JPH0447980B2 - - Google Patents
Info
- Publication number
- JPH0447980B2 JPH0447980B2 JP58206414A JP20641483A JPH0447980B2 JP H0447980 B2 JPH0447980 B2 JP H0447980B2 JP 58206414 A JP58206414 A JP 58206414A JP 20641483 A JP20641483 A JP 20641483A JP H0447980 B2 JPH0447980 B2 JP H0447980B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- wiring
- semiconductor device
- vertical
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/00—
-
- H10W72/07251—
-
- H10W72/20—
-
- H10W90/297—
-
- H10W90/722—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58206414A JPS6098655A (ja) | 1983-11-02 | 1983-11-02 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58206414A JPS6098655A (ja) | 1983-11-02 | 1983-11-02 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6098655A JPS6098655A (ja) | 1985-06-01 |
| JPH0447980B2 true JPH0447980B2 (index.php) | 1992-08-05 |
Family
ID=16522969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58206414A Granted JPS6098655A (ja) | 1983-11-02 | 1983-11-02 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6098655A (index.php) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4982266A (en) * | 1987-12-23 | 1991-01-01 | Texas Instruments Incorporated | Integrated circuit with metal interconnecting layers above and below active circuitry |
| US5354695A (en) * | 1992-04-08 | 1994-10-11 | Leedy Glenn J | Membrane dielectric isolation IC fabrication |
| JPH07109873B2 (ja) * | 1988-07-05 | 1995-11-22 | 株式会社東芝 | 半導体記憶装置 |
| US5435037A (en) * | 1993-12-22 | 1995-07-25 | Terry R. Douglas | Paint brush with replaceable bristle pack |
| US5391917A (en) * | 1993-05-10 | 1995-02-21 | International Business Machines Corporation | Multiprocessor module packaging |
| US6809421B1 (en) | 1996-12-02 | 2004-10-26 | Kabushiki Kaisha Toshiba | Multichip semiconductor device, chip therefor and method of formation thereof |
| JP4063944B2 (ja) * | 1998-03-13 | 2008-03-19 | 独立行政法人科学技術振興機構 | 3次元半導体集積回路装置の製造方法 |
| JP4110390B2 (ja) * | 2002-03-19 | 2008-07-02 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
-
1983
- 1983-11-02 JP JP58206414A patent/JPS6098655A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6098655A (ja) | 1985-06-01 |
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