KR860005739A - 진공 처리장치 - Google Patents

진공 처리장치

Info

Publication number
KR860005739A
KR860005739A KR1019860000614A KR860000614A KR860005739A KR 860005739 A KR860005739 A KR 860005739A KR 1019860000614 A KR1019860000614 A KR 1019860000614A KR 860000614 A KR860000614 A KR 860000614A KR 860005739 A KR860005739 A KR 860005739A
Authority
KR
South Korea
Prior art keywords
processing device
vacuum processing
vacuum
processing
Prior art date
Application number
KR1019860000614A
Other languages
English (en)
Other versions
KR950003597B1 (ko
Inventor
디이그럽 올바니
부우제니 알렉스
지이 오우버래커 월터
Original Assignee
더 비이오우시이 그루우프 인코오포레이팃드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 더 비이오우시이 그루우프 인코오포레이팃드 filed Critical 더 비이오우시이 그루우프 인코오포레이팃드
Publication of KR860005739A publication Critical patent/KR860005739A/ko
Application granted granted Critical
Publication of KR950003597B1 publication Critical patent/KR950003597B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G5/00—Storing fluids in natural or artificial cavities or chambers in the earth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Physical Vapour Deposition (AREA)
KR1019860000614A 1985-01-31 1986-01-30 진공 처리장치 KR950003597B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69683685A 1985-01-31 1985-01-31
US696836 1991-05-07

Publications (2)

Publication Number Publication Date
KR860005739A true KR860005739A (ko) 1986-08-11
KR950003597B1 KR950003597B1 (ko) 1995-04-14

Family

ID=24798750

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860000614A KR950003597B1 (ko) 1985-01-31 1986-01-30 진공 처리장치

Country Status (5)

Country Link
JP (1) JPS61206722A (ko)
KR (1) KR950003597B1 (ko)
AU (1) AU572375B2 (ko)
CA (1) CA1307759C (ko)
GB (1) GB2171119B (ko)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
DE3731444A1 (de) * 1987-09-18 1989-03-30 Leybold Ag Vorrichtung zum beschichten von substraten
DE4111384C2 (de) * 1991-04-09 1999-11-04 Leybold Ag Vorrichtung zur Beschichtung von Substraten
US5215420A (en) * 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
US5275709A (en) * 1991-11-07 1994-01-04 Leybold Aktiengesellschaft Apparatus for coating substrates, preferably flat, more or less plate-like substrates
DE4303462C2 (de) * 1992-03-30 1994-03-31 Leybold Ag Mehrkammerbeschichtungsanlage
DE19500964A1 (de) * 1995-01-14 1996-07-18 Leybold Ag Vorrichtung zum Beschichten
KR100269097B1 (ko) * 1996-08-05 2000-12-01 엔도 마코토 기판처리장치
US6053687A (en) * 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
US6235634B1 (en) 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6000905A (en) * 1998-03-13 1999-12-14 Toro-Lira; Guillermo L. High speed in-vacuum flat panel display handler
US6213704B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6206176B1 (en) 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
EP1296352A4 (en) 2000-06-27 2007-04-18 Ebara Corp INVESTIGATION DEVICE FOR LOADED PARTICLE RAYS AND METHOD FOR PRODUCING A COMPONENT ELEVATED WITH THIS INSPECTION DEVICE
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
WO2002045153A1 (en) * 2000-12-01 2002-06-06 Ebara Corporation Inspection method and apparatus using electron beam, and device production method using it
PL1582607T3 (pl) * 2004-03-31 2009-04-30 Applied Mat Gmbh & Co Kg Układ śluzy dla urządzenia do obróbki próżniowej i sposób jego eksploatacji
ATE437976T1 (de) * 2006-06-22 2009-08-15 Applied Materials Gmbh & Co Kg Vakuumbeschichtungsanlage
DE502007004989D1 (de) 2007-02-09 2010-10-21 Applied Materials Inc Anlage mit einer Transportvorrichtung zur Behandlung von Substraten
EP1973154B1 (de) 2007-03-13 2012-04-25 Applied Materials, Inc. Vorrichtung zum Bewegen eines Carriers in einer Vakuumkammer
DE102007058052B4 (de) * 2007-11-30 2013-12-05 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsanlage
CN102152031A (zh) * 2011-01-26 2011-08-17 阮俊康 打火机自动焊接生产线
CN111477582A (zh) * 2020-05-28 2020-07-31 深圳市捷佳伟创新能源装备股份有限公司 硅片的工艺腔体、硅片加工设备和硅片加工方法
CN113584453B (zh) * 2021-07-22 2023-01-17 深圳天成真空技术有限公司 一种磁力驱动真空镀膜传送装置及传送方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945903A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Sputter-coating of glass sheets or other substrates
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
US4144960A (en) * 1977-06-16 1979-03-20 The Allen Group, Inc. Apparatus and methods for automatically transferring articles from a continuously movable conveyor to a work station
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum

Also Published As

Publication number Publication date
AU5253786A (en) 1986-08-28
JPH0336735B2 (ko) 1991-06-03
GB2171119B (en) 1989-01-18
JPS61206722A (ja) 1986-09-13
KR950003597B1 (ko) 1995-04-14
AU572375B2 (en) 1988-05-05
CA1307759C (en) 1992-09-22
GB2171119A (en) 1986-08-20
GB8601905D0 (en) 1986-03-05

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee