperature reaction treatments. A substrate holding jig made of transparent quartz, etc., on which multiple semiconductor substrates to be processed are mounted,
A commonly used method is to place it on a boat loader made of transparent quartz or the like, insert it, and heat it.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし上記従来方法においては、炉芯管内へ被
処理基板を挿入する際及び炉芯管から被処理基板
を取り出す際にボートローダが炉芯管の内面を摺
動するので、最近のように被処理半導体基板が大
径化され、しかも量産性を高めるために多数枚の
被処理基板を同時に処理するようになると、例え
ば100mmφの半導体基板の100枚同時処理において
はボートローダの荷重が約1Kg程度にも達するた
めに、該ボートローダと炉芯管内面との摩擦は極
めて大きくなり、ボートローダの摺動に際して多
量の石英(SiO2)粉が発生する。
However, in the above conventional method, the boat loader slides on the inner surface of the furnace core tube when inserting the substrate to be processed into the furnace core tube and when removing the substrate to be processed from the furnace core tube. As semiconductor substrates become larger in diameter and moreover a large number of substrates are processed at the same time to increase mass production, for example, when processing 100 semiconductor substrates with a diameter of 100 mm at the same time, the load on the boat loader becomes approximately 1 kg. Therefore, the friction between the boat loader and the inner surface of the furnace core tube becomes extremely large, and a large amount of quartz (SiO 2 ) powder is generated when the boat loader slides.

そして該石英粉は高温処理に際して、炉芯管内
へ流入する反応ガスによつて舞い上がり、被処理
半導体基板に付着し焼き着いて、高温反応処理の
歩留り即ち半導体装置の製造歩留りを低下させる
という問題があつた。
Then, during high-temperature processing, the quartz powder is blown up by the reaction gas flowing into the furnace core tube, adheres to the semiconductor substrate to be processed, and burns, reducing the yield of high-temperature reaction processing, that is, the manufacturing yield of semiconductor devices. It was hot.

そこで弗酸(HF)等による炉芯管の洗浄を頻
繁に行つて歩留り低下を軽減させなければならな
いため、多大の洗浄工数を要し、また炉芯管の寿
命が短くなり、更にまた炉芯管洗浄後の立ち上が
り時間を含めて加熱装置の稼動率が大幅に低下す
る等の問題も生じていた。
Therefore, the furnace core tube must be frequently cleaned with hydrofluoric acid (HF), etc. to reduce the yield loss, which requires a large amount of cleaning man-hours, shortens the life of the furnace core tube, and Problems also occurred, such as the operating rate of the heating device, including the start-up time after pipe cleaning, was significantly reduced.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点は、下端部に先細テーパ部20を介
してガス導入管19が接続され、上部が開口する
炉芯管17を有する縦型加熱炉16と、該炉芯管
17の内壁に触れずに該炉芯管17内に垂下し得
る外径を有して被処理基板をほぼ水平に支持し、
且つ下端部に芯出し管9を具備する基板保持治具
10と、排気口5を有し、該基板保持治具10の
上端部に固定され、該炉芯管17の開口部に被せ
られた状態で該基板保持治具10を該炉芯管17
の中心部にほぼ垂直に支持する炉芯管蓋6と、該
基板保持治具10を該炉芯管蓋6を介して該炉芯
管17の管軸上にほぼ垂直に垂下し、該基板保持
治具10を該炉芯管17の中心軸に沿つて該炉芯
管17内へ出し入れする基板保持治具上下機構1
5とを有し、該基板保持治具上下機構15によつ
て、該基板保持治具10を該炉芯管17内に、該
炉芯管蓋6が該炉芯管17の開口端に接する位置
まで挿入し、該炉芯管17の先細テーパ部20に
接する該芯出し管9と該炉芯管17開口部に被せ
られた炉芯管蓋6とによつて該基板保持治具10
を該炉芯管17の中心部にほぼ垂直に支持した状
態で被処理基板の高温反応処理を行う本発明によ
る高温反応処理装置によつて解決される。
The above-mentioned problem is caused by a vertical heating furnace 16 having a furnace core tube 17 with a gas introduction tube 19 connected to the lower end via a tapered portion 20 and an open upper portion, and the inner wall of the furnace core tube 17 not touching the inner wall of the furnace core tube 17. has an outer diameter that can hang down into the furnace core tube 17 and supports the substrate to be processed almost horizontally;
The substrate holding jig 10 has a centering tube 9 at its lower end and an exhaust port 5, and is fixed to the upper end of the substrate holding jig 10 and placed over the opening of the furnace core tube 17. In this state, the substrate holding jig 10 is attached to the furnace core tube 17.
The furnace core tube lid 6 is supported almost vertically at the center of the furnace core tube, and the substrate holding jig 10 is suspended almost vertically onto the tube axis of the furnace core tube 17 via the furnace core tube lid 6, and the substrate is Substrate holding jig vertical mechanism 1 for moving the holding jig 10 in and out of the furnace core tube 17 along the central axis of the furnace core tube 17
5, the substrate holding jig 10 is placed in the furnace core tube 17 by the substrate holding jig vertical mechanism 15, and the furnace core tube lid 6 is brought into contact with the open end of the furnace core tube 17. The substrate holding jig 10 is inserted into the furnace core tube 17 until the centering tube 9 contacts the tapered portion 20 of the furnace core tube 17, and the furnace core tube lid 6 is placed over the opening of the furnace core tube 17.
This problem is solved by the high-temperature reaction processing apparatus according to the present invention, which performs high-temperature reaction processing on a substrate to be processed while supporting the furnace core tube 17 substantially vertically at the center thereof.

