JPS60182730A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS60182730A
JPS60182730A JP59038064A JP3806484A JPS60182730A JP S60182730 A JPS60182730 A JP S60182730A JP 59038064 A JP59038064 A JP 59038064A JP 3806484 A JP3806484 A JP 3806484A JP S60182730 A JPS60182730 A JP S60182730A
Authority
JP
Japan
Prior art keywords
wire
lead frame
bonding
capillary
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59038064A
Other languages
English (en)
Other versions
JPH0363814B2 (ja
Inventor
Koichi Chiba
宏一 千葉
Yoshio Terasaka
寺坂　良夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59038064A priority Critical patent/JPS60182730A/ja
Publication of JPS60182730A publication Critical patent/JPS60182730A/ja
Publication of JPH0363814B2 publication Critical patent/JPH0363814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 「発明の技術分野」 本発明は、基板、特にハイブリッド阜板上にダイボンド
された半導体ペレットのインナーポンディングパッドと
この基板上に設けられたリードフレームとをボンディン
グワイＡ１を用いＣ電気的に接続づる方法に関する。
［発明の技術的背留］ 従来から、第１図に示ずＪ：うに、ハイブリッドＩＣモ
ジュール用の基板１上にダイボンドされた半導体ペレッ
ト２上に設けられた多数のポンディングパッド３と、こ
の基板１上に形成されたリードフレーム４とを電気的に
接続するには、ボンディング装置を用いて金線等のボン
ディングワイヤ５で以下のようにしＣ接続する方法がと
られている。
すなわち、ボンディング装置のキャピラリー６を通した
ボンデイングワイ１７５の先端を水素トーチ、電気アー
ク等により加熱溶融してボールを作り、まずポンディン
グパッド３上に４＝１７ビラリー６′ｃ押付けＵｒｆ着
し、次いでキ１７ピラリー５を対応づるリードフレーム
４上に移動させつつホンディングワイＡ７５を引き出し
でループを釣り、川び同様にしてリードフレーム４上に
ボンディングワイ八７５を圧着した後、キャピラリー６
をト５ち上げてワイヤクランパぐボンディングワイヤ５
をその圧着部から切り離Ｊプノ法が行われている。
［青用技術の問題点］ しかしながら、このような方法では、リードフレーム４
上への圧着部５ａが第２図に示すように薄くなって圧着
に必要な塑性変形が不十分となり、特にハイブリッド基
板のように表面が粗い基板１の場合には、リードフレー
ム４上へのボンデイングワイＶ５の圧着部５ａが剥がれ
易くなり、製品不良が生じ易いという欠点があった。
「発明の目的」 本発明はこのような問題点を解決するためになされたち
のＣ・、半導体ベレットのポンディングパッドとリード
フレームとをボンディングワイヤを用いて強固に接続す
る方法を提供することを目的どする。
［発明の１既要１ すなわら本発明のソイ＼７ホンデイング方法は、基板上
の所定の位置にダイボンドされた半導体ペレット上のポ
ンディングパッドと前記基板上に設けられたリードフレ
ームとを、キ１７ピラリーを用いてボンディングワイＡ
７により電気的に接続するワイヤボンディング方法にお
いて、 ＜ａ　＞前記ボンゲイングパツドヘボンデイングワイヤ
の一端をキャピラリーを用いて圧着する工程と、 （ｂ）ボンディングワイヤを引出しつつ前記キレピラリ
−をリードフレーム上へ案内しＣボンディングワイヤを
リードフレーム上へ押付ける工程と、（Ｃ）前記キャピ
ラリーを保かに引戻して前記ボンディングワイＡ７を折
返し、この折返し部を重わく一前記リードフレーム上へ
圧着する工程とからなることを特徴としている。
［発明の実施例］ 以下本発明を図面に示づ゛一実施例についてｄ１明する
。なお以下の図におい゛Ｃ，第１図と共通ずる部分には
同−行帰を角しである。
本発明においては、第３図（ａ　）に示すように、基板
１土にダイボンドされた半導体ベレンｌ〜２のポンディ
ングパッド３と同じ基板１上に設けられたリードフレー
ム４とをボンディングワイｔ７５によりボンデインタす
るにあたり、まずポンディングパッド３側でキトピラリ
−６を通したホンディングワイヤ５の先端を水素トーチ
、′電気アーク等で溶かしてボール（ネイルヘッド）７
を作り、このボール７を半導体ベレット２のポンディン
グパッド３上にキャピラリー６の先端で押（＝Ｊけなが
ら超音波をかけ−Ｃ圧着する。
次いＣ第３図（ｂ）に示すように、キャピラリー６を移
動すると同時にボンディングワイヤ５をキャピラリー６
から引き出しＣループを作り、引き出し端をリードフレ
ーム４上にキレピラリ−６の先端で押イｑける。
この（夛、：１−トビラリ−６を」二５７ざＵると第３
図〈ｂ′　）のように、金線５がはがれる場合がある。
これはハイブリッド用基板のリードフレーム４は表面が
粗く、圧着が困雌なためである。この不良をなくすため
第３図（Ｃ）に示ずＪ：うに、キャピラリー６を上昇さ
せ、ボンディングワイヤ５に沿ってボンディングパット
３側に若干引戻す。
この状ｃ、Ｃ′再度ボンディングワイヤ５をリードフレ
ーｌＸ／ｌ上に押付はキャピラリーに超音波振動を加え
Ｃ圧着ざぜる。
このようにリードフレーム４上へのホンディングワイヤ
５の圧着をボンディングワイヤ５を折重ねた状態で行な
うことにより、圧着部のボンディングワイヤの但は従来
の２倍のｍどなるので、加圧によるボンデインクワイＡ
７の塑性変形が充分に行なわれ、ハイブリット基板のよ
うな表面状態の粗い基板１の場合でもリードフレーム４
ヘボンデイングワイ１７５が強固にル着され圧着部が剥
がれることがなくなる。
「発明の効果」 以−１ニ説明したように本発明によれは′、半導体ペレ
ットのポンディングパッドどリードフレームとを強固に
ワイ＼７ボンドすることができ、特にハイブリッドＩＣ
モジュールの製品不良をなくし歩留りを飛躍的に向上さ
せることができる。
【図面の簡単な説明】
第１図は従来のワイヤポンプイングツ７法を示づ斜視図
、第２図はリードフレームに圧着されたボンディングワ
イ１７が剥離した状態を拡大しＣ示Ｊ側面図、第３図＜
ａ　＞〜（ｄ　＞は本発明の一実施例を説明するための
図である。 １・・・・・・・・・・・・基板 ２・・・・・・・・・・・・半導体ペレッ１−３・・・
・・・・・・・・・ポンディングパッド４・・・・・・
・・・・・・リードフレーム５・・・・・・・・・・・
・ボンディングワイヤ６・・・・・・・・・・・・キャ
ピラリー代理人弁理士　須　山　佐　−

