JPH0416437Y2 - - Google Patents

Info

Publication number
JPH0416437Y2
JPH0416437Y2 JP1985127619U JP12761985U JPH0416437Y2 JP H0416437 Y2 JPH0416437 Y2 JP H0416437Y2 JP 1985127619 U JP1985127619 U JP 1985127619U JP 12761985 U JP12761985 U JP 12761985U JP H0416437 Y2 JPH0416437 Y2 JP H0416437Y2
Authority
JP
Japan
Prior art keywords
bonding
bonding wire
extraction electrode
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985127619U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236535U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985127619U priority Critical patent/JPH0416437Y2/ja
Publication of JPS6236535U publication Critical patent/JPS6236535U/ja
Application granted granted Critical
Publication of JPH0416437Y2 publication Critical patent/JPH0416437Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Wire Bonding (AREA)
JP1985127619U 1985-08-21 1985-08-21 Expired JPH0416437Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985127619U JPH0416437Y2 (enExample) 1985-08-21 1985-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985127619U JPH0416437Y2 (enExample) 1985-08-21 1985-08-21

Publications (2)

Publication Number Publication Date
JPS6236535U JPS6236535U (enExample) 1987-03-04
JPH0416437Y2 true JPH0416437Y2 (enExample) 1992-04-13

Family

ID=31022543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985127619U Expired JPH0416437Y2 (enExample) 1985-08-21 1985-08-21

Country Status (1)

Country Link
JP (1) JPH0416437Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS6236535U (enExample) 1987-03-04

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