〔作 用〕[Effect]

即ち本発明の高温反応処理装置においては、基
板保持治具上下機構によつて、炉芯管の内径より
小さい外径を有する基板保持治具が炉芯管の管軸
上に垂直に垂下されている。従つて炉芯管内への
基板保持治具の出し入れを炉芯管の内壁に触れず
に行うことができ、この際の炉芯管と基板保持治
具との摩擦粉の発生が回避される。
That is, in the high temperature reaction processing apparatus of the present invention, a substrate holding jig having an outer diameter smaller than the inner diameter of the furnace core tube is suspended perpendicularly onto the tube axis of the furnace core tube by the substrate holding jig vertical mechanism. There is. Therefore, the substrate holding jig can be taken in and out of the furnace core tube without touching the inner wall of the furnace core tube, and generation of friction powder between the furnace core tube and the substrate holding jig at this time is avoided.

また炉芯管内に挿入された基板保持治具は、基
板保持治具の下端部に配設され炉芯管下端部の先
細テーパ部に接する芯出し管と、基板保持治具の
上端部に固定された排気口を有する炉芯管蓋とに
よつて、該炉芯管の中心部にその管壁に触れずに
支持されるので、該基板保持治具を炉芯管内に静
置する際、静置位置から引き上げる際、及び高温
反応が行われている際に基板保持治具と炉芯管と
の間に大きな摩擦が生ずることはなく、この点で
も炉芯管材料及び治具材料の摩擦粉の発生は防止
される。
In addition, the substrate holding jig inserted into the furnace core tube is fixed to the centering tube, which is arranged at the lower end of the substrate holding jig and touches the tapered part of the lower end of the furnace core tube, and to the upper end of the substrate holding jig. Since the substrate holding jig is supported in the center of the furnace core tube without touching the tube wall by the furnace core tube cover having the exhaust port, when the substrate holding jig is placed in the furnace core tube, There is no significant friction between the substrate holding jig and the furnace core tube when it is lifted from a stationary position or during high-temperature reactions; Powder generation is prevented.

これによつて、高温反応処理における被処理基
板への炉芯管材料及び治具材料の摩擦粉の焼き着
きは殆んど皆無になり、高温反応処理の歩留りが
向上する。
As a result, there is almost no sticking of friction powder of the furnace core tube material and jig material to the substrate to be processed during the high temperature reaction treatment, and the yield of the high temperature reaction treatment is improved.

〔実施例〕〔Example〕

以下実施例を、図面実施例により具体的に説明
する。
Embodiments will be specifically described below with reference to drawing examples.

第1図a及びbは本発明の一実施例の工程別模
式側断面図、第2図は同実施例に用いる基板ホル
ダの正面図a及びA−A矢視断面図b、第3図は
同実施例に用いる基板保持治具の斜視図、第4図
は同実施例における基板ホルダ搭載時の基板保持
治具の側面図である。
1A and 1B are schematic side sectional views of an embodiment of the present invention according to each step, FIG. FIG. 4 is a perspective view of the substrate holding jig used in the same embodiment, and FIG. 4 is a side view of the substrate holding jig when the substrate holder is mounted in the same embodiment.

