JPH0363814B2 - - Google Patents

Info

Publication number
JPH0363814B2
JPH0363814B2 JP3806484A JP3806484A JPH0363814B2 JP H0363814 B2 JPH0363814 B2 JP H0363814B2 JP 3806484 A JP3806484 A JP 3806484A JP 3806484 A JP3806484 A JP 3806484A JP H0363814 B2 JPH0363814 B2 JP H0363814B2
Authority
JP
Japan
Prior art keywords
wire
capillary
lead frame
bonding
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3806484A
Other languages
English (en)
Other versions
JPS60182730A (ja
Inventor
Koichi Chiba
Yoshio Terasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59038064A priority Critical patent/JPS60182730A/ja
Publication of JPS60182730A publication Critical patent/JPS60182730A/ja
Publication of JPH0363814B2 publication Critical patent/JPH0363814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 ［発明の技術分野］ 本発明は、基板、特にハイブリツド基板上にダ
イボンドされた半導体ペレツトのインナーボンデ
イングパツドとこの基板上に設けられたリードフ
レームとをボンデイングワイヤを用いて電気的に
接続する方法に関する。
［発明の技術的背景］ 従来から、第１図に示すように、ハイブリツド
ICモジユール用の基板１上にダイボンドされた
半導体ペレツト２上に設けられた多数のボンデイ
ングパツド３と、この基板１上に形成されたリー
ドフレーム４とを電気的に接続するには、ボンデ
イング装置を用いて金線等のボンデイングワイヤ
５で以下のようにして接続する方法がとられてい
る。
すなわち、ボンデイング装置のキヤピラリー６
を通したボンデイングワイヤ５の先端を水素トー
チ、電気アーク等により加熱溶融してボールを作
り、まずボンデイングパツド３上にキヤピラリー
６で押付けて圧着し、次いでキヤピラリー５を対
応するリードフレーム４上に移動させつつボンデ
イングワイヤ５を引き出してループを作り、再び
同様にしてリードフレーム４上にボンデイングワ
イヤ５を圧着した後、キヤピラリー６を持ち上げ
てワイヤクランパでボンデイングワイヤ５をその
圧着部から切り離す方法が行われている。
［背景技術の問題点］ しかしながら、このような方法では、リードフ
レーム４上への圧着部５ａが第２図に示すように
薄くなつて圧着に必要な塑性変形が不十分とな
り、特にハイブリツド基板のように表面が粗い基
板１の場合には、リードフレーム４上へのボンデ
イングワイヤ５の圧着部５ａが剥がれ易くなり、
製品不良が生じ易いという欠点があつた。
［発明の目的］ 本発明はこのような問題点を解決するためにな
されたもので、半導体ペレツトのボンデイングパ
ツドとリードフレームとをボンデイングワイヤを
用いて強固に接続する方法を提供することを目的
とする。
［発明の概要］ すなわち本発明のワイヤボンデイング方法は、
基板上の所定の位置にダイボンドされた半導体ペ
レツト上のボンデイングパツドと前記基板上に設
けられたリードフレームとを、キヤピラリーを用
いてボンデイングワイヤにより電気的に接続する
ワイヤボンデイング方法において、 (a) 前記ボンデイングパツドへボンデイングワイ
ヤの一端をキヤピラリーを用いて圧着する工程
と、 (b) ボンデイングワイヤを引出しつつ前記キヤピ
ラリーをリードフレーム上へ案内してボンデイ
ングワイヤをリードフレーム上へ押付ける工程
と、 (c) 前記キヤピラリーを僅かに引戻して前記ボン
デイングワイヤを折返し、この折返し部を重ね
て前記リードフレーム上へ圧着する工程とから
なることを特徴としている。
［発明の実施例］ 以下本発明を図面に示す一実施例について説明
する。なお以下の図において、第１図と共通する
部分には同一符号を付してある。
本発明においては、第３図ａに示すように、基
板１上にダイボンドされた半導体ペレツト２のボ
ンデイングパツド３と同じ基板１上に設けられた
リードフレーム４とをボンデイングワイヤ５によ
りボンデイングするにあたり、まずボンデイング
パツド３側でキヤピラリー６を通したボンデイン
グワイヤ５の先端を水素トーチ、電気アーク等で
溶かしてボール（ネイルヘツド）７を作り、この
ボール７を半導体ペレツト２のボンデイングパツ
ド３上にキヤピラリー６の先端で押付けながら超
音波をかけて圧着する。
次いで第３図ｂに示すように、キヤピラリー６
を移動すると同時にボンデイングワイヤ５をキヤ
ピラリー６から引き出してループを作り、引き出
し端をリードフレーム４上にキヤピラリー６の先
端で押付ける。
この後、キヤピラリー６を上昇させると第３図
b′のように、金線５がはがれる場合がある。これ
はハイブリツド用基板のリードフレーム４は表面
が粗く、圧着が困難なためである。この不良をな
くすため第３図ｃに示すように、キヤピラリー６
を上昇させ、ボンデイングワイヤ５に沿つてボン
デイングパツド３側に若干引戻す。
この状態で再度ボンデイングワイヤ５をリード
フレーム４上に押付けキヤピラリーに超音波振動
を加えて圧着させる。
このようにリードフレーム４上へのボンデイン
グワイヤ５の圧着をボンデイングワイヤ５を折重
ねた状態で行なうことにより、圧着部のボンデイ
ングワイヤの量は従来の２倍の量となるので、加
圧によるボンデイングワイヤの塑性変形が充分に
行なわれ、ハイブリツド基板のような表面状態の
粗い基板１の場合でもリードフレーム４へボンデ
イングワイヤ５が強固に圧着され圧着部が剥がれ
ることがなくなる。
［発明の効果］ 以上説明したように本発明によれば、半導体ペ
レツトのボンデイングパツドとリードフレームと
を強固にワイヤボンドすることができ、特にハイ
ブリツドICモジユールの製品不良をなくし歩留
りを飛躍的に向上させることができる。
【図面の簡単な説明】
第１図は従来のワイヤボンデイング方法を示す
斜視図、第２図はリードフレームに圧着されたボ
ンデイングワイヤが剥離した状態を拡大して示す
側面図、第３図ａ〜ｄは本発明の一実施例を説明
するための図である。 １……基板、２……半導体ペレツト、３……ボ
ンデイングパツド、４……リードフレーム、５…
…ボンデイングワイヤ、６……キヤピラリー。

