JPH0336735B2 - - Google Patents

Info

Publication number
JPH0336735B2
JPH0336735B2 JP61017685A JP1768586A JPH0336735B2 JP H0336735 B2 JPH0336735 B2 JP H0336735B2 JP 61017685 A JP61017685 A JP 61017685A JP 1768586 A JP1768586 A JP 1768586A JP H0336735 B2 JPH0336735 B2 JP H0336735B2
Authority
JP
Japan
Prior art keywords
conveyor
chamber
workpiece
level
gate valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61017685A
Other languages
Japanese (ja)
Other versions
JPS61206722A (en
Inventor
Dei Gurabu Arubanii
Buujini Aretsukusu
Jii Oobaaratsukaa Uorutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of JPS61206722A publication Critical patent/JPS61206722A/en
Publication of JPH0336735B2 publication Critical patent/JPH0336735B2/ja
Granted legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G5/00Storing fluids in natural or artificial cavities or chambers in the earth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Physical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 本発明は加工片を真空処理装置に搬入したり搬
出したりする方法および装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for transporting workpieces into and out of a vacuum processing apparatus.

加工片を真空装置に搬入したり搬出したりする
のに必要とする時間および適当な圧力までポンプ
引きするのに必要とする時間はしばしば加工片を
処理することができる速度の制限要因である。こ
れは、個々の基質の被覆時間が被覆室を十分に真
空にするのに必要とする時間と比較してときどき
短いような高速蒸着法において特に当てはまる。
加工片すなわち基質を被覆室すなわち処理室に入
れたり出したりする途中別々の真空ロツク室を通
過させるような被覆装置が開発された。この場
合、ロツク室の容積を最小にすることができ、処
理室を大気圧にすることなしに次々の基質につい
て処理を続けることができるため、生産率を増
す。米国特許第3945903号(スベンダ等)は真空
被覆装置を開示しており、この真空被覆装置は入
口ロツク室と、出口ロツク室と、ガラス板を搬送
してこの装置を通過させるローラコンベヤとを備
えている。
The time required to transport the workpiece into and out of the vacuum system and the time required to pump it to the appropriate pressure are often the limiting factors in the speed at which the workpiece can be processed. This is especially true in high speed deposition methods where the coating time of an individual substrate is sometimes short compared to the time required to sufficiently evacuate the coating chamber.
Coating equipment has been developed in which the workpiece or substrate passes through separate vacuum lock chambers on its way into and out of the coating or processing chamber. In this case, the volume of the lock chamber can be minimized and processing of successive substrates can be continued without bringing the chamber to atmospheric pressure, thereby increasing production rates. U.S. Pat. No. 3,945,903 (Subender et al.) discloses a vacuum coating apparatus that includes an inlet lock chamber, an outlet lock chamber, and a roller conveyor for transporting glass sheets through the apparatus. ing.

或る状況では、被覆室の入口および出口の両方
に真空ロツク室を備える完全な両端付きの装置の
費用は正当化されない。代案としては、単一のロ
ツク室および可逆コンベヤを設け、加工片がこの
ロツク室経て処理室に入つたり出たりすることが
できるようにすることである。このような装置は
単一端付き塗装装置と呼ばれる。米国特許第
4405435号(タテイシ等)は単一端付き真空被覆
装置を開示しており、この被覆装置はマルチレバ
ー加工片カセツトと、ロツク室およびロツク室と
スパツタ被覆室との間の中間室の両方にカセツト
エレベータとを有している。
In some situations, the expense of a complete double-ended system with vacuum lock chambers at both the inlet and outlet of the coating chamber is not justified. An alternative is to provide a single lock chamber and reversible conveyor through which workpieces can enter and exit the processing chamber. Such devices are called single-ended coating devices. US Patent No.
No. 4,405,435 (Tateishi et al.) discloses a single-ended vacuum coating apparatus that includes a cassette elevator for both a multilever workpiece cassette and a lock chamber and an intermediate chamber between the lock chamber and the sputter coating chamber. It has