全図を通じ同一対象物は同一符合で示す。 Identical objects are indicated by the same reference numerals throughout the figures.

本発明の高温反応処理装置は例えば第1図a及
びbに示すように、下端部に先細テーパ部20を
介してガス導入管19が接続され、上部が開口す
る透明石英よりなる炉芯管17が垂直に保持され
た縦型加熱炉16と、該炉芯管17の内壁に触れ
ずに該炉芯管17内に垂下し得る外径を有し、図
示しない半導体基板を基板ホルダ1を介して炉芯
管17の管軸上にほぼ水平に保持し、且つ下端部
の中心に石英製のガス通路を兼ねる芯出し管9を
具備する透明石英製の基板保持治具10と、排気
口5を有し、該基板保持治具10の上部に溶着固
定され、該炉芯管17の開口端にかぶせた状態で
該基板保持治具10を該炉芯管17の中心部に垂
直に支持する透明石英製の炉芯管蓋6と、該基板
保持治具10を該炉芯管蓋6に配設されている吊
り手4を介して炉芯管17の管軸上に垂直に垂下
し、基板保持治具10を炉芯管17の内壁に触れ
ずに炉芯管17内へ出し入れする機能を有する。
例えば先端が上記吊り手4に決着されて滑車23
を介し該先端が上下するステンレスワイヤ15等
の基板保持治具上下機構を有して構成される。
As shown in FIGS. 1a and 1b, for example, the high-temperature reaction treatment apparatus of the present invention has a furnace core tube 17 made of transparent quartz, which has a gas introduction tube 19 connected to its lower end via a tapered portion 20, and whose upper portion is open. A vertical heating furnace 16 is vertically held, and has an outer diameter that allows it to hang down into the furnace core tube 17 without touching the inner wall of the furnace core tube 17. A substrate holding jig 10 made of transparent quartz, which is held substantially horizontally on the tube axis of the furnace core tube 17, and is equipped with a centering tube 9 made of quartz that also serves as a gas passage at the center of the lower end, and an exhaust port 5. is welded and fixed to the upper part of the substrate holding jig 10, and supports the substrate holding jig 10 perpendicularly to the center of the furnace core tube 17 while covering the open end of the furnace core tube 17. A furnace core tube lid 6 made of transparent quartz and the substrate holding jig 10 are suspended vertically onto the tube axis of the furnace core tube 17 via a hanger 4 provided on the furnace core tube lid 6. It has a function of moving the substrate holding jig 10 in and out of the furnace core tube 17 without touching the inner wall of the furnace core tube 17.
For example, the tip is fixed to the above-mentioned hanger 4 and the pulley 23
It is constructed by having a substrate holding jig up and down mechanism such as a stainless steel wire 15 whose tip is moved up and down via a substrate holding jig.

そして先ず、同図aに示すようにワイヤ15を
引上げた状態で該ワイヤ15の先端部を前記吊り
手4に結着された基板保持治具10を炉芯管17
の開口部の真上(管軸上)に滑車23を介して垂
直に吊り下げる。
First, as shown in FIG.
The tube is suspended vertically via a pulley 23 directly above the opening (on the axis of the tube).

高温反応処理に際しては同図bに示すように、
所望の反応ガス18を下部のガス導入管19から
流入し、所定の温度に昇温されている炉芯管17
の中へその中心軸に沿つて上記基板保持治具10
を徐々に下降し、基板保持治具10の炉芯管蓋6
を炉芯管17の開口部に被せる。この際基板保持
治具10の下端に配設されている芯出し管9が炉
芯管17下部の先細テーパ部20によりガイドさ
れ、該基板保持治具10は炉芯管17の中心にほ
ぼ垂直に保持される。
During high-temperature reaction treatment, as shown in Figure b,
A desired reaction gas 18 flows into the furnace core tube 17 from the lower gas introduction tube 19 and is heated to a predetermined temperature.
The substrate holding jig 10 is
gradually lower the furnace core tube lid 6 of the substrate holding jig 10.
cover the opening of the furnace core tube 17. At this time, the centering tube 9 disposed at the lower end of the substrate holding jig 10 is guided by the tapered part 20 at the bottom of the furnace core tube 17, and the substrate holding jig 10 is approximately perpendicular to the center of the furnace core tube 17. is maintained.

