JPH0418697B2 - - Google Patents

Info

Publication number
JPH0418697B2
JPH0418697B2 JP60267250A JP26725085A JPH0418697B2 JP H0418697 B2 JPH0418697 B2 JP H0418697B2 JP 60267250 A JP60267250 A JP 60267250A JP 26725085 A JP26725085 A JP 26725085A JP H0418697 B2 JPH0418697 B2 JP H0418697B2
Authority
JP
Japan
Prior art keywords
wire
bonding
ball
workpiece
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60267250A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62128130A (ja
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP60267250A priority Critical patent/JPS62128130A/ja
Publication of JPS62128130A publication Critical patent/JPS62128130A/ja
Publication of JPH0418697B2 publication Critical patent/JPH0418697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
JP60267250A 1985-11-29 1985-11-29 ワイヤボンデイング方法 Granted JPS62128130A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60267250A JPS62128130A (ja) 1985-11-29 1985-11-29 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60267250A JPS62128130A (ja) 1985-11-29 1985-11-29 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS62128130A JPS62128130A (ja) 1987-06-10
JPH0418697B2 true JPH0418697B2 (https=) 1992-03-27

Family

ID=17442217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60267250A Granted JPS62128130A (ja) 1985-11-29 1985-11-29 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS62128130A (https=)

Also Published As

Publication number Publication date
JPS62128130A (ja) 1987-06-10

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