JPS61206722A - Vacuum treater - Google Patents
Vacuum treaterInfo
- Publication number
- JPS61206722A JPS61206722A JP61017685A JP1768586A JPS61206722A JP S61206722 A JPS61206722 A JP S61206722A JP 61017685 A JP61017685 A JP 61017685A JP 1768586 A JP1768586 A JP 1768586A JP S61206722 A JPS61206722 A JP S61206722A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- conveyor
- workpiece
- level
- vacuum processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G5/00—Storing fluids in natural or artificial cavities or chambers in the earth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は加工片を真空処理装置に搬入したり搬出したり
する方法および装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for transporting workpieces into and out of a vacuum processing apparatus.
加工片を真空装置に搬入したり搬出したりするのに必要
とする時間および適当な圧力までポンプ引きするのに必
要とする時間はしばしば加工片を処理することができる
速度の制限要因である。これは、個々の基質の被覆時間
が被覆室を十分に真空にするのに必要とする時間と比較
してときどき短いような高速蒸着法において特に当ては
まる。The time required to transport the workpiece into and out of the vacuum system and the time required to pump it to the appropriate pressure are often the limiting factors in the speed at which the workpiece can be processed. This is especially true in high speed deposition methods where the coating time of an individual substrate is sometimes short compared to the time required to sufficiently evacuate the coating chamber.
加工片すなわち基質を被覆室すなわち処理室に入れたり
出したりする途中別々の真空ロック室を通過させるよう
な被覆装置が開発された。この場合、ロック室の容積を
最小にすることができ、処理室を大気圧にすることなし
に次々の基質について処理を続けることができるため、
生産率を増す、米国特許第3,945.903号(スパ
ッタ等)は真空被覆装置を開示しており、この真空被覆
装置は入口ロック室と、出口ロック室と、ガラス板を搬
送してこの装置を通過させるローラコンベヤとを備えて
いる。Coating equipment has been developed in which the workpiece or substrate passes through separate vacuum lock chambers on its way into and out of the coating or processing chamber. In this case, the volume of the lock chamber can be minimized and the treatment can be continued for one substrate after another without bringing the treatment chamber to atmospheric pressure.
In order to increase production rates, U.S. Pat. and a roller conveyor for passing the device.
成る状況では、被覆室の入口および出口の両方に真空ロ
ック室を備える完全な両端付き装置の費用は正当化され
ない。代案としては、単一のロック室および可逆コンベ
ヤを設け、加工片がこのロック室径て処理室に入っkり
出たりすることができるようにすることである。このよ
うな装置は単一端付き塗装装置と呼ばれる。米国特許第
4.405,435号(タテイシ等)は単一端付き真空
被覆装置を開示しており、この被覆装置はマルチレバー
加工片カセットと、ロック室およびロック室とスパッタ
被覆室との間の中間室の両方にカセットエレベータとを
有している。In these situations, the expense of a complete double-ended device with vacuum lock chambers at both the inlet and outlet of the coating chamber is not justified. An alternative is to provide a single lock chamber and reversible conveyor, allowing workpieces to enter and exit the processing chamber through the lock chamber diameter. Such devices are called single-ended coating devices. U.S. Pat. No. 4,405,435 (Tateishi et al.) discloses a single-ended vacuum coating apparatus that includes a multi-lever workpiece cassette and a lock chamber and a sputter coating chamber between the lock chamber and the sputter coating chamber. Both intermediate rooms have cassette elevators.
1皿q量!
本発明は、加工片を単一端付き真空処理装置に搬入した
り搬出したりする方法および装置である。q amount per plate! The present invention is a method and apparatus for loading and unloading workpieces into a single-ended vacuum processing apparatus.
この装置は処理室および第2室を有し、この第2室は加
工片搬送装置を収容し、この搬送装置は、共通フレーム
に支持される2つのコンベヤと、加工片を第2室を通し
て両方向に搬送するためにフレームおよび各コンベヤを
整列させる装置とを備えている。第2室は外側への出入
口を備える端口ツク室でもよいし、あるいは処理室と端
口ツク室との間の中間ロックすなわち保持室でもよい、
好ましくは、コンベヤは、平行な2組の水平ローラ、お
よび各組のローラと移送ラインとを選択的に整列させる
エレベータを備え、加工片を移送ラインに沿って端口ツ
ク室と保持室との間および保持室と処理室との間を搬送
する。The apparatus has a processing chamber and a second chamber, the second chamber housing a workpiece transport device that includes two conveyors supported on a common frame and a workpiece conveyor in both directions through the second chamber. and a frame and a device for aligning each conveyor. The second chamber may be an end-to-end chamber with an exit/exit to the outside, or an intermediate lock or holding chamber between the processing chamber and the end-to-end chamber;
Preferably, the conveyor includes two sets of parallel horizontal rollers and an elevator for selectively aligning each set of rollers with the transfer line to move the workpieces along the transfer line between the end picking chamber and the holding chamber. and transport between the holding chamber and the processing chamber.