そして、高温反応処理は炉芯管蓋6によつて炉
芯管17の開口部が覆われ炉芯管17の内部が均
一な反応ガス18の雰囲気に保たれ、且つ基板保
持治具10を静止せしめた状態で行われる。
In the high-temperature reaction process, the opening of the furnace core tube 17 is covered by the furnace core tube lid 6, the inside of the furnace core tube 17 is maintained in a uniform atmosphere of the reaction gas 18, and the substrate holding jig 10 is kept stationary. It is done in a restrained state.

反応領域を通過した反応ガス18は炉芯管蓋6
の排気口5を通して例えば該高温反応装置を内包
するクリーンベンチ21内へ放出され排気ダクト
により室外に排出される。
The reaction gas 18 that has passed through the reaction area is transferred to the furnace core tube lid 6.
The gas is discharged through the exhaust port 5 into, for example, the clean bench 21 containing the high-temperature reaction apparatus, and is exhausted outside through an exhaust duct.

上記状態において被処理基板に所望の時間高温
反応処理が施された後、基板保持治具上下機構即
ち前記ステンレスワイヤ15を滑車23を介して
徐々に引上げ、再び同図aに示すように基板保持
治具10を炉芯管17の上部に引上げて高温反応
処理を完了する。
After the substrate to be processed is subjected to the high temperature reaction treatment for the desired time in the above state, the substrate holding jig vertical mechanism, that is, the stainless steel wire 15 is gradually pulled up via the pulley 23, and the substrate is held again as shown in FIG. The jig 10 is pulled up to the top of the furnace core tube 17 to complete the high temperature reaction treatment.

なお上記基板保持治具10の出し入れに際し
て、基板保持治具10を炉芯管17の内壁に触れ
させずに行うことは可能であるが、該基板保持治
具10が例え炉芯管17の内壁に触れたとして
も、該基板保持治具10の荷重は総て基板保持治
具上下機構即ちステンレスワイヤ15で支持され
ているので該基板保持治具10が炉芯管17の内
壁を強く摩擦することがなく、石英粉の発生は殆
どない。
Note that it is possible to take in and out the substrate holding jig 10 without touching the inner wall of the furnace core tube 17 with the substrate holding jig 10; Even if it touches the substrate holding jig 10, the entire load of the substrate holding jig 10 is supported by the substrate holding jig up/down mechanism, that is, the stainless steel wire 15, so the substrate holding jig 10 strongly rubs against the inner wall of the furnace core tube 17. There is no occurrence of quartz powder.

第2図a,bは上記実施例に示す高温反応処理
装置に用いる一般的な透明石英よりなる基板ホル
ダ1で、被処理半導体基板3は基板挿入溝2に差
し込まれて搭載する。
2a and 2b show a substrate holder 1 made of general transparent quartz used in the high-temperature reaction processing apparatus shown in the above embodiment, and a semiconductor substrate 3 to be processed is inserted into the substrate insertion groove 2 and mounted.

また同実施例に用いる基板保持治具10は第3
図に示すように、吊り手4が溶着され、排気口5
が設けられ透明石英板からなる炉芯管蓋6を上部
に有し、(図においては横に寝かせた状態で示し
ている)、該炉芯管蓋6に垂直に溶着された透明
石英からなる3本の支柱7の他端に透明石英から
なる環状枠8a及び8bを有し、該環状枠8bの
下方中心部に該環状枠8bに石英棒を介して溶着
固定された透明石英よりなる芯出し管9が配設さ
れた構造を有する。
Further, the substrate holding jig 10 used in the same embodiment is the third one.
As shown in the figure, the hanger 4 is welded and the exhaust port 5 is
is provided with a furnace core tube cover 6 made of a transparent quartz plate on the upper part (in the figure, it is shown in a horizontally lying state), and is made of transparent quartz welded vertically to the furnace core tube cover 6. The other ends of the three pillars 7 have annular frames 8a and 8b made of transparent quartz, and a core made of transparent quartz is welded and fixed to the annular frame 8b at the lower center of the annular frame 8b via a quartz rod. It has a structure in which an outlet pipe 9 is provided.

なお図中11は基板ホルダ11が搭載されるふ
ところ部を示す。
Note that 11 in the figure indicates a pocket portion on which the substrate holder 11 is mounted.

第4図は上記基板保持治具10に被処理基板を
搭載した状態を示している。
FIG. 4 shows a state in which a substrate to be processed is mounted on the substrate holding jig 10.

