JPH0371785B2 - - Google Patents

Info

Publication number
JPH0371785B2
JPH0371785B2 JP57147459A JP14745982A JPH0371785B2 JP H0371785 B2 JPH0371785 B2 JP H0371785B2 JP 57147459 A JP57147459 A JP 57147459A JP 14745982 A JP14745982 A JP 14745982A JP H0371785 B2 JPH0371785 B2 JP H0371785B2
Authority
JP
Japan
Prior art keywords
resin
lead
dam bar
external
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57147459A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5936955A (ja
Inventor
Yoshiharu Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP57147459A priority Critical patent/JPS5936955A/ja
Publication of JPS5936955A publication Critical patent/JPS5936955A/ja
Publication of JPH0371785B2 publication Critical patent/JPH0371785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57147459A 1982-08-25 1982-08-25 リ−ドフレ−ム Granted JPS5936955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57147459A JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57147459A JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP32203687A Division JPS63296256A (ja) 1987-12-18 1987-12-18 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5936955A JPS5936955A (ja) 1984-02-29
JPH0371785B2 true JPH0371785B2 (ko) 1991-11-14

Family

ID=15430837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57147459A Granted JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5936955A (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117750U (ja) * 1984-07-04 1986-02-01 三菱電機株式会社 半導体装置用フレ−ム
JPS6181154U (ko) * 1984-10-31 1986-05-29
JPS6265848U (ko) * 1985-10-16 1987-04-23
JPH0319229Y2 (ko) * 1986-03-12 1991-04-23
JPS62160553U (ko) * 1986-04-02 1987-10-13
JPS639151U (ko) * 1986-07-02 1988-01-21
US5070039A (en) * 1989-04-13 1991-12-03 Texas Instruments Incorporated Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
JPH02271652A (ja) * 1989-04-13 1990-11-06 Orient Watch Co Ltd 樹脂封止型半導体装置用リードフレームとその製造方法及び半導体装置の製造方法
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
JP2928120B2 (ja) * 1995-01-18 1999-08-03 日本電気株式会社 樹脂封止型半導体装置用リードフレームおよび樹脂封止型半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5936955A (ja) 1984-02-29

Similar Documents

Publication Publication Date Title
JPH0371785B2 (ko)
JPS618960A (ja) リ−ドフレ−ム
JPS60261163A (ja) リードフレームの製造方法
JPH0145228B2 (ko)
JPH08318328A (ja) リード切断用金型
JPH0444425B2 (ko)
JP3077505B2 (ja) リードフレームの製造方法
JP2826508B2 (ja) 半導体装置の製造装置
JP2866816B2 (ja) リードフレーム
JPS63302545A (ja) 樹脂封止型半導体リ−ドフレ−ム
JP3216934B2 (ja) アウターリードの曲げ成形方法及びこれを用いた半導体装置
JP2603814B2 (ja) 半導体装置及びその製造方法
JP2606736B2 (ja) リードフレームの製造方法
JPS633164Y2 (ko)
JP2708343B2 (ja) 半導体装置の製造方法およびリードフレーム
JPH0622266B2 (ja) 半導体装置及びその製造方法
JPS6150379B2 (ko)
JP3062709B2 (ja) 半導体装置の製造方法
JPH04324970A (ja) 半導体装置のリードフレームの製造方法
JPH0515065B2 (ko)
JPH01215412A (ja) プレス加工方法
JP2669710B2 (ja) リードフレームとその製造方法
JP2538718B2 (ja) 半導体装置の製造方法
CN115084072A (zh) 半导体装置
JPH04103140A (ja) 半導体装置の樹脂カス除去方法