JPH0527257B2 - - Google Patents

Info

Publication number
JPH0527257B2
JPH0527257B2 JP59125229A JP12522984A JPH0527257B2 JP H0527257 B2 JPH0527257 B2 JP H0527257B2 JP 59125229 A JP59125229 A JP 59125229A JP 12522984 A JP12522984 A JP 12522984A JP H0527257 B2 JPH0527257 B2 JP H0527257B2
Authority
JP
Japan
Prior art keywords
shaft
cartridges
wafers
moving mechanism
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59125229A
Other languages
English (en)
Japanese (ja)
Other versions
JPS615541A (ja
Inventor
Kunihiko Murakami
Hatsuo Hiraide
Hajime Yui
Ryosaku Chikaoka
Kazuhiko Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP12522984A priority Critical patent/JPS615541A/ja
Publication of JPS615541A publication Critical patent/JPS615541A/ja
Publication of JPH0527257B2 publication Critical patent/JPH0527257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Specific Conveyance Elements (AREA)
JP12522984A 1984-06-20 1984-06-20 移し替え装置 Granted JPS615541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12522984A JPS615541A (ja) 1984-06-20 1984-06-20 移し替え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12522984A JPS615541A (ja) 1984-06-20 1984-06-20 移し替え装置

Publications (2)

Publication Number Publication Date
JPS615541A JPS615541A (ja) 1986-01-11
JPH0527257B2 true JPH0527257B2 (enrdf_load_stackoverflow) 1993-04-20

Family

ID=14905014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12522984A Granted JPS615541A (ja) 1984-06-20 1984-06-20 移し替え装置

Country Status (1)

Country Link
JP (1) JPS615541A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068100Y2 (ja) * 1986-07-01 1994-03-02 東京エレクトロン相模株式会社 ウエハ移し替え突き上げ装置
JPH01122135A (ja) * 1987-11-06 1989-05-15 Seiko Epson Corp 半導体製造装置
JPH07111963B2 (ja) * 1988-09-12 1995-11-29 株式会社スガイ 基板の洗浄乾燥装置
JPH02215570A (ja) * 1989-02-16 1990-08-28 Matsushita Electric Ind Co Ltd 印字装置
CN113247611B (zh) * 2021-04-20 2022-04-29 深圳市真味生物科技有限公司 一种电子雾化液调味瓶选取系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945219B2 (ja) * 1976-05-17 1984-11-05 株式会社日立製作所 ウェハ処理装置
JPS5434774A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Article transfer device
JPS5483371U (enrdf_load_stackoverflow) * 1977-11-17 1979-06-13
JPS5643718A (en) * 1979-09-17 1981-04-22 Mitsubishi Electric Corp Semiconductor wafer shifting device
JPS56161653A (en) * 1980-05-16 1981-12-12 Fujitsu Ltd Replacing device of wafer
JPS60258459A (ja) * 1984-06-04 1985-12-20 Deisuko Saiyaa Japan:Kk 縦型熱処理装置

Also Published As

Publication number Publication date
JPS615541A (ja) 1986-01-11

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