JPH034621B2 - - Google Patents

Info

Publication number
JPH034621B2
JPH034621B2 JP57070246A JP7024682A JPH034621B2 JP H034621 B2 JPH034621 B2 JP H034621B2 JP 57070246 A JP57070246 A JP 57070246A JP 7024682 A JP7024682 A JP 7024682A JP H034621 B2 JPH034621 B2 JP H034621B2
Authority
JP
Japan
Prior art keywords
substrate
targets
target
opposing
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57070246A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58189371A (ja
Inventor
Sadao Kadokura
Kazuhiko Pponjo
Masahiko Naoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP7024682A priority Critical patent/JPS58189371A/ja
Publication of JPS58189371A publication Critical patent/JPS58189371A/ja
Publication of JPH034621B2 publication Critical patent/JPH034621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP7024682A 1982-04-28 1982-04-28 スパツタ装置 Granted JPS58189371A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7024682A JPS58189371A (ja) 1982-04-28 1982-04-28 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7024682A JPS58189371A (ja) 1982-04-28 1982-04-28 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS58189371A JPS58189371A (ja) 1983-11-05
JPH034621B2 true JPH034621B2 (enrdf_load_html_response) 1991-01-23

Family

ID=13426010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7024682A Granted JPS58189371A (ja) 1982-04-28 1982-04-28 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS58189371A (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953680A (ja) * 1982-09-21 1984-03-28 Teijin Ltd スパツタ装置
JPS61270369A (ja) * 1985-05-23 1986-11-29 Nec Corp 三極スパツタリングソ−ス
US4841908A (en) * 1986-06-23 1989-06-27 Minnesota Mining And Manufacturing Company Multi-chamber deposition system
JPH0772344B2 (ja) * 1988-06-23 1995-08-02 帝人株式会社 対向ターゲット式スパッタ装置
US5053625A (en) * 1988-08-04 1991-10-01 Minnesota Mining And Manufacturing Company Surface characterization apparatus and method
JP5116078B2 (ja) * 2006-11-30 2013-01-09 株式会社神戸製鋼所 対向ターゲットスパッタ装置及び対向ターゲットスパッタ方法
DE102008029379A1 (de) * 2008-06-23 2009-08-13 Von Ardenne Anlagentechnik Gmbh Anordnung zum Beschichten bandförmiger Foliensubstrate
EP3438322B1 (en) * 2016-03-30 2022-05-25 Keihin Ramtech Co., Ltd. Sputtering device, and method for producing film-formed body

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573831A (en) * 1980-06-10 1982-01-09 Matsushita Electric Ind Co Ltd Vacuum metallizing method
JPS5743986A (en) * 1980-08-30 1982-03-12 Shimadzu Corp Film forming apparatus

Also Published As

Publication number Publication date
JPS58189371A (ja) 1983-11-05

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