゛な の゛
第1図は単一端付き真空処理装置を示し、この装置は処
理室10、保持室16およびロック室18を備えている
。真空処理は被覆処理であって、この処理では、加工片
を入口バッファ12から処理室内の多数のスパッタ被覆
源11を通過してオーバランバッファ14の中へ搬送す
る。必要に応じて、加工片を処理室10を通して前後に
搬送しても良い。装置の処理領域は第1内部ゲート弁2
0によって保持室16から分離され、このゲート弁20
はアクチュエータ22によって所望に応じて開閉するこ
とができる。保持室16およびロック室18は第2内部
ゲート弁24によって相互に連結され、このゲート弁2
4はアクチュエータ26によって作動される。加工片積
降し領域19からロック室18への出入りはアクチュエ
ータ29によって作動できる外部ゲート弁28によって
行なわれる。ゲート弁およびアクチュエータは所望の大
きさおよび形状の加工片を移送するのに適した在来の設
計のものでよい。1つのこのようなゲート弁は米国特許
第4.065.097号(ティミン)に示されている。Figure 1 shows a single-ended vacuum processing apparatus that includes a processing chamber 10, a holding chamber 16, and a locking chamber 18. Vacuum processing is a coating process in which the workpiece is transported from an inlet buffer 12 past multiple sputter coating sources 11 within the processing chamber and into an overrun buffer 14. Workpieces may be transported back and forth through the processing chamber 10 if desired. The processing area of the device is the first internal gate valve 2
0 from the holding chamber 16 and this gate valve 20
can be opened and closed as desired by actuator 22. The holding chamber 16 and the locking chamber 18 are interconnected by a second internal gate valve 24, which
4 is actuated by an actuator 26. Access to and from the lock chamber 18 from the workpiece unloading area 19 is provided by an external gate valve 28 which can be actuated by an actuator 29. The gate valve and actuator may be of any conventional design suitable for transferring workpieces of desired size and shape. One such gate valve is shown in US Pat. No. 4.065.097 (Timin).
処理装置の室の各々は在来の装置によって別々に真空に
することができる。ロック室18はブロワまたは他の機
械ポンプ32によって真空にすることができる。スパッ
タリングまたは電子ビーム加熱被覆法の場合、保持室1
6および処理室1゜は好ましくは拡散ポンプ30によっ
て真空にすることができる。処理室10は所望のスパッ
タリングガスの源34を備えるのがよい。Each of the chambers of the processing apparatus can be evacuated separately by conventional equipment. Lock chamber 18 can be evacuated by a blower or other mechanical pump 32. In the case of sputtering or electron beam heating coating method, holding chamber 1
6 and the processing chamber 1° can preferably be evacuated by means of a diffusion pump 30. Processing chamber 10 may include a source 34 of the desired sputtering gas.
真空処理装置の各・室は加工片を支持しかつ搬送するコ
ンベヤを備えている。ガラス板およびlWf以の基質の
場合、各コンベヤは好ましくは一連の平行な水平ローラ
42を備え、これらのローラ42はフレーム44に設け
られ、可逆モータ46によって駆動される。好ましくは
、別々の室のコンベヤは基質を移送ライン48に沿って
装置に入れたり出したりするように整列される。Each chamber of the vacuum processing apparatus is equipped with a conveyor that supports and transports the workpiece. For glass sheets and substrates larger than lWf, each conveyor preferably comprises a series of parallel horizontal rollers 42 mounted on a frame 44 and driven by a reversible motor 46. Preferably, the separate chamber conveyors are aligned to move substrates into and out of the apparatus along transfer line 48.
