JPH0418464B2 - - Google Patents
Info
- Publication number
- JPH0418464B2 JPH0418464B2 JP59208843A JP20884384A JPH0418464B2 JP H0418464 B2 JPH0418464 B2 JP H0418464B2 JP 59208843 A JP59208843 A JP 59208843A JP 20884384 A JP20884384 A JP 20884384A JP H0418464 B2 JPH0418464 B2 JP H0418464B2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- mold
- transfer
- cavity
- molten resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 51
- 238000012546 transfer Methods 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 10
- 238000004891 communication Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20884384A JPS6185829A (ja) | 1984-10-03 | 1984-10-03 | 半導体素子のトランスフア樹脂モ−ルド成形方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20884384A JPS6185829A (ja) | 1984-10-03 | 1984-10-03 | 半導体素子のトランスフア樹脂モ−ルド成形方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6185829A JPS6185829A (ja) | 1986-05-01 |
JPH0418464B2 true JPH0418464B2 (el) | 1992-03-27 |
Family
ID=16563019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20884384A Granted JPS6185829A (ja) | 1984-10-03 | 1984-10-03 | 半導体素子のトランスフア樹脂モ−ルド成形方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6185829A (el) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0644581B2 (ja) * | 1986-06-27 | 1994-06-08 | 三菱電機株式会社 | 樹脂封止形半導体の製造方法 |
FR2615037B1 (fr) * | 1987-05-06 | 1990-04-27 | Radiotechnique Compelec | Procede et moule pour l'encapsulation d'un dispositif semi-conducteur par injection de resine |
WO2008093511A1 (ja) * | 2007-01-30 | 2008-08-07 | Konica Minolta Opto, Inc. | 光学素子の成形装置及び光学素子の成形方法 |
JP5824765B2 (ja) * | 2011-01-11 | 2015-12-02 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5868940A (ja) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | 樹脂封止型半導体のトランスフア成形装置 |
JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
JPS5911232A (ja) * | 1982-07-12 | 1984-01-20 | Hitachi Ltd | 樹脂封止方法 |
-
1984
- 1984-10-03 JP JP20884384A patent/JPS6185829A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5868940A (ja) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | 樹脂封止型半導体のトランスフア成形装置 |
JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
JPS5911232A (ja) * | 1982-07-12 | 1984-01-20 | Hitachi Ltd | 樹脂封止方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6185829A (ja) | 1986-05-01 |
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