即ち、前記3本の支柱7に囲まれて形成されて
いるふところ部11に複数台の前記被処理半導体
基板3を搭載した基板ホルダ11を載置し、基板
保持治具10の炉芯管蓋6に形成されている基板
押さえ棒挿入孔12を通して該基板保持治具10
の環状枠8に形成されている基板押さえ棒挿入溝
13に透明石英よりなる基板押さえ棒14を差込
み、該基板保持治具10を基板保持治具上下機構
に前記吊り手4を介して垂直に垂下した際の被処
理基板処理半導体基板3の落下を防止する。
That is, the substrate holder 11 on which a plurality of the semiconductor substrates 3 to be processed are mounted is placed on the pocket portion 11 formed surrounded by the three pillars 7, and the furnace core tube cover of the substrate holding jig 10 is placed. The substrate holding jig 10 is inserted through the substrate holding rod insertion hole 12 formed in the substrate holding jig 6.
A substrate presser rod 14 made of transparent quartz is inserted into the substrate presser rod insertion groove 13 formed in the annular frame 8, and the substrate holding jig 10 is vertically attached to the substrate holding jig vertical mechanism via the hanger 4. This prevents the semiconductor substrate 3 to be processed from falling when it hangs down.

上記実施例に示すように本発明の高温反応処理
装置においては、下端部に先細テーパ部20を介
してガス導入管19が接続され上端部が開口する
縦型加熱炉16の炉芯管17内に、該炉芯管17
開口の上部における該炉芯管の管軸上に設けられ
た基板保持治具上下機構15によつて、該上下機
構15に垂直に垂下された炉芯管17の内径によ
り細い外径を有する基板保持治具(被処理基板が
水平に搭載されている)10を、該炉芯管17の
中心軸に沿つて垂下挿入し、該基板保持治具10
をその下端部に配設された炉芯管下端部の先細テ
ーパ部20に接する芯出し管9と、該基板保持治
具10の上端部に固定された排気口5を有する炉
芯管蓋6とによつて炉芯管17の中心部に支持し
て、塔載されている被処理基板の高温反応処理が
行われる。
As shown in the above embodiment, in the high-temperature reaction processing apparatus of the present invention, a gas introduction pipe 19 is connected to the lower end via the tapered part 20, and the furnace core tube 17 of the vertical heating furnace 16 is open at the upper end. , the furnace core tube 17
A substrate holding jig vertical mechanism 15 provided on the tube axis of the furnace core tube in the upper part of the opening allows a substrate having an outer diameter smaller than the inner diameter of the furnace core tube 17 suspended perpendicularly to the vertical mechanism 15. A holding jig 10 (on which the substrate to be processed is mounted horizontally) is inserted downwardly along the central axis of the furnace core tube 17, and the substrate holding jig 10 is inserted downwardly along the central axis of the furnace core tube 17.
A core tube lid 6 having a centering tube 9 in contact with the tapered part 20 at the lower end of the core tube and an exhaust port 5 fixed to the upper end of the substrate holding jig 10. As a result, high-temperature reaction processing is performed on substrates to be processed that are supported in the center of the furnace core tube 17 and mounted on the tower.

従つて基板保持治具10の、炉芯管17内への
出し入れ、及び炉芯管17内での支持を炉芯管の
内壁に触れずに行うことが可能であり、また炉芯
管17内への出し入れに際して例え基板保持治具
が多少傾いて炉芯管17の内壁に触れたとして
も、基板保持治具10の荷重が総て基板保持治具
上下機構15によつて支持されているので、炉芯
管17の内壁が基板保持治具10により強く摩擦
されていることはないので、炉芯管17内壁や基
板保持治具10が削られてその細粉が発生するこ
とは殆どない。従つて該細粉の焼きつきによる高
温反応処理歩留りの低下は防止される。
Therefore, it is possible to take the substrate holding jig 10 in and out of the furnace core tube 17 and to support it within the furnace core tube 17 without touching the inner wall of the furnace core tube 17. Even if the substrate holding jig slightly tilts and touches the inner wall of the furnace core tube 17 when taking it in and out of the furnace, the entire load of the substrate holding jig 10 is supported by the substrate holding jig up/down mechanism 15. Since the inner wall of the furnace core tube 17 is not strongly rubbed by the substrate holding jig 10, the inner wall of the furnace core tube 17 and the substrate holding jig 10 are rarely scraped and fine powder is hardly generated. Therefore, a decrease in the yield of high-temperature reaction treatment due to burning of the fine powder is prevented.