発明の概要 本発明は、加工片を単一端付き真空処理装置に
搬入したり搬出したりする方法および装置であ
る。この装置は処理室および第2室を有し、この
第2室は加工片搬送装置を収容し、この搬送装置
は、共通フレームに支持される2つのコンベヤ
と、加工片を第2室を通して両方向に搬送するた
めに各コンベヤを選択的に移動させる装置とを備
えている。第2室は外側への出入口を備える端ロ
ツク室でもよいし、あるいは処理室と端ロツク室
との間の中間ロツク室すなわち保持室でもよい。
好ましくは、コンベヤは、平行な2組の水平ロー
ラ、および各組のローラと移送ラインとを選択的
に整列させるエレベータを備え、加工片を移送ラ
インに沿つて端ロツク室と保持室との間および保
持室と処理室との間を搬送する。
SUMMARY OF THE INVENTION The present invention is a method and apparatus for loading and unloading workpieces into a single-ended vacuum processing apparatus. The apparatus has a processing chamber and a second chamber, the second chamber housing a workpiece transport device that includes two conveyors supported on a common frame and a workpiece conveyor in both directions through the second chamber. and a device for selectively moving each conveyor to convey the conveyor. The second chamber may be an end lock chamber with an exit/exit to the outside, or it may be an intermediate lock or holding chamber between the processing chamber and the end lock chamber.
Preferably, the conveyor includes two sets of parallel horizontal rollers and an elevator for selectively aligning each set of rollers with the transfer line to move the workpieces along the transfer line between the end lock chamber and the holding chamber. and transport between the holding chamber and the processing chamber.

好適な実施例の説明 第1図は単一端付き真空処理装置を示し、この
装置は処理室10、保持室16およびロツク室1
8を備えている。真空処理は被覆処理であつて、
この処理では、加工片を入口バツフア12から処
理室内の多数のスパツタ被覆源11を通過してオ
ーバランバツフア14の中へ搬送する。必要に応
じて、加工片を処理室10を通して前後に搬送し
ても良い。装置の処理領域は第1内部ゲート弁2
0によつて保持室16から分離され、このゲート
弁20はアクチユエータ22によつて所望に応じ
て開閉することができる。保持室16およびロツ
ク室18は第2内部ゲート弁24によつて相互に
連結され、このゲート弁24はアクチユエータ2
6によつて作動される。加工片積降し領域19か
らロツク室18への出入りはアクチユエータ29
によつて作動できる外部ゲート弁28によつて行
なわれる。ゲート弁およびアクチユエータは所望
の大きさおよび形状の加工片を移送するのに適し
た従来の設計のものでよい。1つのこのようなゲ
ート弁は米国特許第4065097号(テイミン)に示
されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a single-ended vacuum processing apparatus comprising a process chamber 10, a holding chamber 16 and a lock chamber 1.
It is equipped with 8. Vacuum treatment is a coating treatment,
In this process, the workpiece is conveyed from the inlet buffer 12 past multiple spatter coating sources 11 within the process chamber and into an overrun buffer 14. Workpieces may be transported back and forth through the processing chamber 10 if desired. The processing area of the device is the first internal gate valve 2
0 from the holding chamber 16, this gate valve 20 can be opened and closed as desired by an actuator 22. The holding chamber 16 and the locking chamber 18 are interconnected by a second internal gate valve 24, which is connected to the actuator 2.
6. An actuator 29 is used to enter and exit the lock chamber 18 from the work piece loading/unloading area 19.
This is done by an external gate valve 28 which can be operated by. The gate valve and actuator may be of any conventional design suitable for transporting workpieces of desired size and shape. One such gate valve is shown in US Pat. No. 4,065,097 (Teimin).

処理装置の室の各々は在来の装置によつて別々
に真空にすることができる。ロツク室18はブロ
ワまたは他の機械ポンプ32によつて真空にする
ことができる。スパツタリングまたは電子ビーム
加熱被覆法の場合、保持室16および処理室10
は好ましくは拡散ポンプ30によつて真空にする
ことができる。処理室10は所望のスパツタリン
グガスの源34を備えるのがよい。
Each of the chambers of the processing apparatus can be evacuated separately by conventional equipment. Lock chamber 18 can be evacuated by a blower or other mechanical pump 32. In the case of sputtering or electron beam heating coating methods, the holding chamber 16 and the processing chamber 10
can be evacuated, preferably by means of a diffusion pump 30. Processing chamber 10 may include a source 34 of the desired sputtering gas.