Claims (1)

  1. 【特許請求の範囲】 １ 基板上の所定の位置にダイボンドされた半導
    体ペレツト上のボンデイングパツドと前記基板上
    に設けられたリードフレームとを、キヤピラリー
    を用いてボンデイングワイヤにより電気的に接続
    するワイヤボンデイング方法において、 (a) 前記ボンデイングパツドへボンデイングワイ
    ヤの一端をキヤピラリーを用いて圧着する工程
    と、 (b) ボンデイングワイヤを引出しつつ前記キヤピ
    ラリーをリードフレーム上へ案内してボンデイ
    ングワイヤをリードフレーム上へ押付ける工程
    と、 (c) 前記キヤピラリーを僅かに引戻して前記ボン
    デイングワイヤを折返し、この折返し部を重ね
    て前記リードフレーム上へ圧着する工程とから
    なることを特徴とするワイヤボンデイング方
    法。 ２ (b)の工程においてはキヤピラリーに超音波振
    動を加えずにボンデイングワイヤをリードフレー
    ム上へ押付け、(c)の工程においてはキヤピラリー
    に超音波振動を加えながらボンデイングワイヤを
    リードフレーム上へ押付けてボンデイングワイヤ
    とリードフレームとを圧着させることを特徴とす
    る特許請求の範囲第１項記載のワイヤボンデイン
    グ方法。
JP59038064A 1984-02-29 1984-02-29 ワイヤボンデイング方法 Granted JPS60182730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59038064A JPS60182730A (ja) 1984-02-29 1984-02-29 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59038064A JPS60182730A (ja) 1984-02-29 1984-02-29 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS60182730A JPS60182730A (ja) 1985-09-18
JPH0363814B2 true JPH0363814B2 (ja) 1991-10-02

Family

ID=12515060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59038064A Granted JPS60182730A (ja) 1984-02-29 1984-02-29 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS60182730A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4787374B2 (ja) 2010-01-27 2011-10-05 株式会社新川 半導体装置の製造方法並びにワイヤボンディング装置

Also Published As

Publication number Publication date
JPS60182730A (ja) 1985-09-18

Similar Documents

Publication Publication Date Title
JP3762475B2 (ja) ワイヤボンディング方法及び半導体装置
JPH10512399A (ja) 半導体チップを少なくとも１つの接触面と電気的に接続する方法
JPH0363814B2 (ja)
JP3128718B2 (ja) ワイヤボンデイング方法
US6467677B1 (en) Method and contact point for producing an electrical connection
JPH10229100A (ja) ワイヤボンディング方法及びプラスティックパッケージの製造方法
JPH0530058B2 (ja)
JP3923379B2 (ja) 半導体装置
JP2943381B2 (ja) ボンディング方法
JP2821777B2 (ja) フリップチップ用ｉｃ及びその製造方法
JP2846095B2 (ja) 半導体装置の製造方法
JP3202193B2 (ja) ワイヤボンディング方法
JPH05226428A (ja) ワイヤボンディング方法
JP2574531B2 (ja) バンプ電極の形成方法
JP2848344B2 (ja) 半導体装置および半導体装置の製造方法
JPH05102384A (ja) 樹脂封止型半導体装置の製造方法
JPS6254500A (ja) ワイヤ接続方法
JPH01231333A (ja) 半導体装置の製造方法
JPH0695519B2 (ja) バンプ形成方法
JP3293757B2 (ja) 半導体装置製造用リードフレーム組立体の製造方法
JP2656762B2 (ja) 半導体装置およびその製造方法
JPH10189640A (ja) 半導体装置及びその製造方法
JPH10199913A (ja) ワイヤボンディング方法
JPH02144955A (ja) リードフレーム
JP2822997B2 (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term