JPH0418697B2 - - Google Patents
Info
- Publication number
- JPH0418697B2 JPH0418697B2 JP60267250A JP26725085A JPH0418697B2 JP H0418697 B2 JPH0418697 B2 JP H0418697B2 JP 60267250 A JP60267250 A JP 60267250A JP 26725085 A JP26725085 A JP 26725085A JP H0418697 B2 JPH0418697 B2 JP H0418697B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- ball
- workpiece
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は熱圧着ワイヤボンダ、熱圧着超音波併
用ワイヤボンダ等によるワイヤボンデイング方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding method using a thermocompression wire bonder, a thermocompression ultrasonic wire bonder, or the like.
［従来の技術］
周知の如く、ワイヤボンダは、リードフレーム
上にペレツトが固着されたワークの第１ボンド点
と第２ボンド点にワイヤを接続するために用いら
れる。かかるワイヤボンダの内、熱圧着ワイヤボ
ンダ、熱圧着超音波併用ワイヤボンダ等において
は、ワークの第１ボンド点にワイヤボンデイング
を行うに当り、キヤピラリに挿通されてキヤピラ
リより突出したワイヤの先端に電気トーチで放電
してボールが形成される。[Prior Art] As is well known, a wire bonder is used to connect a wire to a first bond point and a second bond point of a workpiece having a pellet fixed to a lead frame. Among such wire bonders, thermocompression wire bonders, thermocompression ultrasonic wire bonders, etc., when wire bonding is performed at the first bonding point of the workpiece, discharge electricity with an electric torch to the tip of the wire that is inserted into the capillary and protrudes from the capillary. A ball is formed.
従来、ワークの最初の第１ボンド点へのワイヤ
ボンデイングは、ワークがボンデイング位置へ送
られてくる途中でキヤピラリの先端に突出したワ
イヤ先端に電気トーチの放電によつてボールを形
成し、ワークが位置決めされた後にキヤピラリを
下降させてワイヤボンデイングを行つていた。ま
たワークの第２番目、第３番目…の第１ボンド点
へのワイヤボンデイングは、その前の第２ボンド
点のワイヤボンデイングが終了し、ワイヤが第２
ボンド点の付根で切断された後に電気トーチの放
電によつてボールが形成されて行われる。 Conventionally, in wire bonding to the first bonding point of a workpiece, an electric torch discharges a ball to form a ball at the tip of the wire protruding from the tip of a capillary while the workpiece is being sent to the bonding position. After positioning, the capillary was lowered and wire bonding was performed. In addition, when wire bonding to the second, third, etc. first bond points on the workpiece, the wire bonding to the previous second bond point is completed, and the wire is transferred to the second bond point.
This is done by cutting at the base of the bond point and then forming a ball by discharging an electric torch.
［発明が解決しようとする問題点］
ところで、最近になつて、ワークの最初の第１
ボンド点へのワイヤボンデイングについては、ワ
イヤのはがれ（不着）が多いことが判つた。この
原因は判明すれば非常に単純なことであるが、当
業者においては頭をなやましていたのが実情であ
る。本出願人は、種々実験の結果、次のようなこ
とをつきとめた。[Problems to be solved by the invention] Recently, it has become clear that the first
Regarding wire bonding to bond points, it was found that there were many cases of wire peeling (non-adhesion). The cause of this problem would be very simple if it were known, but the reality is that it has puzzled those skilled in the art. As a result of various experiments, the applicant has found the following.
ワークの第２番目、第３番目…の第１ボンド点
へのワイヤはがれは生じないのに、ワイヤの最初
の第１ボンド点のみのはがれが多いことに着目し
た。ワークの第２番目、第３番目…の第１ボンド
点へのワイヤボンデイングは、ワークの送り時間
がなく、ボールを形成した後に直ちにワイヤボン
デイングするので、ボールが暖まつた状態にある
ために良好なワイヤボンデイングが行われると思
われる。 It was noticed that although the wire did not peel off to the second, third, etc. first bond points of the workpiece, only the first bond point of the wire often peeled off. Wire bonding to the first bond point of the second, third, etc. of the work is good because there is no time to feed the work and the wire bonding is performed immediately after forming the ball, so the ball is in a warm state. It seems likely that some wire bonding will be done.
しかし、ワークの最初の第１ボンド点へのワイ
ヤボンデイングは、トータル的なワイヤボンデイ
ング時間を短縮するために、ワークがボンデイン
グ位置へ送られてくる途中でボールを形成してい
る。このため、ワイヤボンデイング時にはボール
の温度が下つて硬化するので、ボンダビリテイが
悪く、ワイヤのはがれが発生し易い。 However, in wire bonding to the first bonding point at the beginning of the work, a ball is formed on the work on the way to the bonding position in order to shorten the total wire bonding time. For this reason, during wire bonding, the temperature of the ball drops and hardens, resulting in poor bondability and easy wire peeling.