真空処理装置の各室は加工片を支持しかつ搬送
するコンベヤを備えている。ガラス板および類似
の基質の場合、各コンベヤは好ましくは一連の平
行な水平ローラ42を備え、これらのローラ42
はフレーム44に設けられ、可逆モータ46によ
つて駆動される。好ましくは、別々の室のコンベ
ヤは基質を移送ライン48に沿つて装置に入れた
り出したりするように整列される。
Each chamber of the vacuum processing apparatus is equipped with a conveyor for supporting and transporting the workpieces. For glass sheets and similar substrates, each conveyor preferably comprises a series of parallel horizontal rollers 42, which
is provided on the frame 44 and driven by a reversible motor 46. Preferably, the separate chamber conveyors are aligned to move substrates into and out of the apparatus along transfer line 48.

好ましい装置では、保持室16は垂直方向に移
動するマルチレベル搬送装置50を備え、この搬
送装置は共通のフレーム60に互いに上下に取付
けられる2つの水平コンベヤ52,54を有して
いる。第2図、第3a図および第3b図に示すよ
うに、フレーム60は多数の横部材63によつて
相互に連結された2つの平行な長さ方向上部材6
2と、上記横部材と同じ数の横部材65によつて
相互に連結され、上部材の真下に整列した2つの
平行な長さ方向下部材64とを備えている。
In the preferred device, the holding chamber 16 is equipped with a vertically moving multilevel conveyor 50 having two horizontal conveyors 52, 54 mounted one above the other on a common frame 60. As shown in FIGS. 2, 3a and 3b, the frame 60 consists of two parallel longitudinal upper members 6 interconnected by a number of transverse members 63.
2 and two parallel lower longitudinal members 64 interconnected by the same number of transverse members 65 and aligned directly below the upper member.

フレーム60は、その下方位置(第2図および
第3b図に示す)にあるとき、脚部68上に位置
し、これらの脚部68は、フレーム保持室16の
底壁部17上のレベルに位置するように必要に応
じて調節できる。加工片搬送装置の長さにより必
要に応じてさらに他の脚部および横部材を側部材
間に設けてもよい。
When the frame 60 is in its lower position (as shown in FIGS. 2 and 3b), it rests on legs 68 which are at a level above the bottom wall 17 of the frame holding chamber 16. You can adjust the position as needed. Further legs and cross members may be provided between the side members as required depending on the length of the workpiece transport device.

第2図、第3a図および第3b図では、装置5
0の上コンベヤ52は移送ライン48と整列して
いる。下コンベヤ54が移送ライン上にあるよう
にフレーム60を上昇させるために、エレベータ
が設けられている。図示のように、このエレベー
タは4つのボールねじジヤツキ70を備え、これ
らのジヤツキ70は底壁部17の真空シール組立
体71を貫いて室16の外方に延びている。各ジ
ヤツキはシール組立体を潤滑するために注油部7
5を備えている。変形例として、エレベータは液
圧または空気圧シリンダを備えてもよい。
In FIGS. 2, 3a and 3b, the device 5
0 upper conveyor 52 is aligned with transfer line 48 . An elevator is provided to raise frame 60 so that lower conveyor 54 is on the transfer line. As shown, the elevator includes four ball screw jacks 70 that extend out of the chamber 16 through a vacuum seal assembly 71 in the bottom wall 17. Each jack has a lubricating section 7 to lubricate the seal assembly.
It is equipped with 5. Alternatively, the elevator may be equipped with hydraulic or pneumatic cylinders.

搬送装置50の垂直方向運動は4つの横案内ホ
イール72によつて案内され、これらのホイール
のうちの2つは各長さ方向下部材の外面に取付け
られている。これらのホイールは室16の両側壁
部に設けられた上棒路73および下棒路74に沿
つて転動する。装置50の運動はまた長さ方向下
部材64の一方と直角な軸77に設けられている
長さ方向案内ホイール76によつて案内される。
ホイール76は室16の一方の側壁部15に設け
られた2つ上路78間と2つの下路79間を転動
する。案内ホイール72,76用の上路および下
路は整列し、従つて、装置50はその上昇位置お
よび降下位置で夫々適切に整列する。
Vertical movement of the transport device 50 is guided by four lateral guide wheels 72, two of which are mounted on the outer surface of each lower longitudinal member. These wheels roll along upper rod paths 73 and lower rod paths 74 provided on both side walls of the chamber 16. Movement of the device 50 is also guided by a longitudinal guide wheel 76 mounted on an axis 77 perpendicular to one of the lower longitudinal members 64.
The wheel 76 rolls between two upper passages 78 and two lower passages 79 provided on one side wall portion 15 of the chamber 16. The upper and lower passages for guide wheels 72, 76 are aligned so that device 50 is properly aligned in its raised and lowered positions, respectively.

