JPH0436112Y2 - - Google Patents

Info

Publication number
JPH0436112Y2
JPH0436112Y2 JP1986052405U JP5240586U JPH0436112Y2 JP H0436112 Y2 JPH0436112 Y2 JP H0436112Y2 JP 1986052405 U JP1986052405 U JP 1986052405U JP 5240586 U JP5240586 U JP 5240586U JP H0436112 Y2 JPH0436112 Y2 JP H0436112Y2
Authority
JP
Japan
Prior art keywords
metal film
fet
package
effect transistor
field effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986052405U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62163944U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986052405U priority Critical patent/JPH0436112Y2/ja
Publication of JPS62163944U publication Critical patent/JPS62163944U/ja
Application granted granted Critical
Publication of JPH0436112Y2 publication Critical patent/JPH0436112Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Amplifiers (AREA)
JP1986052405U 1986-04-07 1986-04-07 Expired JPH0436112Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986052405U JPH0436112Y2 (enExample) 1986-04-07 1986-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986052405U JPH0436112Y2 (enExample) 1986-04-07 1986-04-07

Publications (2)

Publication Number Publication Date
JPS62163944U JPS62163944U (enExample) 1987-10-17
JPH0436112Y2 true JPH0436112Y2 (enExample) 1992-08-26

Family

ID=30877546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986052405U Expired JPH0436112Y2 (enExample) 1986-04-07 1986-04-07

Country Status (1)

Country Link
JP (1) JPH0436112Y2 (enExample)

Also Published As

Publication number Publication date
JPS62163944U (enExample) 1987-10-17

Similar Documents

Publication Publication Date Title
JP3036233B2 (ja) 半導体装置およびその製造方法
JP2833522B2 (ja) 半導体装置
JPH06125208A (ja) マイクロ波集積回路およびその製造方法
US4992764A (en) High-power FET circuit
JPS5884510A (ja) Ｆｅｔ装置を用いたｒｆ増巾回路
JPH0436112Y2 (enExample)
JPH05335487A (ja) 伝送回路素子
JP2567976B2 (ja) 高周波低雑音半導体装置
JPS6255721B2 (enExample)
JPS61172376A (ja) 半導体装置
JP3196752B2 (ja) 半導体集積回路装置とその製造方法
JPS5892270A (ja) ＧａＡｓマイクロ波モノリシツク集積回路装置
JPH0239573A (ja) ゲートバイアホール型半導体素子
JPS6350106A (ja) 高周波半導体装置
JPS6364081B2 (enExample)
JPH054281Y2 (enExample)
JPH09232334A (ja) 化合物半導体装置
JPH02140969A (ja) 半導体集積回路装置
JPH0416437Y2 (enExample)
JP2601952B2 (ja) 高周波半導体装置
JPS5832270Y2 (ja) 電界効果型トランジスタ
JPS63229725A (ja) 半導体装置
JPH0817291B2 (ja) マイクロ波回路
JPH02105701A (ja) マイクロ波集積回路用バイアス回路
JPS58140140A (ja) 半導体装置