Claims (2)

    【特許請求の範囲】
  1. （１）基板上の所定の位置にダイボンドされた半導体ペ
    レット上のポンディングパッドと前記基板上に設けられ
    たリードフレームとを、キャピラリーを用いてボンディ
    ングワイヤにＪ：り電気的に接続するワイヤボンディン
    グ方法において、（ａ　）前記ボンゲイングパツドヘボ
    ン−ｊ−イングワイヤの一端をキャピラリーを用いて圧
    着する工程と、 （１））ボンディングワイヤを引出しつつ前記ギセピラ
    リーをリードフレーム上へ案内してボンディングワイヤ
    をリードフレーム上へ押付（）る工程と、ＣＧ　＞前記
    キトピラリ−を僅かに引戻して前記ボンディングワイＡ
    ７を折返し、この折返し部を重ねて前記リードフレーム
    上へ圧着する工程とからなることを特徴とするワイヤボ
    ンディング方法。
  2. （２）（ｂ）の工程においてはキャピラリーに超音波振
    動を加えずにボンディングワイヤをリードフレーム上へ
    押付け、（Ｃ）の工程においてはキャピラリーにＪＪＪ
    　ｕ波振動を加えながらボンディングワイヤをリードフ
    レーム上へ押付番プてボンディングワイヤとリードフレ
    ームとを圧着させることを特徴とする特許請求の範囲第
    １項記載のワイヤボンディング方ｉ人。
JP59038064A 1984-02-29 1984-02-29 ワイヤボンデイング方法 Granted JPS60182730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59038064A JPS60182730A (ja) 1984-02-29 1984-02-29 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59038064A JPS60182730A (ja) 1984-02-29 1984-02-29 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS60182730A true JPS60182730A (ja) 1985-09-18
JPH0363814B2 JPH0363814B2 (ja) 1991-10-02

Family

ID=12515060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59038064A Granted JPS60182730A (ja) 1984-02-29 1984-02-29 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS60182730A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8123108B2 (en) 2010-01-27 2012-02-28 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8123108B2 (en) 2010-01-27 2012-02-28 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus
US8196803B2 (en) 2010-01-27 2012-06-12 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus

Also Published As

Publication number Publication date
JPH0363814B2 (ja) 1991-10-02

Similar Documents

Publication Publication Date Title
JP4382281B2 (ja) 電気的な接続部を形成するための方法およびコンタクト部
US6604670B2 (en) Lead penetrating clamping system
US6662993B2 (en) Bondhead lead clamp apparatus
JPH10512399A (ja) 半導体チップを少なくとも１つの接触面と電気的に接続する方法
JPS60182730A (ja) ワイヤボンデイング方法
JP3128718B2 (ja) ワイヤボンデイング方法
JPH04294552A (ja) ワイヤーボンディング方法
JP2002280410A (ja) ワイヤボンディング方法
JPH01276729A (ja) ワイヤボンディング方法
US6467677B1 (en) Method and contact point for producing an electrical connection
EP2471624A1 (en) Continuous wire bonding
JPH10229100A (ja) ワイヤボンディング方法及びプラスティックパッケージの製造方法
JPH05267385A (ja) ワイヤーボンディング装置
JP3923379B2 (ja) 半導体装置
JP2003086621A (ja) 半導体装置およびその製造方法
JP3202193B2 (ja) ワイヤボンディング方法
JP2846095B2 (ja) 半導体装置の製造方法
JPS5925377B2 (ja) ワイヤボンデイング方法
JPH0568101B2 (ja)
JP2943381B2 (ja) ボンディング方法
JPH05226428A (ja) ワイヤボンディング方法
JP2848344B2 (ja) 半導体装置および半導体装置の製造方法
JPH0748507B2 (ja) ワイヤボンデイング方法
JPH10199913A (ja) ワイヤボンディング方法
JP3293757B2 (ja) 半導体装置製造用リードフレーム組立体の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term