JPS6255721B2 - - Google Patents
Info
- Publication number
- JPS6255721B2 JPS6255721B2 JP56169058A JP16905881A JPS6255721B2 JP S6255721 B2 JPS6255721 B2 JP S6255721B2 JP 56169058 A JP56169058 A JP 56169058A JP 16905881 A JP16905881 A JP 16905881A JP S6255721 B2 JPS6255721 B2 JP S6255721B2
- Authority
- JP
- Japan
- Prior art keywords
- output
- input
- electrode
- metal
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Wire Bonding (AREA)
- Microwave Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56169058A JPS5868954A (ja) | 1981-10-20 | 1981-10-20 | 高周波トランジスタのパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56169058A JPS5868954A (ja) | 1981-10-20 | 1981-10-20 | 高周波トランジスタのパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5868954A JPS5868954A (ja) | 1983-04-25 |
| JPS6255721B2 true JPS6255721B2 (enExample) | 1987-11-20 |
Family
ID=15879556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56169058A Granted JPS5868954A (ja) | 1981-10-20 | 1981-10-20 | 高周波トランジスタのパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5868954A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510758A (en) * | 1993-04-07 | 1996-04-23 | Matsushita Electric Industrial Co., Ltd. | Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps |
| JP4760930B2 (ja) | 2009-02-27 | 2011-08-31 | 株式会社デンソー | Ic搭載基板、多層プリント配線板、及び製造方法 |
| AU2010281317A1 (en) * | 2009-08-04 | 2012-02-23 | Gan Systems Inc. | Island matrixed gallium nitride microwave and power switching transistors |
| US9818857B2 (en) | 2009-08-04 | 2017-11-14 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| JP6615414B1 (ja) | 2018-11-13 | 2019-12-04 | 三菱電機株式会社 | 高周波増幅器および高周波増幅器モジュール |
-
1981
- 1981-10-20 JP JP56169058A patent/JPS5868954A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5868954A (ja) | 1983-04-25 |
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