JPS60251633A - トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置 - Google Patents

トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Info

Publication number
JPS60251633A
JPS60251633A JP10821384A JP10821384A JPS60251633A JP S60251633 A JPS60251633 A JP S60251633A JP 10821384 A JP10821384 A JP 10821384A JP 10821384 A JP10821384 A JP 10821384A JP S60251633 A JPS60251633 A JP S60251633A
Authority
JP
Japan
Prior art keywords
resin
plunger
pressurizing
pot
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10821384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213931B2 (el
Inventor
Michio Osada
道男 長田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10821384A priority Critical patent/JPS60251633A/ja
Publication of JPS60251633A publication Critical patent/JPS60251633A/ja
Publication of JPH0213931B2 publication Critical patent/JPH0213931B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10821384A 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置 Granted JPS60251633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10821384A JPS60251633A (ja) 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10821384A JPS60251633A (ja) 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Publications (2)

Publication Number Publication Date
JPS60251633A true JPS60251633A (ja) 1985-12-12
JPH0213931B2 JPH0213931B2 (el) 1990-04-05

Family

ID=14478891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10821384A Granted JPS60251633A (ja) 1984-05-28 1984-05-28 トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置

Country Status (1)

Country Link
JP (1) JPS60251633A (el)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0186241U (el) * 1987-11-30 1989-06-07
EP0530377A1 (en) * 1991-03-20 1993-03-10 Nitto Denko Corporation Semiconductor sealing resin tablet and its manufacture
US5200125A (en) * 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
US5435953A (en) * 1991-01-17 1995-07-25 Towa Corporation Method of molding resin for sealing an electronic device
US5603879A (en) * 1993-04-22 1997-02-18 Towa Corporation Method of molding resin to seal electronic parts using two evacuation steps
US5770128A (en) * 1992-04-13 1998-06-23 Apic Yamada Corporation Method of transfer molding and a transfer molding machine
EP0771636A3 (en) * 1995-10-30 1999-08-18 Towa Corporation Resin sealing/molding apparatus for electronic parts
EP1765563A1 (en) * 2004-07-01 2007-03-28 Husky Injection Molding Systems Ltd. Coinjection molding cooled shooting pot cylinder

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0186241U (el) * 1987-11-30 1989-06-07
US5200125A (en) * 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
US5507633A (en) * 1991-01-17 1996-04-16 Towa Corporation Resin molding apparatus for sealing an electronic device
US5435953A (en) * 1991-01-17 1995-07-25 Towa Corporation Method of molding resin for sealing an electronic device
US5645787A (en) * 1991-03-20 1997-07-08 Nitto Denko Corporation Process for producing semiconductor devices using resin tablets
EP0530377A1 (en) * 1991-03-20 1993-03-10 Nitto Denko Corporation Semiconductor sealing resin tablet and its manufacture
US5770128A (en) * 1992-04-13 1998-06-23 Apic Yamada Corporation Method of transfer molding and a transfer molding machine
US5834035A (en) * 1993-04-19 1998-11-10 Towa Corporation Method of and apparatus for molding resin to seal electronic parts
US5603879A (en) * 1993-04-22 1997-02-18 Towa Corporation Method of molding resin to seal electronic parts using two evacuation steps
EP0771636A3 (en) * 1995-10-30 1999-08-18 Towa Corporation Resin sealing/molding apparatus for electronic parts
EP1134064A2 (en) * 1995-10-30 2001-09-19 Towa Corporation Resin sealing/molding apparatus for electronic parts
SG90015A1 (en) * 1995-10-30 2002-07-23 Towa Corp Resin sealing/molding apparatus for electronic parts
EP1134064A3 (en) * 1995-10-30 2004-03-03 Towa Corporation Resin sealing/molding apparatus for electronic parts
EP1765563A1 (en) * 2004-07-01 2007-03-28 Husky Injection Molding Systems Ltd. Coinjection molding cooled shooting pot cylinder
EP1765563A4 (en) * 2004-07-01 2007-08-29 Husky Injection Molding CYLINDER OF COOLED INJECTION INJECTION POTS IN CO-INJECTION MOLDING

Also Published As

Publication number Publication date
JPH0213931B2 (el) 1990-04-05

Similar Documents

Publication Publication Date Title
JP2612795B2 (ja) ランナーレス射出成形装置
US6068809A (en) Method of injection molding elements such as semiconductor elements
GB2252746A (en) Resin sealing of electronic parts
CN104070634B (zh) 成型品生产装置、成型品生产方法及成型品
JPS60251633A (ja) トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置
JPH0820040A (ja) 射出成形方法
JPH0416940B2 (el)
JPH09141688A (ja) 電子部品の射出成形方法及び装置
JPS6315892B2 (el)
JPH0537474Y2 (el)
JPH0374892B2 (el)
JPH0356341Y2 (el)
JP3581743B2 (ja) 電子部品の樹脂封止成形方法及び装置
JPS6031930A (ja) 熱可塑性樹脂のプレス成形方法
JP2666630B2 (ja) 半導体装置の製造方法
JP2518661B2 (ja) 半導体素子の樹脂封止成形方法及び装置
JPS5889334A (ja) 射出成形用金型
JPH11168114A (ja) 半導体チップ用の樹脂封止装置
KR101973630B1 (ko) 수지역류 가스 인젝션을 이용한 수지 성형물 제조 방법
KR100340979B1 (ko) 전자부품의수지봉지성형방법
CN210362287U (zh) 一种针对热固性塑料开发的冷流道系统
JP2000000850A (ja) 射出成形用金型
JPS61125821A (ja) 樹脂成形装置
JP2706914B2 (ja) 電子部品の樹脂封止成形方法及び金型
JPH0511531B2 (el)