JPS6052585B2 - ワイヤボンディング法 - Google Patents

ワイヤボンディング法

Info

Publication number
JPS6052585B2
JPS6052585B2 JP53007305A JP730578A JPS6052585B2 JP S6052585 B2 JPS6052585 B2 JP S6052585B2 JP 53007305 A JP53007305 A JP 53007305A JP 730578 A JP730578 A JP 730578A JP S6052585 B2 JPS6052585 B2 JP S6052585B2
Authority
JP
Japan
Prior art keywords
wire
wedge
bonding
bonding method
vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53007305A
Other languages
English (en)
Other versions
JPS54101668A (en
Inventor
一壽 高島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP53007305A priority Critical patent/JPS6052585B2/ja
Publication of JPS54101668A publication Critical patent/JPS54101668A/ja
Publication of JPS6052585B2 publication Critical patent/JPS6052585B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明はワイヤボンディング法に関し、主として半導体
装置の電極をワイヤにより超音波接合して組立てる場合
のワイヤボンディングを対象とするものである。
超音波ワイヤボンディング法は第１図を参照し接合に際
してワイヤを押さえるためのくさび型棒状体であるウェ
ッジを使用し、その押え部をなすピール部（かかと）５
でワイヤ（例えばＡｌ）をアルミニウム電極に押しつけ
た状態で上記ウェッジに超音波振動を与えることにより
行うワイヤボンディング法であり、一般に同図ａ−ｆに
示す順序でボンディングが行なわれる。
ａはクランパー６を閉じてワイヤ３を供給する状態、を
はワイヤ３をウェッジ４のピール５で押しつけ、超音波
振動を与えることによりチップ１の電極２にボンディン
グする状態、ｃはクランパー６を開いたままウェッジ４
をリード７の先端部上に移動している状態、ｄは再びワ
イヤ３をウェッジ４のピール５で押しつけ、超音波振動
を与えることによりりード７にボンディングする状態、
ｅはクランパー６を閉じた状態で、クランパー６を後に
引いてワイヤ３を切離す状態、ｆはウェッジ４、クラン
パ−６を一体に上昇した状態をそれぞれ示すものである
。ｆに示す状態からａに示す状態に移行し、これら一連
の動作が繰返されることになる。ところで、従来におい
て、第１図ａに示すワイヤ３の供給をする動作で、第２
図に示すようにウェッジ４のピール５の角部をあるいは
ワイヤ供給孔の角部ａにワイヤ３の先端があたり、ワイ
ヤが正しく供給されないことがあつた。
これは、ワイヤ３の先端に曲りｃができる場合に多く起
き、その結果、ボンディングされないという不良あるい
は圧着不良が発生した。元来、ワイヤはワイヤ供給孔内
の遊びを利用して、より水平に近い角度で供給すること
が望ましい。
すなわち、クランプ６によつて供給されたワイヤをウェ
ッジで押さえるためにウェッジが下降する際、ワイヤ供
給孔内をワイヤが若干上昇する（戻る）という現象が起
き（このときはクランプは開いているからワイヤ３の先
端が電極２の表面に押さえられた状態になるため起きる
）、ウェッジ４のピール５で押さえられる面積が不充分
となる場合があるが、ワイヤをより水平に近い向きにす
ればする程その傾向が小さくなるからであり、−また、
ワイヤの向きをより水平に近い向きにする程テールの長
さが短かくすることができるからである。しかるに、ワ
イヤを水平に近づけた（寝かせた）方向で供給すればす
る程、ワイヤの先端が角部ａあるいはｂでひつかかる可
能が多くなる。
したがつて、ひつかかりをなくすこととワイヤのもどり
をなくすことは二律背反の関係にあつた。したがつて本
発明はかかるワイヤのひつかかりをなくすことを目的と
するもので、その一つの実施例はワイヤ供給孔内を通し
てワイヤを供給するときにウエツジに対して振動を与え
ることにある。これを詳細に述べれば、ワイヤ供給孔内
を通してクランプによりワイヤを供給する際にウエツジ
に対して振動を与えれば、例え一時的にワイヤの先端が
角部Ａ，ｂにひつかかつても振動によりすぐはずれ、ク
ランプによつて正しくワイヤが供給されるのである。
この振動は、従来において一回のワイヤボンデイングで
超音波振動が２回ウエツジに加えられた（そえは２回の
圧着工程の際に加えられた）のを１回増やし、ワイヤ供
給時〔第１図ａに示す動作時〕にも超音波振動を加える
ことによつて与えることができる。
その結果、ボンデイングされないという事故、あるいは
ワイヤ供給量不足が原因となる圧着形状不良が極めて少
なくなつた。
また、それに伴つて、ワイヤ供給孔内の遊びを最大限に
利用してワイヤをより水平に近い方向で供給できるよう
になり、その結果、ワイヤのテールの長さが従来よりも
加μｍ短かくなり、配線短絡事故が少なくなつた。
【図面の簡単な説明】
第１図ａ−ｆは一回のワイヤボンデイング作業における
各動作を順番に示す断面図、第２図は従来の問題点を示
す断面図である。 １・・・・・・チツプ、２・・・・・・電極、３・・・
・・・ワイヤ、４００１ウエツジ、５″″ＥＯＩ″ピー
ル、ト０′ＥＯｌクランパ−、７・・・・・・リード、
Ａ，ｂ・・・・・・角部、ｃ・・・・・・りードの曲り
。

