JPH0336735B2 - - Google Patents

Info

Publication number
JPH0336735B2
JPH0336735B2 JP61017685A JP1768586A JPH0336735B2 JP H0336735 B2 JPH0336735 B2 JP H0336735B2 JP 61017685 A JP61017685 A JP 61017685A JP 1768586 A JP1768586 A JP 1768586A JP H0336735 B2 JPH0336735 B2 JP H0336735B2
Authority
JP
Japan
Prior art keywords
conveyor
chamber
workpiece
level
gate valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61017685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61206722A (ja
Inventor
Dei Gurabu Arubanii
Buujini Aretsukusu
Jii Oobaaratsukaa Uorutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of JPS61206722A publication Critical patent/JPS61206722A/ja
Publication of JPH0336735B2 publication Critical patent/JPH0336735B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP61017685A 1985-01-31 1986-01-29 真空処理装置 Granted JPS61206722A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69683685A 1985-01-31 1985-01-31
US696836 1985-01-31

Publications (2)

Publication Number Publication Date
JPS61206722A JPS61206722A (ja) 1986-09-13
JPH0336735B2 true JPH0336735B2 (enExample) 1991-06-03

Family

ID=24798750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61017685A Granted JPS61206722A (ja) 1985-01-31 1986-01-29 真空処理装置

Country Status (5)

Country Link
JP (1) JPS61206722A (enExample)
KR (1) KR950003597B1 (enExample)
AU (1) AU572375B2 (enExample)
CA (1) CA1307759C (enExample)
GB (1) GB2171119B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111477582A (zh) * 2020-05-28 2020-07-31 深圳市捷佳伟创新能源装备股份有限公司 硅片的工艺腔体、硅片加工设备和硅片加工方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
DE3731444A1 (de) * 1987-09-18 1989-03-30 Leybold Ag Vorrichtung zum beschichten von substraten
DE4111384C2 (de) * 1991-04-09 1999-11-04 Leybold Ag Vorrichtung zur Beschichtung von Substraten
US5215420A (en) * 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
US5275709A (en) * 1991-11-07 1994-01-04 Leybold Aktiengesellschaft Apparatus for coating substrates, preferably flat, more or less plate-like substrates
DE4303462C2 (de) * 1992-03-30 1994-03-31 Leybold Ag Mehrkammerbeschichtungsanlage
DE19500964A1 (de) * 1995-01-14 1996-07-18 Leybold Ag Vorrichtung zum Beschichten
KR100269097B1 (ko) * 1996-08-05 2000-12-01 엔도 마코토 기판처리장치
US6053687A (en) * 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
US6235634B1 (en) 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6000905A (en) * 1998-03-13 1999-12-14 Toro-Lira; Guillermo L. High speed in-vacuum flat panel display handler
US6215897B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6213704B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6206176B1 (en) 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
EP2365512A3 (en) * 2000-06-27 2012-01-04 Ebara Corporation Inspection system by charged particle beam
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
WO2002045153A1 (fr) 2000-12-01 2002-06-06 Ebara Corporation Procede et appareil d'inspection utilisant un faisceau d'electrons, et procede de production de dispositif utilisant celui-ci
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
DE502004008341D1 (de) * 2004-03-31 2008-12-11 Applied Materials Gmbh & Co Kg Schleusenanordnung für eine Vakuumbehandlungsanlage und Verfahren zum Betreiben von dieser
DE502006004376D1 (de) * 2006-06-22 2009-09-10 Applied Materials Gmbh & Co Kg Vakuumbeschichtungsanlage
ATE480646T1 (de) 2007-02-09 2010-09-15 Applied Materials Inc Anlage mit einer transportvorrichtung zur behandlung von substraten
ATE555496T1 (de) 2007-03-13 2012-05-15 Applied Materials Inc Vorrichtung zum bewegen eines carriers in einer vakuumkammer
DE102007058052B4 (de) * 2007-11-30 2013-12-05 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsanlage
CN102152031A (zh) * 2011-01-26 2011-08-17 阮俊康 打火机自动焊接生产线
CN113584453B (zh) * 2021-07-22 2023-01-17 深圳天成真空技术有限公司 一种磁力驱动真空镀膜传送装置及传送方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945903A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Sputter-coating of glass sheets or other substrates
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
US4144960A (en) * 1977-06-16 1979-03-20 The Allen Group, Inc. Apparatus and methods for automatically transferring articles from a continuously movable conveyor to a work station
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111477582A (zh) * 2020-05-28 2020-07-31 深圳市捷佳伟创新能源装备股份有限公司 硅片的工艺腔体、硅片加工设备和硅片加工方法

Also Published As

Publication number Publication date
GB8601905D0 (en) 1986-03-05
CA1307759C (en) 1992-09-22
GB2171119A (en) 1986-08-20
AU572375B2 (en) 1988-05-05
KR950003597B1 (ko) 1995-04-14
KR860005739A (ko) 1986-08-11
AU5253786A (en) 1986-08-28
GB2171119B (en) 1989-01-18
JPS61206722A (ja) 1986-09-13

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