側レール62に沿つて整列した支持ブロツク8
2には、多数のローラ80が回転自在に設けられ
ている(ブロツク82は第2図から省いてある)。
各ローラの軸83の一端には2つのプーリ84,
85が取付けられている。第3a図に示すよう
に、隣接したローラのプーリはベルト86によつ
て相互に連結され、このベルトにより、ローラは
同じ方向に同時に回転する。
Support blocks 8 aligned along side rails 62
2 is rotatably provided with a number of rollers 80 (block 82 is omitted from FIG. 2).
Two pulleys 84 are provided at one end of the shaft 83 of each roller.
85 is installed. As shown in Figure 3a, the pulleys of adjacent rollers are interconnected by belts 86 which cause the rollers to rotate simultaneously in the same direction.

どちらのコンベヤが移送ラインにあつても、そ
のコンベヤの1つのローラの軸は磁気装置90,
92によつてシヤフト94に連結され、このシヤ
フト94は側壁部15の回転シールを通つて延び
ている。この回転シヤフトは室16の外側の可逆
モータ95によつて駆動される。
Whichever conveyor is in the transfer line, the axis of one roller of that conveyor is connected to a magnetic device 90,
92 to a shaft 94 which extends through a rotary seal in side wall 15. This rotating shaft is driven by a reversible motor 95 outside the chamber 16.

第4図は本発明の方法を示している。この図の
各部分は処理室100、保持室16およびロツク
室18を示している。処理室は入口バツフアおよ
びオーバランバツフアを備えるのがよい。処理室
100および保持室16は第1ゲート弁20によ
つて相互に連結されている。保持室16およびロ
ツク室18は第2ゲート弁24によつて相互に連
結されている。ロツク室18への加工片の出入り
は第3ゲート弁28によつて行われる。処理室1
00は第1コンベヤ101を収容しており、ロツ
ク室18お第2コベヤ102を収容している。前
記のように、保持室16は加工片搬送装置50を
収容しており、この搬送装置50は上レベルのコ
ンベヤ52および下レベルのコンベヤ54の2つ
を有し、かつ各コンベヤを真空処理装置を通る移
送ライン48と整列させるエレベータを有してい
る。
FIG. 4 illustrates the method of the invention. The parts of this figure show a processing chamber 100, a holding chamber 16, and a lock chamber 18. Preferably, the processing chamber includes an inlet buffer and an overrun buffer. The processing chamber 100 and the holding chamber 16 are interconnected by a first gate valve 20. The holding chamber 16 and the locking chamber 18 are interconnected by a second gate valve 24. The workpieces enter and exit the lock chamber 18 by means of a third gate valve 28. Processing room 1
00 accommodates a first conveyor 101, a lock chamber 18, and a second conveyor 102. As mentioned above, the holding chamber 16 houses a workpiece transport system 50 having two conveyors, an upper level conveyor 52 and a lower level conveyor 54, and each conveyor connected to a vacuum processing apparatus. It has an elevator aligned with a transfer line 48 passing through.

第4a図では、弁20,24は閉じている。1
つの加工片110が室100で処理を受けてい
て、未処理加工片112が保持室16に搬送装置
50の下レベルのコンベヤ54の上に待機してい
る。弁20,24は閉じているので、所望に応じ
て、室16を拡散ポンプによつて真空にし、処理
室100内の圧力を別個に設定する。弁28は開
いており、第2未処理加工片114を第4b図に
示すように積降し領域のコンベヤ104からロツ
ク室の中のコンベヤ102上に搬送する。次い
で、弁28を閉じ、ロツク室18を荒引きポンプ
により真空にする。
In Figure 4a, valves 20, 24 are closed. 1
Two workpieces 110 are being processed in chamber 100 and unprocessed workpieces 112 are waiting in holding chamber 16 on conveyor 54 at the lower level of transport device 50 . Since valves 20 and 24 are closed, chamber 16 is evacuated by the diffusion pump and the pressure within process chamber 100 is independently set, if desired. Valve 28 is open and conveys a second green workpiece 114 from conveyor 104 in the unloading area onto conveyor 102 in the lock chamber, as shown in FIG. 4b. Then, the valve 28 is closed and the lock chamber 18 is evacuated by the rough pump.