Claims (1)

    【特許請求の範囲】
  1. １ ワイヤ押付具に設けたワイヤ供給孔内を通してワイ
    ヤを供給するワイヤボンディング法において、上記ワイ
    ヤ供給孔内を通してワイヤを供給するときに上記ワイヤ
    押付具に対してボンディングの際に用いる超音波振動を
    与えることを特徴とするワイヤボンディング法。
JP53007305A 1978-01-27 1978-01-27 ワイヤボンディング法 Expired JPS6052585B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53007305A JPS6052585B2 (ja) 1978-01-27 1978-01-27 ワイヤボンディング法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53007305A JPS6052585B2 (ja) 1978-01-27 1978-01-27 ワイヤボンディング法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60095501A Division JPS60242629A (ja) 1985-05-07 1985-05-07 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS54101668A JPS54101668A (en) 1979-08-10
JPS6052585B2 true JPS6052585B2 (ja) 1985-11-20

Family

ID=11662292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53007305A Expired JPS6052585B2 (ja) 1978-01-27 1978-01-27 ワイヤボンディング法

Country Status (1)

Country Link
JP (1) JPS6052585B2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3537850A1 (en) 2018-03-08 2019-09-11 LG Electronics Inc. Induction heating device having improved indicator structure
EP3654735A1 (en) 2018-11-19 2020-05-20 LG Electronics Inc. Induction heating device having improved structure for compact arrangement of components and ease of assembling
WO2020213947A1 (en) * 2019-04-18 2020-10-22 Lg Electronics Inc. Induction heating device providing improved user experience and user interface
WO2020213951A1 (en) * 2019-04-18 2020-10-22 Lg Electronics Inc. Induction heating device providing improved user experience and user interface
WO2020213948A1 (en) * 2019-04-18 2020-10-22 Lg Electronics Inc. Induction heating device providing improved user experience and user interface

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60242629A (ja) * 1985-05-07 1985-12-02 Hitachi Ltd ワイヤボンデイング装置
JPH0628345Y2 (ja) * 1985-09-06 1994-08-03 帝人製機 株式会社 クローラ駆動装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3537850A1 (en) 2018-03-08 2019-09-11 LG Electronics Inc. Induction heating device having improved indicator structure
EP3654735A1 (en) 2018-11-19 2020-05-20 LG Electronics Inc. Induction heating device having improved structure for compact arrangement of components and ease of assembling
US11140753B2 (en) 2018-11-19 2021-10-05 Lg Electronics Inc. Induction heating device having improved component arrangement structure and assemblability
WO2020213947A1 (en) * 2019-04-18 2020-10-22 Lg Electronics Inc. Induction heating device providing improved user experience and user interface
WO2020213951A1 (en) * 2019-04-18 2020-10-22 Lg Electronics Inc. Induction heating device providing improved user experience and user interface
WO2020213948A1 (en) * 2019-04-18 2020-10-22 Lg Electronics Inc. Induction heating device providing improved user experience and user interface

Also Published As

Publication number Publication date
JPS54101668A (en) 1979-08-10

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