JPH038113B2 - - Google Patents

Info

Publication number
JPH038113B2
JPH038113B2 JP61049196A JP4919686A JPH038113B2 JP H038113 B2 JPH038113 B2 JP H038113B2 JP 61049196 A JP61049196 A JP 61049196A JP 4919686 A JP4919686 A JP 4919686A JP H038113 B2 JPH038113 B2 JP H038113B2
Authority
JP
Japan
Prior art keywords
pad
lead
semiconductor chip
wide
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61049196A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62205653A (ja
Inventor
Katsufusa Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP61049196A priority Critical patent/JPS62205653A/ja
Publication of JPS62205653A publication Critical patent/JPS62205653A/ja
Priority to US07/255,294 priority patent/US4912546A/en
Publication of JPH038113B2 publication Critical patent/JPH038113B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61049196A 1986-03-06 1986-03-06 リ−ドフレ−ムおよび半導体装置の製造方法 Granted JPS62205653A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61049196A JPS62205653A (ja) 1986-03-06 1986-03-06 リ−ドフレ−ムおよび半導体装置の製造方法
US07/255,294 US4912546A (en) 1986-03-06 1988-10-11 Lead frame and method of fabricating a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61049196A JPS62205653A (ja) 1986-03-06 1986-03-06 リ−ドフレ−ムおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62205653A JPS62205653A (ja) 1987-09-10
JPH038113B2 true JPH038113B2 (enEXAMPLES) 1991-02-05

Family

ID=12824249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61049196A Granted JPS62205653A (ja) 1986-03-06 1986-03-06 リ−ドフレ−ムおよび半導体装置の製造方法

Country Status (2)

Country Link
US (1) US4912546A (enEXAMPLES)
JP (1) JPS62205653A (enEXAMPLES)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447063A (en) * 1987-08-18 1989-02-21 Rohm Co Ltd Structure of lead frame
JPH07176677A (ja) * 1993-08-31 1995-07-14 Texas Instr Inc <Ti> 低コストリードフレームの設計及び製造方法
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
US6921967B2 (en) * 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
JP2006049694A (ja) * 2004-08-06 2006-02-16 Freescale Semiconductor Inc 二重ゲージ・リードフレーム
JP5889753B2 (ja) * 2012-08-31 2016-03-22 新電元工業株式会社 リードフレーム及び樹脂封止型半導体装置の製造方法
JP6189222B2 (ja) * 2014-01-20 2017-08-30 新電元工業株式会社 リードフレーム及びリードフレームの製造方法
JP6258044B2 (ja) * 2014-01-20 2018-01-10 新電元工業株式会社 リードフレーム及びリードフレームの製造方法
JP7145798B2 (ja) * 2019-03-19 2022-10-03 三菱電機株式会社 半導体装置の製造方法および半導体装置
US20250038077A1 (en) * 2023-07-28 2025-01-30 Texas Instruments Incorporated Electronic device with lead lock

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2336385A (en) * 1941-03-14 1943-12-07 Standard Mfg Co Electric connector
US3361251A (en) * 1966-07-22 1968-01-02 Vaco Products Co Mounting for electrical terminals and method of making same
US3837001A (en) * 1971-12-09 1974-09-17 Lucas Industries Ltd A spring contact for semi-conductor devices
FR2477786A1 (fr) * 1980-03-07 1981-09-11 Socapex Bande d'elements de contact a tenue en rive pour dispositif de connexion et procede de mise en oeuvre de tels elements de contact
US4438181A (en) * 1981-01-13 1984-03-20 Jon M. Schroeder Electronic component bonding tape
JPS59155159A (ja) * 1983-02-24 1984-09-04 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS6019365A (ja) * 1983-07-13 1985-01-31 Toshiba Corp 垂直輪郭回路
JPS629656A (ja) * 1985-07-08 1987-01-17 Shinko Electric Ind Co Ltd リ−ドフレ−ム
US4663651A (en) * 1986-04-14 1987-05-05 Gte Products Corporation Segmented lead frame strip for IC chip carrier

Also Published As

Publication number Publication date
JPS62205653A (ja) 1987-09-10
US4912546A (en) 1990-03-27

Similar Documents

Publication Publication Date Title
US5034350A (en) Semiconductor device package with dies mounted on both sides of the central pad of a metal frame
KR100730906B1 (ko) 리드 프레임 장치와 그 제조 방법
JPH08255862A (ja) リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
JPH038113B2 (enEXAMPLES)
JPS6238863B2 (enEXAMPLES)
JP2569400B2 (ja) 樹脂封止型半導体装置の製造方法
JPS6223097Y2 (enEXAMPLES)
JPS629656A (ja) リ−ドフレ−ム
KR200153438Y1 (ko) 탭테이프를 이용한 칩스케일 패키지
JPH0228966A (ja) 半導体装置
JPS60175433A (ja) 樹脂封止型半導体装置の製造方法およびリ−ドフレ−ム
JPH07201928A (ja) フィルムキャリア及び半導体装置
JPS60180127A (ja) 樹脂封止型半導体装置の製造方法
JPS61263248A (ja) 樹脂封止型半導体装置の製造方法及びそれに使用するリ−ドフレ−ム
JPH09134929A (ja) 半導体集積回路装置の製造方法およびそれに用いるモールド装置ならびにリードフレームおよびそれを用いた半導体集積回路装置
JPH03102859A (ja) 半導体装置の製造方法
JP2515882B2 (ja) リ―ドフレ―ム、リ―ドフレ―ムの製造方法、半導体装置および半導体装置の製造方法
JPH0290558A (ja) リードフレーム
KR200224097Y1 (ko) 몰딩용 다이
JPS60177656A (ja) 半導体装置
JPH02246143A (ja) リードフレーム
JPH01133329A (ja) 樹脂封止型半導体装置の製造方法
JPH03190264A (ja) 樹脂封止型半導体装置
JPH04346257A (ja) 半導体用リードフレームの製造方法
JPS58110064A (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees