KR950003597B1 - 진공 처리장치 - Google Patents
진공 처리장치 Download PDFInfo
- Publication number
- KR950003597B1 KR950003597B1 KR1019860000614A KR860000614A KR950003597B1 KR 950003597 B1 KR950003597 B1 KR 950003597B1 KR 1019860000614 A KR1019860000614 A KR 1019860000614A KR 860000614 A KR860000614 A KR 860000614A KR 950003597 B1 KR950003597 B1 KR 950003597B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- conveyor
- workpiece
- level
- gate valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G5/00—Storing fluids in natural or artificial cavities or chambers in the earth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69683685A | 1985-01-31 | 1985-01-31 | |
| US696836 | 1985-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR860005739A KR860005739A (ko) | 1986-08-11 |
| KR950003597B1 true KR950003597B1 (ko) | 1995-04-14 |
Family
ID=24798750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019860000614A Expired - Fee Related KR950003597B1 (ko) | 1985-01-31 | 1986-01-30 | 진공 처리장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS61206722A (enExample) |
| KR (1) | KR950003597B1 (enExample) |
| AU (1) | AU572375B2 (enExample) |
| CA (1) | CA1307759C (enExample) |
| GB (1) | GB2171119B (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4676884A (en) * | 1986-07-23 | 1987-06-30 | The Boc Group, Inc. | Wafer processing machine with evacuated wafer transporting and storage system |
| DE3827343A1 (de) * | 1988-08-12 | 1990-02-15 | Leybold Ag | Vorrichtung nach dem karussel-prinzip zum beschichten von substraten |
| DE3731444A1 (de) * | 1987-09-18 | 1989-03-30 | Leybold Ag | Vorrichtung zum beschichten von substraten |
| DE4111384C2 (de) * | 1991-04-09 | 1999-11-04 | Leybold Ag | Vorrichtung zur Beschichtung von Substraten |
| US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
| US5275709A (en) * | 1991-11-07 | 1994-01-04 | Leybold Aktiengesellschaft | Apparatus for coating substrates, preferably flat, more or less plate-like substrates |
| DE4303462C2 (de) * | 1992-03-30 | 1994-03-31 | Leybold Ag | Mehrkammerbeschichtungsanlage |
| DE19500964A1 (de) * | 1995-01-14 | 1996-07-18 | Leybold Ag | Vorrichtung zum Beschichten |
| KR100269097B1 (ko) * | 1996-08-05 | 2000-12-01 | 엔도 마코토 | 기판처리장치 |
| US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
| US6235634B1 (en) | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
| US6000905A (en) * | 1998-03-13 | 1999-12-14 | Toro-Lira; Guillermo L. | High speed in-vacuum flat panel display handler |
| US6517303B1 (en) | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
| US6206176B1 (en) | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
| US6213704B1 (en) * | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
| US6215897B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Automated substrate processing system |
| US6217272B1 (en) * | 1998-10-01 | 2001-04-17 | Applied Science And Technology, Inc. | In-line sputter deposition system |
| TWI294632B (en) | 2000-06-27 | 2008-03-11 | Ebara Corp | Inspecting device using an electron ebam and method for making semiconductor devices with such inspection device |
| US6682288B2 (en) | 2000-07-27 | 2004-01-27 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
| US6530733B2 (en) | 2000-07-27 | 2003-03-11 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
| US6821912B2 (en) | 2000-07-27 | 2004-11-23 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
| JP3943022B2 (ja) | 2000-12-01 | 2007-07-11 | 株式会社荏原製作所 | 基板検査装置 |
| US7100954B2 (en) | 2003-07-11 | 2006-09-05 | Nexx Systems, Inc. | Ultra-thin wafer handling system |
| DE502004008341D1 (de) * | 2004-03-31 | 2008-12-11 | Applied Materials Gmbh & Co Kg | Schleusenanordnung für eine Vakuumbehandlungsanlage und Verfahren zum Betreiben von dieser |
| ATE437976T1 (de) * | 2006-06-22 | 2009-08-15 | Applied Materials Gmbh & Co Kg | Vakuumbeschichtungsanlage |
| EP1956111B1 (de) | 2007-02-09 | 2010-09-08 | Applied Materials, Inc. | Anlage mit einer Transportvorrichtung zur Behandlung von Substraten |
| EP1973154B1 (de) | 2007-03-13 | 2012-04-25 | Applied Materials, Inc. | Vorrichtung zum Bewegen eines Carriers in einer Vakuumkammer |
| DE102007058052B4 (de) * | 2007-11-30 | 2013-12-05 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsanlage |
| CN102152031A (zh) * | 2011-01-26 | 2011-08-17 | 阮俊康 | 打火机自动焊接生产线 |
| CN111477582B (zh) * | 2020-05-28 | 2025-07-08 | 深圳市捷佳伟创新能源装备股份有限公司 | 硅片的工艺腔体、硅片加工设备和硅片加工方法 |
| CN113584453B (zh) * | 2021-07-22 | 2023-01-17 | 深圳天成真空技术有限公司 | 一种磁力驱动真空镀膜传送装置及传送方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3945903A (en) * | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Sputter-coating of glass sheets or other substrates |
| US4047624A (en) * | 1975-10-21 | 1977-09-13 | Airco, Inc. | Workpiece handling system for vacuum processing |
| US4144960A (en) * | 1977-06-16 | 1979-03-20 | The Allen Group, Inc. | Apparatus and methods for automatically transferring articles from a continuously movable conveyor to a work station |
| US4405435A (en) * | 1980-08-27 | 1983-09-20 | Hitachi, Ltd. | Apparatus for performing continuous treatment in vacuum |
-
1986
- 1986-01-21 AU AU52537/86A patent/AU572375B2/en not_active Ceased
- 1986-01-27 GB GB08601905A patent/GB2171119B/en not_active Expired
- 1986-01-29 JP JP61017685A patent/JPS61206722A/ja active Granted
- 1986-01-30 KR KR1019860000614A patent/KR950003597B1/ko not_active Expired - Fee Related
- 1986-01-30 CA CA000500743A patent/CA1307759C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB2171119B (en) | 1989-01-18 |
| JPH0336735B2 (enExample) | 1991-06-03 |
| GB2171119A (en) | 1986-08-20 |
| KR860005739A (ko) | 1986-08-11 |
| AU5253786A (en) | 1986-08-28 |
| AU572375B2 (en) | 1988-05-05 |
| CA1307759C (en) | 1992-09-22 |
| GB8601905D0 (en) | 1986-03-05 |
| JPS61206722A (ja) | 1986-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 19980415 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 19980415 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |