JPH0378407B2 - - Google Patents

Info

Publication number
JPH0378407B2
JPH0378407B2 JP27593784A JP27593784A JPH0378407B2 JP H0378407 B2 JPH0378407 B2 JP H0378407B2 JP 27593784 A JP27593784 A JP 27593784A JP 27593784 A JP27593784 A JP 27593784A JP H0378407 B2 JPH0378407 B2 JP H0378407B2
Authority
JP
Japan
Prior art keywords
epoxy
meth
acrylic
acid
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27593784A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61157520A (ja
Inventor
Toshiaki Hanyuda
Joji Shibata
Kazuo Ootani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Highpolymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co Ltd filed Critical Showa Highpolymer Co Ltd
Priority to JP27593784A priority Critical patent/JPS61157520A/ja
Publication of JPS61157520A publication Critical patent/JPS61157520A/ja
Publication of JPH0378407B2 publication Critical patent/JPH0378407B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP27593784A 1984-12-28 1984-12-28 硬化性組成物 Granted JPS61157520A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27593784A JPS61157520A (ja) 1984-12-28 1984-12-28 硬化性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27593784A JPS61157520A (ja) 1984-12-28 1984-12-28 硬化性組成物

Publications (2)

Publication Number Publication Date
JPS61157520A JPS61157520A (ja) 1986-07-17
JPH0378407B2 true JPH0378407B2 (zh) 1991-12-13

Family

ID=17562504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27593784A Granted JPS61157520A (ja) 1984-12-28 1984-12-28 硬化性組成物

Country Status (1)

Country Link
JP (1) JPS61157520A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235318A (ja) * 1986-04-04 1987-10-15 Terada Kogyo Kk 光硬化による同時IPNsの合成方法
JPS62241978A (ja) * 1986-04-15 1987-10-22 Nippon Kayaku Co Ltd 樹脂組成物及びソルダ−レジストインキ樹脂組成物
JPH0662927B2 (ja) * 1986-12-02 1994-08-17 鐘淵化学工業株式会社 光硬化性接着剤組成物の硬化方法
JP2604438B2 (ja) * 1988-09-19 1997-04-30 旭電化工業株式会社 樹脂の光学的造形方法
JP2632961B2 (ja) * 1988-09-13 1997-07-23 旭電化工業株式会社 樹脂の光学的造形方法
JPH0623233B2 (ja) * 1989-06-13 1994-03-30 昭和高分子株式会社 酸ペンダント型エポキシアクリレート樹脂の製造法
JPH0321629A (ja) * 1989-06-19 1991-01-30 Toagosei Chem Ind Co Ltd 光硬化性樹脂組成物
JPH0621153B2 (ja) * 1990-04-06 1994-03-23 昭和高分子株式会社 感光性樹脂組成物
JP4682340B2 (ja) * 2003-07-25 2011-05-11 昭和電工株式会社 感光性樹脂の製造方法
JP5797680B2 (ja) * 2013-03-04 2015-10-21 株式会社タムラ製作所 活性エネルギー線硬化性樹脂組成物

Also Published As

Publication number Publication date
JPS61157520A (ja) 1986-07-17

Similar Documents

Publication Publication Date Title
EP0843685B1 (en) Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators
JP2679586B2 (ja) 活性エネルギー線硬化型組成物
JPS6219455B2 (zh)
JP2004204228A (ja) 硬化性エポキシ樹脂組成物および硬化物
JPH0378407B2 (zh)
JP2008540710A (ja) 放射線硬化性メタクリレートポリエステル
JPH11140279A (ja) 活性エネルギー線硬化型組成物
TWI386456B (zh) 分枝聚醚樹脂組成物之製法及酸懸垂型分枝聚醚樹脂組成物之製法
JP2009185116A (ja) カルボキシル基含有エポキシアクリレート樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性樹脂組成物およびその硬化物
US4101398A (en) Process for hardening a resin which is the reaction product of an epoxy resin, an olefinically unsaturated monocarboxylic acid and a polycarboxylic acid anhydride unit
JPS588732A (ja) プリプレグシ−トの製法
US4475998A (en) Modified epoxy (meth) acrylate resin and hardenable resin composition containing the same
JPS6211006B2 (zh)
JPH083633B2 (ja) 耐熱性皮膜形成用感光性組成物
JPH0330616B2 (zh)
JPH11148045A (ja) 活性エネルギー線硬化型塗料組成物及びそれを用いた被膜形成方法
JPS6335609A (ja) エチレン性不飽和基を有する硬化性樹脂組成物の製造法
JP4202171B2 (ja) 低誘電性光硬化性樹脂組成物
JP2001288205A (ja) 光カチオン重合開始剤及びそれを含有する光硬化性樹脂組成物
TWI809257B (zh) 含有不飽和基的聚羧酸樹脂、感光性樹脂組成物、硬化物、基材及物品
JPH1180118A (ja) 新規スルホニウム塩、カチオン重合性組成物及びその硬化物
JPH0714993B2 (ja) 電子部品用表面コーテイング剤
JPS6228972B2 (zh)
JPH1149840A (ja) 硬化性樹脂および樹脂組成物
JPH0545611B2 (zh)