空のコンベヤ52が移送ラインにあるように搬
送装置50を整列させる。加工片110の処理が
終了するとき、弁20を開き、加工片110を空
の上コンベヤ52の上に搬送する。次いで、搬送
装置50は上方に移動し、従つて第4c図に示す
ように、下コンベヤ54が移送ラインに位置し、
未処理加工片112を処理室内のコンベヤ101
の上に搬送する。弁20を閉じると、加工片11
2の処理が進行する。弁24,28は閉じたまま
であり、ロツク室18のポンプ荒引きが続く。
The conveyor 50 is aligned so that the empty conveyor 52 is in the transfer line. When processing of the workpiece 110 is finished, the valve 20 is opened and the workpiece 110 is conveyed onto the empty upper conveyor 52. The conveying device 50 then moves upwards so that the lower conveyor 54 is located in the transfer line, as shown in FIG. 4c.
The unprocessed piece 112 is transferred to the conveyor 101 in the processing chamber.
Transport on top of. When the valve 20 is closed, the work piece 11
Process 2 proceeds. Valves 24 and 28 remain closed and rough pumping of lock chamber 18 continues.

第4d図に示すように、弁24を開き、未処理
加工片114を保持室16へ中へ装置50の下コ
ンベヤ54の上に搬送する。次いで、装置50を
下方に移動させて、上コンベヤ52を第4e図に
示すように移送ラインに整列させ、処理された加
工片110を第4f図に示すように弁24からロ
ツク室18内のコンベヤ102の上に搬送する。
弁20は閉じたままであり、従つて室100では
加工片112の処理が続く。ロツク室18を通気し、
ゲート弁28を開くと、処理された加工片110
をロツク室18からコンベヤ104の上に移送す
ることができる。弁20,24を閉じ、保持室1
6のポンプ作用および室100での処理を続け
る。処理された加工片110をコンベヤから降し
未処理加工片と交換し、サイクルを続けて第4a
図で再び始める。
As shown in FIG. 4d, the valve 24 is opened and the unprocessed workpiece 114 is conveyed into the holding chamber 16 onto the lower conveyor 54 of the apparatus 50. The apparatus 50 is then moved downwardly to align the upper conveyor 52 with the transfer line as shown in FIG. It is conveyed onto the conveyor 102.
Valve 20 remains closed so processing of workpiece 112 continues in chamber 100. Vent the lock chamber 18,
When the gate valve 28 is opened, the processed workpiece 110
can be transferred from lock chamber 18 onto conveyor 104. Close the valves 20 and 24 and open the holding chamber 1.
6 continue pumping and processing in chamber 100. The treated workpiece 110 is removed from the conveyor and replaced with an untreated workpiece, and the cycle continues at step 4a.
Start again with the diagram.

保持室を使用することにより、ゲート20を開
くとき、処理室へのガスの噴入を減らすことがで
き、かつ第4a図および第4f図に指示するよう
に加工片をゲート28通して搬送するのに必要と
する時間を除いて、ロツク室18のポンプ作用を
可能にする。第4b図および第4c図に指示する
ように、加工片を処理室100と保持室16との
間で搬送するのに必要とする短い時間を除いて処
理を続け得るので、処理室の効率的な利用が図か
れる。
The use of a holding chamber reduces the injection of gas into the process chamber when gate 20 is opened and the workpiece is transported through gate 28 as indicated in FIGS. 4a and 4f. This allows the lock chamber 18 to pump. As indicated in FIGS. 4b and 4c, processing can continue except for the short time required to transport the workpiece between the processing chamber 100 and the holding chamber 16, thereby increasing the efficiency of the processing chamber. It will be used for various purposes.

第4図と併させて説明すると、処理された加工
片を下コンベヤ52に載せ、未処理加工片を下コ
ンベヤ54に載せる。落下破片が問題であれば、
処理された加工片を下コンベヤ54に未処理加工
片より下に載せるように方法を変形することが好
ましい。
Explaining this in conjunction with FIG. 4, processed pieces are placed on the lower conveyor 52, and untreated pieces are placed on the lower conveyor 54. If falling debris is a problem,
Preferably, the method is modified so that the treated workpieces are placed on the lower conveyor 54 below the untreated workpieces.

