JPS59158580A - プリント配線基板の製造方法 - Google Patents
プリント配線基板の製造方法Info
- Publication number
- JPS59158580A JPS59158580A JP3347283A JP3347283A JPS59158580A JP S59158580 A JPS59158580 A JP S59158580A JP 3347283 A JP3347283 A JP 3347283A JP 3347283 A JP3347283 A JP 3347283A JP S59158580 A JPS59158580 A JP S59158580A
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- printed wiring
- wiring board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000000758 substrate Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347283A JPS59158580A (ja) | 1983-02-28 | 1983-02-28 | プリント配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347283A JPS59158580A (ja) | 1983-02-28 | 1983-02-28 | プリント配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158580A true JPS59158580A (ja) | 1984-09-08 |
| JPH0378794B2 JPH0378794B2 (enrdf_load_html_response) | 1991-12-16 |
Family
ID=12387479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3347283A Granted JPS59158580A (ja) | 1983-02-28 | 1983-02-28 | プリント配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158580A (enrdf_load_html_response) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252992A (ja) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | 電子素子用チツプキヤリア |
| JP2017069253A (ja) * | 2015-09-28 | 2017-04-06 | ニチコン株式会社 | 半導体パワーモジュール |
| US10813209B2 (en) | 2016-01-07 | 2020-10-20 | Murata Manufacturing Co., Ltd. | Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI584420B (zh) * | 2015-09-16 | 2017-05-21 | 旭德科技股份有限公司 | 封裝載板及其製作方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669264U (enrdf_load_html_response) * | 1979-10-25 | 1981-06-08 | ||
| JPS5678284U (enrdf_load_html_response) * | 1979-11-09 | 1981-06-25 | ||
| JPS5678282U (enrdf_load_html_response) * | 1979-11-09 | 1981-06-25 | ||
| JPS56172974U (enrdf_load_html_response) * | 1980-05-19 | 1981-12-21 |
-
1983
- 1983-02-28 JP JP3347283A patent/JPS59158580A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669264U (enrdf_load_html_response) * | 1979-10-25 | 1981-06-08 | ||
| JPS5678284U (enrdf_load_html_response) * | 1979-11-09 | 1981-06-25 | ||
| JPS5678282U (enrdf_load_html_response) * | 1979-11-09 | 1981-06-25 | ||
| JPS56172974U (enrdf_load_html_response) * | 1980-05-19 | 1981-12-21 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252992A (ja) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | 電子素子用チツプキヤリア |
| JP2017069253A (ja) * | 2015-09-28 | 2017-04-06 | ニチコン株式会社 | 半導体パワーモジュール |
| US10813209B2 (en) | 2016-01-07 | 2020-10-20 | Murata Manufacturing Co., Ltd. | Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0378794B2 (enrdf_load_html_response) | 1991-12-16 |
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