WO2008093511A1 - 光学素子の成形装置及び光学素子の成形方法 - Google Patents

光学素子の成形装置及び光学素子の成形方法 Download PDF

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Publication number
WO2008093511A1
WO2008093511A1 PCT/JP2008/050060 JP2008050060W WO2008093511A1 WO 2008093511 A1 WO2008093511 A1 WO 2008093511A1 JP 2008050060 W JP2008050060 W JP 2008050060W WO 2008093511 A1 WO2008093511 A1 WO 2008093511A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical element
element forming
forming
forming apparatus
lmb
Prior art date
Application number
PCT/JP2008/050060
Other languages
English (en)
French (fr)
Inventor
Shigeru Hosoe
Takemi Miyazaki
Yuiti Fujii
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to CN2008800031939A priority Critical patent/CN101600555B/zh
Priority to JP2008556032A priority patent/JPWO2008093511A1/ja
Publication of WO2008093511A1 publication Critical patent/WO2008093511A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

　成形材料の性質に関わらず、稼働率を高めることができる光学素子の成形装置及び成形方法を提供する。下型ＬＭに保持キャビティＬＭｂを設け、押圧プランジャＰＰは、上型ＵＭを通って保持キャビティＬＭｂに侵入する構造とする。このようにすることにより、押圧プランジャＰＰは、成形材料ＭＭを押圧する直前まで液体化した樹脂に触れないため、押圧プランジャＰＰと貫通孔ＵＭｃとの隙間に樹脂が流れ込んで硬化することを抑制し、これにより清掃作業による成形動作の中断を抑えることができる。
PCT/JP2008/050060 2007-01-30 2008-01-08 光学素子の成形装置及び光学素子の成形方法 WO2008093511A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800031939A CN101600555B (zh) 2007-01-30 2008-01-08 光学元件成型装置及光学元件成型方法
JP2008556032A JPWO2008093511A1 (ja) 2007-01-30 2008-01-08 光学素子の成形装置及び光学素子の成形方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-019368 2007-01-30
JP2007019368 2007-01-30

Publications (1)

Publication Number Publication Date
WO2008093511A1 true WO2008093511A1 (ja) 2008-08-07

Family

ID=39673825

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050060 WO2008093511A1 (ja) 2007-01-30 2008-01-08 光学素子の成形装置及び光学素子の成形方法

Country Status (3)

Country Link
JP (1) JPWO2008093511A1 (ja)
CN (1) CN101600555B (ja)
WO (1) WO2008093511A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102205587A (zh) * 2010-03-16 2011-10-05 松下电器产业株式会社 成形机、模制电动机的制造方法和电气设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61297114A (ja) * 1985-06-26 1986-12-27 Toshiba Corp トランスフア・モ−ルド加工方法
JPH09201846A (ja) * 1996-01-25 1997-08-05 Apic Yamada Kk リリースフィルムを用いる樹脂モールド方法及び樹脂モールド装置並びにこれに用いる樹脂タブレット
JPH11300781A (ja) * 1998-04-22 1999-11-02 Matsushita Electric Works Ltd 樹脂成形方法及び成形用金型装置
JP2002122708A (ja) * 2000-10-13 2002-04-26 Canon Inc アライメントマーカーを持つマイクロレンズ基板、及びそれを備えた液晶表示装置
JP2004134607A (ja) * 2002-10-11 2004-04-30 New Japan Radio Co Ltd 半導体装置の樹脂封止方法および装置
WO2005093131A1 (ja) * 2004-03-26 2005-10-06 Osaka Prefectural Government 微細パターン複製用金型の作製方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185829A (ja) * 1984-10-03 1986-05-01 Michio Osada 半導体素子のトランスフア樹脂モ−ルド成形方法
JPS63108958A (ja) * 1986-10-27 1988-05-13 Toshiba Mach Co Ltd 竪型ダイカスト鋳造方法及び装置
JPH0236039U (ja) * 1988-09-01 1990-03-08
JPH09122879A (ja) * 1995-10-30 1997-05-13 Toshiba Mach Co Ltd ダイカストマシンにおける射出追従制御装置
JP2002350608A (ja) * 2001-05-23 2002-12-04 Konica Corp 撮像レンズ、撮像装置、金型及び撮像レンズの成形方法
JP4730307B2 (ja) * 2004-10-29 2011-07-20 コニカミノルタオプト株式会社 プラスチックレンズの製造装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61297114A (ja) * 1985-06-26 1986-12-27 Toshiba Corp トランスフア・モ−ルド加工方法
JPH09201846A (ja) * 1996-01-25 1997-08-05 Apic Yamada Kk リリースフィルムを用いる樹脂モールド方法及び樹脂モールド装置並びにこれに用いる樹脂タブレット
JPH11300781A (ja) * 1998-04-22 1999-11-02 Matsushita Electric Works Ltd 樹脂成形方法及び成形用金型装置
JP2002122708A (ja) * 2000-10-13 2002-04-26 Canon Inc アライメントマーカーを持つマイクロレンズ基板、及びそれを備えた液晶表示装置
JP2004134607A (ja) * 2002-10-11 2004-04-30 New Japan Radio Co Ltd 半導体装置の樹脂封止方法および装置
WO2005093131A1 (ja) * 2004-03-26 2005-10-06 Osaka Prefectural Government 微細パターン複製用金型の作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102205587A (zh) * 2010-03-16 2011-10-05 松下电器产业株式会社 成形机、模制电动机的制造方法和电气设备

Also Published As

Publication number Publication date
CN101600555B (zh) 2012-09-05
JPWO2008093511A1 (ja) 2010-05-20
CN101600555A (zh) 2009-12-09

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