本発明の精神から逸脱することなしに方法およ
び装置に種々の他の変形を行うことができる。
Various other modifications may be made to the method and apparatus without departing from the spirit of the invention.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明を組込んだ真空被覆装置の概略
側面図;第2図は本発明による2レベル加工片搬
送装置を組込んだ保持室の部分横断面側面図;第
3a図は第2図の保持室および加工片搬送装置の
平面図;第3b図は第2図の保持室および加工片
搬送装置の部分横断面端面図;第4図は本発明に
よる方法を示す処理室、保持室および真空ロツク
室を備える真空処理装置の概略図である。 10……処理室、16……保持室、18……ロ
ツク室、20,24,28……ゲート弁、26,
29……アクチユエータ、30……拡散ポンプ、
42……ローラ、44……フレーム、48……移
送ライン、50……搬送装置、52,54……コ
ンベヤ、60……フレーム、72……ホイール、
80……ローラ。
1 is a schematic side view of a vacuum coating apparatus incorporating the present invention; FIG. 2 is a partial cross-sectional side view of a holding chamber incorporating a two-level workpiece transport apparatus according to the invention; FIG. FIG. 3b is a partial cross-sectional end view of the holding chamber and workpiece conveyance device shown in FIG. 2; FIG. 4 is a processing chamber and holding chamber illustrating the method according to the invention. 1 is a schematic diagram of a vacuum processing apparatus including a vacuum lock chamber and a vacuum lock chamber. 10... Processing chamber, 16... Holding chamber, 18... Lock chamber, 20, 24, 28... Gate valve, 26,
29... Actuator, 30... Diffusion pump,
42... Roller, 44... Frame, 48... Transfer line, 50... Conveying device, 52, 54... Conveyor, 60... Frame, 72... Wheel,
80... Laura.

Claims (1)

