JPH0369197B2 - - Google Patents
Info
- Publication number
- JPH0369197B2 JPH0369197B2 JP60186919A JP18691985A JPH0369197B2 JP H0369197 B2 JPH0369197 B2 JP H0369197B2 JP 60186919 A JP60186919 A JP 60186919A JP 18691985 A JP18691985 A JP 18691985A JP H0369197 B2 JPH0369197 B2 JP H0369197B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- multilayer
- conductor
- weight
- firing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 239000000203 mixture Substances 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 19
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 5
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 22
- 238000010304 firing Methods 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000007639 printing Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007372 rollout process Methods 0.000 description 1
Landscapes
- Glass Compositions (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18691985A JPS6247196A (ja) | 1985-08-26 | 1985-08-26 | セラミツク多層基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18691985A JPS6247196A (ja) | 1985-08-26 | 1985-08-26 | セラミツク多層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6247196A JPS6247196A (ja) | 1987-02-28 |
| JPH0369197B2 true JPH0369197B2 (ko) | 1991-10-31 |
Family
ID=16196991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18691985A Granted JPS6247196A (ja) | 1985-08-26 | 1985-08-26 | セラミツク多層基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247196A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0193436A (ja) * | 1987-09-30 | 1989-04-12 | Nippon Electric Glass Co Ltd | 基板材料用ガラス組成物 |
| JP4988375B2 (ja) * | 2007-02-22 | 2012-08-01 | 日本板硝子株式会社 | ガラス組成物 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119814A (ko) * | 1974-03-08 | 1975-09-19 | ||
| JPS5563900A (en) * | 1978-11-08 | 1980-05-14 | Fujitsu Ltd | Multilyaer ceramic circuit board |
| JPS5711847A (en) * | 1978-02-06 | 1982-01-21 | Ibm | Nonporous glass-ceramic body |
| JPS5817695A (ja) * | 1981-07-24 | 1983-02-01 | 株式会社日立製作所 | 多層回路板とその製造方法 |
| JPS58151345A (ja) * | 1982-02-26 | 1983-09-08 | Asahi Glass Co Ltd | 低誘電率ガラス組成物 |
| JPS59995A (ja) * | 1982-06-16 | 1984-01-06 | 富士通株式会社 | 銅導体多層構造体の製造方法 |
| JPS59162169A (ja) * | 1983-03-04 | 1984-09-13 | 株式会社日立製作所 | セラミック多層配線板 |
| JPS608229A (ja) * | 1983-06-27 | 1985-01-17 | Agency Of Ind Science & Technol | ７−置換ノルボルナジエン類−シクロデキストリン包接化合物及びその製造方法 |
| JPS60103075A (ja) * | 1983-11-01 | 1985-06-07 | 旭硝子株式会社 | セラミツク基板用組成物 |
| JPS60137884A (ja) * | 1983-12-26 | 1985-07-22 | 株式会社日立製作所 | セラミツク多層配線回路基板の製造法 |
| JPS61122159A (ja) * | 1984-11-16 | 1986-06-10 | 太陽誘電株式会社 | 絶縁性磁器組成物 |
| JPS61186248A (ja) * | 1985-02-13 | 1986-08-19 | Nippon Electric Glass Co Ltd | ガラスセラミツク |
| JPS61275161A (ja) * | 1985-05-29 | 1986-12-05 | 株式会社ノリタケカンパニーリミテド | 低温焼成多層セラミツク基板 |
-
1985
- 1985-08-26 JP JP18691985A patent/JPS6247196A/ja active Granted
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119814A (ko) * | 1974-03-08 | 1975-09-19 | ||
| JPS5711847A (en) * | 1978-02-06 | 1982-01-21 | Ibm | Nonporous glass-ceramic body |
| JPS5563900A (en) * | 1978-11-08 | 1980-05-14 | Fujitsu Ltd | Multilyaer ceramic circuit board |
| JPS5817695A (ja) * | 1981-07-24 | 1983-02-01 | 株式会社日立製作所 | 多層回路板とその製造方法 |
| JPS58151345A (ja) * | 1982-02-26 | 1983-09-08 | Asahi Glass Co Ltd | 低誘電率ガラス組成物 |
| JPS59995A (ja) * | 1982-06-16 | 1984-01-06 | 富士通株式会社 | 銅導体多層構造体の製造方法 |
| JPS59162169A (ja) * | 1983-03-04 | 1984-09-13 | 株式会社日立製作所 | セラミック多層配線板 |
| JPS608229A (ja) * | 1983-06-27 | 1985-01-17 | Agency Of Ind Science & Technol | ７−置換ノルボルナジエン類−シクロデキストリン包接化合物及びその製造方法 |
| JPS60103075A (ja) * | 1983-11-01 | 1985-06-07 | 旭硝子株式会社 | セラミツク基板用組成物 |
| JPS60137884A (ja) * | 1983-12-26 | 1985-07-22 | 株式会社日立製作所 | セラミツク多層配線回路基板の製造法 |
| JPS61122159A (ja) * | 1984-11-16 | 1986-06-10 | 太陽誘電株式会社 | 絶縁性磁器組成物 |
| JPS61186248A (ja) * | 1985-02-13 | 1986-08-19 | Nippon Electric Glass Co Ltd | ガラスセラミツク |
| JPS61275161A (ja) * | 1985-05-29 | 1986-12-05 | 株式会社ノリタケカンパニーリミテド | 低温焼成多層セラミツク基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6247196A (ja) | 1987-02-28 |
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