本発明の目的は、ボンダビリテイに優れ、ワイ
ヤはがれが防止されるワイヤボンデイング方法を
提供することにある。 An object of the present invention is to provide a wire bonding method that has excellent bondability and prevents wire peeling.
［問題点を解決するための手段］
上記従来技術の問題点は、ワークが移送されて
ボンデイング位置に位置決めされた後で、ワーク
の最初の第１ボンド点にワイヤボンデイングを行
う直前に、キヤピラリに挿通されたワイヤの先端
に電気トーチで放電してボールを形成しワイヤボ
ンデイングを行うことによつて解消される。[Means for Solving the Problems] The problem with the above conventional technology is that after the workpiece is transferred and positioned at the bonding position, immediately before wire bonding is performed on the first bonding point of the workpiece, the capillary is This problem can be solved by discharging the tip of the inserted wire with an electric torch to form a ball and performing wire bonding.
［実施例］
以下、本発明のワイヤボンデイング方法の一実
施例について説明する。ワークがボンデイング位
置に送られて位置決めされた後に、キヤピラリよ
り突出したワイヤの先端に電気トーチの放電によ
つてボールを形成し、その後直ちにキヤピラリを
下降させてワークの最初の第１ボンド点にワイヤ
ボンデイングを行う。ここで、ボール形成時には
キヤピラリからワイヤが抜けないようにクランパ
でワイヤをクランプした状態にしておく。ボール
形成後にはクランパは開状態にする。[Example] Hereinafter, an example of the wire bonding method of the present invention will be described. After the workpiece is sent to the bonding position and positioned, a ball is formed at the tip of the wire protruding from the capillary by discharging an electric torch, and then the capillary is immediately lowered and the wire is placed at the first bonding point of the workpiece. Perform bonding. Here, when forming the ball, the wire is clamped with a clamper so that it does not come off from the capillary. After the ball is formed, the clamper is opened.
このように、ワークの最初の第１ボンド点にワ
イヤボンデイングする直前にボールを形成するの
で、ボールは温度が下らない内にワイヤボンデイ
ングされる。これにより、ボンダビリテイが向上
し、ワイヤはがれが殆ど少なくなつた。 In this way, since the ball is formed immediately before wire bonding to the first bond point of the workpiece, the ball can be wire bonded before the temperature drops. This improved bondability and reduced wire peeling.
なお、ワイヤボンダがワイヤボンデイング途中
で停止した場合は、再度ボンデイングスタートを
させ、キヤピラリがボンデイングのために下降す
る直前にボールを形成するようにする。 Note that if the wire bonder stops during wire bonding, bonding is restarted so that a ball is formed just before the capillary descends for bonding.
［発明の効果］
以上の説明から明らかなように、本発明によれ
ば、ワークが移送されてボンデイング位置に位置
決めされた後で、ワークの最初の第１ボンド点に
ワイヤボンデイングを行う直前に、キヤピラリに
挿通されたワイヤの先端に電気トーチで放電して
ボールを形成しワイヤボンデイングを行うので、
ボンダビリテイに優れ、ワイヤはがれが防止され
る。[Effects of the Invention] As is clear from the above description, according to the present invention, after the workpiece has been transferred and positioned at the bonding position, immediately before wire bonding is performed at the first bonding point of the workpiece, Wire bonding is performed by discharging the tip of the wire inserted into the capillary with an electric torch to form a ball.
Excellent bondability and prevents wire peeling.
Claims (1)
決めされた後で、ワークの最初の第１ボンド点に
ワイヤボンデイングを行う直前に、キヤピラリに
挿通されたワイヤの先端に電気トーチで放電して
ボールを形成しワイヤボンデイングを行うことを
特徴とするワイヤボンデイング方法。1 After the workpiece has been transferred and positioned in the bonding device, and immediately before wire bonding is performed at the first bond point on the workpiece, an electric torch is used to discharge electricity at the tip of the wire inserted into the capillary to form a ball. A wire bonding method characterized by performing wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60267250A JPS62128130A (en) | 1985-11-29 | 1985-11-29 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60267250A JPS62128130A (en) | 1985-11-29 | 1985-11-29 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62128130A JPS62128130A (en) | 1987-06-10 |
| JPH0418697B2 true JPH0418697B2 (en) | 1992-03-27 |
Family
ID=17442217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60267250A Granted JPS62128130A (en) | 1985-11-29 | 1985-11-29 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128130A (en) |
-
1985
- 1985-11-29 JP JP60267250A patent/JPS62128130A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62128130A (en) | 1987-06-10 |
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