JPH0378794B2 - - Google Patents

Info

Publication number
JPH0378794B2
JPH0378794B2 JP58033472A JP3347283A JPH0378794B2 JP H0378794 B2 JPH0378794 B2 JP H0378794B2 JP 58033472 A JP58033472 A JP 58033472A JP 3347283 A JP3347283 A JP 3347283A JP H0378794 B2 JPH0378794 B2 JP H0378794B2
Authority
JP
Japan
Prior art keywords
electronic component
hole
board
metal plate
resin substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58033472A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59158580A (ja
Inventor
Osamu Fujikawa
Hiromi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP3347283A priority Critical patent/JPS59158580A/ja
Publication of JPS59158580A publication Critical patent/JPS59158580A/ja
Publication of JPH0378794B2 publication Critical patent/JPH0378794B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP3347283A 1983-02-28 1983-02-28 プリント配線基板の製造方法 Granted JPS59158580A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3347283A JPS59158580A (ja) 1983-02-28 1983-02-28 プリント配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3347283A JPS59158580A (ja) 1983-02-28 1983-02-28 プリント配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS59158580A JPS59158580A (ja) 1984-09-08
JPH0378794B2 true JPH0378794B2 (enrdf_load_html_response) 1991-12-16

Family

ID=12387479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3347283A Granted JPS59158580A (ja) 1983-02-28 1983-02-28 プリント配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS59158580A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059812A (ja) * 2015-09-16 2017-03-23 旭徳科技股▲ふん▼有限公司 パッケージキャリアおよびその製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252992A (ja) * 1985-09-02 1987-03-07 松下電工株式会社 電子素子用チツプキヤリア
JP6546496B2 (ja) * 2015-09-28 2019-07-17 ニチコン株式会社 半導体パワーモジュール
WO2017119248A1 (ja) 2016-01-07 2017-07-13 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669264U (enrdf_load_html_response) * 1979-10-25 1981-06-08
JPS5678282U (enrdf_load_html_response) * 1979-11-09 1981-06-25
JPS5678284U (enrdf_load_html_response) * 1979-11-09 1981-06-25
US4278707A (en) * 1980-05-19 1981-07-14 Hewlett-Packard Company Method for coating the edge of a printed circuit board to improve its moisture resistance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059812A (ja) * 2015-09-16 2017-03-23 旭徳科技股▲ふん▼有限公司 パッケージキャリアおよびその製造方法

Also Published As

Publication number Publication date
JPS59158580A (ja) 1984-09-08

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