【特許請求の範囲】 1 真空引き可能な第1室及び第2室と、 第1室及び第2室を相互に連結する第1ゲート
弁と、 第2室への出入りを行わせるための第2ゲート
弁と、 第1室内の第1コンベヤと、 第1室及び第2室の外側の第2コンベヤと、 第2室内の加工片搬送装置と、からなり、 前記加工片搬送装置は、共通のフレームに互に
隣接して支持された第3コンベヤ及び第4コンベ
ヤと、 第3コンベヤ及び第4コンベヤの各々を、第1
ゲート弁が開いているときに第1コンベアと第3
コンベヤ及び第4コンベヤの各々との間を加工片
を搬送するために第1コンベヤと整列させ、かつ
第2ゲート弁が開いているときに第3コンベヤ及
び第4コンベヤの各々と第2コンベヤとの間を加
工片を搬送するために第2コンベヤと整列させる
ように、第3コンベヤ及び第4コンベヤを選択的
に移動させる装置と、を備える、真空処理装置。 2 真空引き可能な第3室を更に備え、第2ゲー
ト弁は第2室及び第3室を相互に連結する、特許
請求の範囲第1項に記載の真空処理装置。 3 第3コンベヤ及び第4コンベヤが平行であ
る、特許請求の範囲第1項に記載の真空処理装
置。 4 各コンベヤは多数の平行で実質的に水平なロ
ーラ及びこれらのローラを同時に回転させる手段
を備えている、特許請求の範囲第3項に記載の真
空処理装置。 5 第3コンベヤ及び第4コンベヤは互いに上下
に支持され、コンベヤ移動装置はフレームを垂直
方向に移動させるエレベータからなる、特許請求
の範囲第4項に記載の真空処理装置。 6 加工片搬送装置は、フレームに設けられフレ
ームの移動を案内するためのホイールを更に備え
ている、特許請求の範囲第5項に記載の真空処理
装置。 7 加工片を真空処理装置に搬入したり搬出した
りする方法において、 加工片を処理し、 処理した加工片を第1室内の第1コンベヤから
第2室内のマルチレベルコンベヤの第1レベルま
で搬送し、 マルチレベルコンベヤを移動してマルチレベル
コンベヤの第2レベルを第1コンベヤと整列さ
せ、 始めの未処理加工片を第2レベルから第1コン
ベヤの上に搬送し、次いで第1室を第2室に対し
て密封し、 2番目の未処理加工片を第2室の外側の第2コ
ンベヤから第2レベルに搬送し、 マルチレベルコンベヤを移動して第1レベルを
第2コンベヤと整列させ、 処理した加工片を第1レベルから第2コンベヤ
まで搬送し、 第2室を密封する、ことを特徴とする方法。 8 第2コンベヤが密封可能な第3室の中にあ
り、処理した各加工片を装置外へ第2コンベヤか
ら搬出し、 各未処理加工片を装置の外側から第3室の中へ
第2コンベヤ上に搬送し、 第3室を密封しかつ真空引きすることを更に含
む、特許請求の範囲第7項に記載の方法。
[Claims] 1. A first chamber and a second chamber that can be evacuated, a first gate valve that interconnects the first chamber and the second chamber, and a second gate valve that allows entry and exit into the second chamber. It consists of a 2-gate valve, a first conveyor in the first chamber, a second conveyor outside the first and second chambers, and a workpiece conveyance device in the second chamber, and the workpiece conveyance device is common. a third conveyor and a fourth conveyor supported adjacent to each other on the frame of the first conveyor;
When the gate valve is open, the first and third conveyors
the first conveyor for conveying workpieces between each of the conveyor and the fourth conveyor, and the second conveyor and each of the third conveyor and the fourth conveyor when the second gate valve is open; a device for selectively moving a third conveyor and a fourth conveyor into alignment with a second conveyor for conveying workpieces therebetween. 2. The vacuum processing apparatus according to claim 1, further comprising a third chamber that can be evacuated, and the second gate valve interconnects the second chamber and the third chamber. 3. The vacuum processing apparatus according to claim 1, wherein the third conveyor and the fourth conveyor are parallel. 4. A vacuum processing apparatus according to claim 3, wherein each conveyor comprises a number of parallel, substantially horizontal rollers and means for rotating the rollers simultaneously. 5. The vacuum processing apparatus according to claim 4, wherein the third conveyor and the fourth conveyor are supported above and below each other, and the conveyor moving device is an elevator that moves the frame in the vertical direction. 6. The vacuum processing apparatus according to claim 5, wherein the workpiece conveyance device further includes a wheel provided on the frame to guide movement of the frame. 7. A method for transporting a workpiece into and out of a vacuum processing device, including processing the workpiece and transporting the processed workpiece from a first conveyor in a first chamber to a first level of a multilevel conveyor in a second chamber. moving the multi-level conveyor to align the second level of the multi-level conveyor with the first conveyor, transporting the first unprocessed piece from the second level onto the first conveyor, and then moving the first chamber onto the first conveyor. sealing against the two chambers, conveying the second unprocessed piece from a second conveyor outside the second chamber to the second level, and moving the multilevel conveyor to align the first level with the second conveyor. , transporting the processed workpiece from the first level to a second conveyor, and sealing the second chamber. 8 A second conveyor is in a third sealable chamber, transporting each processed workpiece from the second conveyor out of the apparatus and transporting each unprocessed workpiece from outside the apparatus into the third chamber. 8. The method of claim 7, further comprising transferring onto a conveyor, sealing and evacuating the third chamber.
JP61017685A 1985-01-31 1986-01-29 Vacuum treater Granted JPS61206722A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69683685A 1985-01-31 1985-01-31
US696836 1985-01-31

Publications (2)

Publication Number Publication Date
JPS61206722A JPS61206722A (en) 1986-09-13
JPH0336735B2 true JPH0336735B2 (en) 1991-06-03

Family

ID=24798750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61017685A Granted JPS61206722A (en) 1985-01-31 1986-01-29 Vacuum treater

Country Status (5)

Country Link
JP (1) JPS61206722A (en)
KR (1) KR950003597B1 (en)
AU (1) AU572375B2 (en)
CA (1) CA1307759C (en)
GB (1) GB2171119B (en)

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Also Published As

Publication number Publication date
KR950003597B1 (en) 1995-04-14
GB2171119A (en) 1986-08-20
KR860005739A (en) 1986-08-11
GB8601905D0 (en) 1986-03-05
AU5253786A (en) 1986-08-28
JPS61206722A (en) 1986-09-13
GB2171119B (en) 1989-01-18
AU572375B2 (en) 1988-05-05
CA1307759C (en) 1992-09-22

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