なお上記実施例においては、本発明に係る高温
反応装置が透明石英による炉芯管及び治具を用い
て構成されたが、本発明は高純度カーボン或いは
炭化珪素等で炉芯管及び治具を構成する際にも勿
論有効に適用される。
In the above embodiment, the high-temperature reaction apparatus according to the present invention was constructed using a furnace core tube and jig made of transparent quartz, but the present invention uses a furnace core tube and jig made of high-purity carbon, silicon carbide, etc. Of course, it can also be effectively applied when configuring.

〔発明の効果〕〔Effect of the invention〕

以上説明のように本発明によれば高温反応処理
装置における炉芯管と基板保持治具との摩擦によ
る炉芯管や治具の材料の細粉の発生が防止できる
ので、上記細粉の焼つきによる被処理基板の汚染
が防止され、高温反応処理の歩留りが向上する。
As explained above, according to the present invention, it is possible to prevent the generation of fine powder from the material of the furnace core tube and the jig due to friction between the furnace core tube and the substrate holding jig in a high-temperature reaction processing apparatus. Contamination of the substrate to be processed due to adhesion is prevented, and the yield of high-temperature reaction processing is improved.

また上記効果により、細粉除去のための炉芯管
の洗浄頻度も従来に比べ大幅に減少できるので、
洗浄工数の削減、炉芯管の長寿命化、及び加熱炉
の稼動率向上等の効果が生ずる。
Additionally, due to the above effects, the frequency of cleaning the furnace core tube to remove fine powder can be significantly reduced compared to conventional methods.
Effects such as a reduction in cleaning man-hours, a longer life of the furnace core tube, and an improvement in the operating rate of the heating furnace are produced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a及びbは本発明の一実施例の工程別模
式側断面図、第2図は同実施例に用いる基板ホル
ダの正面図a及びA−A矢視断面図b、第3図は
同実施例に用いる基板保持治具の斜視図、第4図
は同実施例における基板ホルダ搭載時の基板保持
治具の側面図である。 図において、1は基板ホルダ、2は基板挿入
溝、3は被処理半導体基板、4は吊り手、5は排
気口、6は炉芯管、7は支柱、8a,8bは環状
枠、9は芯出し管、10は基板保持治具、11は
ふところ部、12は基板押さえ棒挿入孔、13は
基板押さえ棒挿入溝、14は基板押さえ棒、15
はステンレスワイヤ、16は縦型加熱炉、17は
炉芯管、18は反応ガス、19はガス導入管、2
0は先細テーパ部、21はクリーンベンチ、22
は排気ダクト、23は滑車を示す。
1A and 1B are schematic side sectional views of an embodiment of the present invention according to each step, FIG. FIG. 4 is a perspective view of the substrate holding jig used in the same embodiment, and FIG. 4 is a side view of the substrate holding jig when the substrate holder is mounted in the same embodiment. In the figure, 1 is a substrate holder, 2 is a substrate insertion groove, 3 is a semiconductor substrate to be processed, 4 is a hanger, 5 is an exhaust port, 6 is a furnace core tube, 7 is a column, 8a and 8b are annular frames, and 9 is a Centering tube, 10 is a substrate holding jig, 11 is a pocket portion, 12 is a substrate presser rod insertion hole, 13 is a substrate presser rod insertion groove, 14 is a substrate presser rod, 15
1 is a stainless steel wire, 16 is a vertical heating furnace, 17 is a furnace core tube, 18 is a reaction gas, 19 is a gas introduction tube, 2
0 is a tapered part, 21 is a clean bench, 22
indicates an exhaust duct, and 23 indicates a pulley.

