JPH0213931B2 - - Google Patents

Info

Publication number
JPH0213931B2
JPH0213931B2 JP10821384A JP10821384A JPH0213931B2 JP H0213931 B2 JPH0213931 B2 JP H0213931B2 JP 10821384 A JP10821384 A JP 10821384A JP 10821384 A JP10821384 A JP 10821384A JP H0213931 B2 JPH0213931 B2 JP H0213931B2
Authority
JP
Japan
Prior art keywords
resin
plunger
pressurizing
pot
tablet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10821384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60251633A (ja
Inventor
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10821384A priority Critical patent/JPS60251633A/ja
Publication of JPS60251633A publication Critical patent/JPS60251633A/ja
Publication of JPH0213931B2 publication Critical patent/JPH0213931B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10821384A 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置 Granted JPS60251633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10821384A JPS60251633A (ja) 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10821384A JPS60251633A (ja) 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Publications (2)

Publication Number Publication Date
JPS60251633A JPS60251633A (ja) 1985-12-12
JPH0213931B2 true JPH0213931B2 (el) 1990-04-05

Family

ID=14478891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10821384A Granted JPS60251633A (ja) 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Country Status (1)

Country Link
JP (1) JPS60251633A (el)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0186241U (el) * 1987-11-30 1989-06-07
US5200125A (en) * 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
GB2252746B (en) * 1991-01-17 1995-07-12 Towa Corp A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
MY109641A (en) * 1991-03-20 1997-03-31 Nitto Denko Corp Resin tablet for semiconductor sealing,process for producing the same, and process for producing semiconductor devices using the same
KR0137851B1 (ko) * 1992-04-13 1998-05-01 쯔게 슈이찌 트랜스퍼 성형 방법 및 트랜스퍼 성형 기계
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP3566426B2 (ja) * 1995-10-30 2004-09-15 Ｔｏｗａ株式会社 電子部品の樹脂成形装置
US7291304B2 (en) * 2004-07-01 2007-11-06 Husky Injection Molding Systems Ltd. Coinjection molding cooled shooting pot cylinder

Also Published As

Publication number Publication date
JPS60251633A (ja) 1985-12-12

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