JPH0512876B2 - - Google Patents

Info

Publication number
JPH0512876B2
JPH0512876B2 JP2084830A JP8483090A JPH0512876B2 JP H0512876 B2 JPH0512876 B2 JP H0512876B2 JP 2084830 A JP2084830 A JP 2084830A JP 8483090 A JP8483090 A JP 8483090A JP H0512876 B2 JPH0512876 B2 JP H0512876B2
Authority
JP
Japan
Prior art keywords
resin
electronic components
plates
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2084830A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03285382A (ja
Inventor
Toshisuke Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OO KEE PURINTO KK
Original Assignee
OO KEE PURINTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OO KEE PURINTO KK filed Critical OO KEE PURINTO KK
Priority to JP2084830A priority Critical patent/JPH03285382A/ja
Publication of JPH03285382A publication Critical patent/JPH03285382A/ja
Publication of JPH0512876B2 publication Critical patent/JPH0512876B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2084830A 1990-04-02 1990-04-02 プリント配線基板 Granted JPH03285382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2084830A JPH03285382A (ja) 1990-04-02 1990-04-02 プリント配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2084830A JPH03285382A (ja) 1990-04-02 1990-04-02 プリント配線基板

Publications (2)

Publication Number Publication Date
JPH03285382A JPH03285382A (ja) 1991-12-16
JPH0512876B2 true JPH0512876B2 (enrdf_load_html_response) 1993-02-19

Family

ID=13841689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2084830A Granted JPH03285382A (ja) 1990-04-02 1990-04-02 プリント配線基板

Country Status (1)

Country Link
JP (1) JPH03285382A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251792A (ja) * 2004-03-01 2005-09-15 Fujitsu Ltd 配線基板およびその製造方法
JP2006339440A (ja) * 2005-06-02 2006-12-14 Fujitsu Ltd スルービアをもつ基板及びその製造方法
US11587881B2 (en) * 2020-03-09 2023-02-21 Advanced Semiconductor Engineering, Inc. Substrate structure including embedded semiconductor device

Also Published As

Publication number Publication date
JPH03285382A (ja) 1991-12-16

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