Claims (1)

【特許請求の範囲】 1 下端部に先細テーパ部20を介してガス導入
管19が接続され、上部が開口する炉芯管17を
有する縦型加熱炉16と、 該炉芯管17の内壁に触れずに該炉芯管17内
に垂下し得る外径を有して被処理基板をほぼ水平
に支持し、且つ下端部に芯出し管9を具備する基
板保持治具10と、 排気口5を有し、該基板保持治具10の上端部
に固定され、該炉芯管17の開口部に被せられた
状態で該基板保持治具10を該炉芯管17の中心
部にほぼ垂直に支持する炉芯管蓋6と、 該基板保持治具10を該炉芯管蓋6を介して該
炉芯管17の管軸上にほぼ垂直に垂下し、該基板
保持治具10を該炉芯管17の中心軸に沿つて該
炉芯管17内へ出し入れする基板保持治具上下機
構15とを有し、 該基板保持治具上下機構15によつて、該基板
保持治具10を該炉芯管17内に、該炉芯管蓋6
が該炉芯管17の開口端に接する位置まで挿入
し、 該炉芯管17の先細テーパ部20に接する該芯
出し管9と該炉芯管17開口部に被せられた炉芯
管蓋6とによつて該基板保持治具10を該炉芯管
17の中心部にほぼ垂直に支持した状態で被処理
基板の高温反応処理を行うことを特徴とする高温
反応処理装置。
[Scope of Claims] 1. A vertical heating furnace 16 having a furnace core tube 17 with an open top and a gas introduction tube 19 connected to the lower end via a tapered portion 20; a substrate holding jig 10 that has an outer diameter that allows it to hang down into the furnace core tube 17 without touching it, supports the substrate to be processed almost horizontally, and is equipped with a centering tube 9 at its lower end; and an exhaust port 5 is fixed to the upper end of the substrate holding jig 10, and the substrate holding jig 10 is held approximately perpendicular to the center of the furnace core tube 17 while being placed over the opening of the furnace core tube 17. The furnace core tube lid 6 to be supported and the substrate holding jig 10 are suspended almost perpendicularly onto the tube axis of the furnace core tube 17 via the furnace core tube lid 6, and the substrate holding jig 10 is attached to the furnace core tube lid 6. It has a substrate holding jig vertical mechanism 15 that moves the substrate holding jig in and out of the furnace core tube 17 along the central axis of the core tube 17, and the substrate holding jig 10 is moved in and out of the furnace core tube 17 by the substrate holding jig vertical mechanism 15. Inside the furnace core tube 17, the furnace core tube lid 6 is installed.
is inserted to a position where it touches the open end of the furnace core tube 17, and the centering tube 9 contacts the tapered part 20 of the furnace core tube 17, and the furnace core tube lid 6 is placed over the opening of the furnace core tube 17. A high-temperature reaction processing apparatus characterized in that high-temperature reaction processing of a substrate to be processed is performed with the substrate holding jig 10 supported substantially perpendicularly to the center of the furnace core tube 17.
JP6981780A 1980-05-26 1980-05-26 Manufacture of semiconductor device Granted JPS56165317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6981780A JPS56165317A (en) 1980-05-26 1980-05-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6981780A JPS56165317A (en) 1980-05-26 1980-05-26 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56165317A JPS56165317A (en) 1981-12-18
JPS6227725B2 true JPS6227725B2 (en) 1987-06-16

Family

ID=13413684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6981780A Granted JPS56165317A (en) 1980-05-26 1980-05-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56165317A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650756B2 (en) * 1982-08-27 1994-06-29 東京応化工業株式会社 Heat treatment equipment for thin plate
JPS58110034A (en) * 1981-12-24 1983-06-30 Fujitsu Ltd Vertical vapor phase epitaxial device
JPS60140817A (en) * 1983-12-28 1985-07-25 Fujitsu Ltd Manufacture of semiconductor device
JPS61111524A (en) * 1984-11-06 1986-05-29 Denkoo:Kk Vertical heat-treatment furnace for semiconductor
JPS60182728A (en) * 1984-02-29 1985-09-18 Fujitsu Ltd Vertical type furnace
JPS60213022A (en) * 1984-04-09 1985-10-25 Tekunisuko:Kk Vertical supporting tool
JPS6112024A (en) * 1984-06-27 1986-01-20 Fujitsu Ltd Vertical type heating furnace
JPH0220830Y2 (en) * 1985-11-05 1990-06-06
JPS62122123A (en) * 1985-11-21 1987-06-03 Toshiba Corp Vertical type thermal treatment equipment
JPS62130534A (en) * 1985-12-02 1987-06-12 Deisuko Saiyaa Japan:Kk Wafer conveyor for vertical wafer processor
JPH0610674Y2 (en) * 1988-11-28 1994-03-16 株式会社福井信越石英 Wafer support device

Also Published As

Publication number Publication date
JPS56165317A (en) 1981-12-18

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