好ましい装置では、保持室16は垂直方向に移動するマ
ルチレバー搬送装置50を備え、この搬送装置は共通の
フレーム60に互いに上下に取付けられる2つの水平コ
ンベヤ52.54を有している。第2図、第3a図およ
び第3b図に示すように、フレーム60は多数の横部材
63によつて相互に連結された2つの平行な長さ方向上
部材62と、上記横部材と同じ数の横部材65によって
相互に連結され、上部材の真下に整列した2つの平行な
長さ方向下部材64とを備えている。In the preferred device, the holding chamber 16 is equipped with a vertically moving multi-lever transport device 50, which has two horizontal conveyors 52, 54 mounted one above the other on a common frame 60. As shown in FIGS. 2, 3a and 3b, the frame 60 comprises two parallel upper longitudinal members 62 interconnected by a number of transverse members 63 and an equal number of said transverse members. two parallel longitudinal lower members 64 interconnected by transverse members 65 and aligned directly below the upper member.
フレーム60は、その下方位置(第2図および第3b図
に示す)にあるとき、脚部68上に位置し、これらの脚
部68は、フレームが保持室16の底壁部17上のレベ
ルに位置するように必要に応じて調節できる。加工片搬
送装置の長さにより必要に応じてさらに他の脚部および
横部材を側部材間に設けてもよい。When the frame 60 is in its lower position (as shown in FIGS. 2 and 3b), it rests on legs 68, which ensure that the frame is level above the bottom wall 17 of the holding chamber 16. It can be adjusted as necessary to position it. Further legs and cross members may be provided between the side members as required depending on the length of the workpiece transport device.
第2図、第3a図および第3b図では、装置50の上コ
ンベヤ52は移送ライン48と整列している。下コンベ
ヤ54が移送ライン上にあるようにフレーム60を上昇
させるために、エレベータが設けられている。図示のよ
うに、このエレベータは4つのボールねじジヤツキ70
を備え、これらのジヤツキ70は底壁部17の真空シー
ル組立体71を貫いて室16の外方に延びている。各ジ
ヤツキはシール組立体を潤滑するために注油部75を備
えている。変形例として、エレベータは液圧または空気
圧シリンダを備えてもよい。2, 3a and 3b, upper conveyor 52 of apparatus 50 is aligned with transfer line 48. In FIGS. An elevator is provided to raise frame 60 so that lower conveyor 54 is on the transfer line. As shown, this elevator has four ball screw jacks 70.
These jacks 70 extend outwardly of the chamber 16 through a vacuum seal assembly 71 in the bottom wall 17. Each jack includes a lubricant 75 for lubricating the seal assembly. Alternatively, the elevator may be equipped with hydraulic or pneumatic cylinders.
搬送装置50の垂直方向運動は4つの横案内ホイール7
2によって案内され、これらのホイールのうちの2つは
各長さ方向下部材の外面に取付けられている。これらの
ホイールは室16の両側壁部に設けられた上棒路73お
よび下棒路74に沿って転勤する。装置50の運動はま
た長さ方向下部材64の一方と直角な軸77に設けられ
ている長さ方向案内ホイール76によって案内される。The vertical movement of the conveying device 50 is achieved by means of four lateral guide wheels 7.
2, two of these wheels are attached to the outer surface of each lower longitudinal member. These wheels are rotated along an upper bar track 73 and a lower bar track 74 provided on both side walls of the chamber 16. Movement of the device 50 is also guided by a longitudinal guide wheel 76 mounted on an axis 77 perpendicular to one of the lower longitudinal members 64.
ホイール76は室16の一方の側壁部15に設けられた
2つ上路78間と2つの下路79間を転動する。案内ホ
イール72.76用の上路および下路は整列し、従って
、装置50はその上昇位置および降下位置で夫々適切に
整列する。The wheel 76 rolls between two upper passages 78 and two lower passages 79 provided on one side wall portion 15 of the chamber 16. The upper and lower passages for the guide wheels 72, 76 are aligned so that the device 50 is properly aligned in its raised and lowered positions, respectively.
側レール62に沿って整列した支持ブロック82には、
多数のローラ80が回転自在に設けられている(ブロッ
ク82は第2図から省いである)、各ローラの軸83の
一端には2つのプーリ84.85が取付けられている。The support blocks 82 aligned along the side rails 62 include
A number of rollers 80 are rotatably provided (block 82 is omitted from FIG. 2), each roller having two pulleys 84, 85 attached to one end of its shaft 83.
第3a図に示すように、隣接したローラのブーりはベル
ト86によって相互に連結され、このベルトにより、ロ
ーラは同じ方向に同時に回転する。As shown in Figure 3a, the boots of adjacent rollers are interconnected by belts 86 which cause the rollers to rotate simultaneously in the same direction.
どちらのコンベヤが移送ラインにあっても、そのコンベ
ヤの1つのローラの軸は磁気装置90.92によってシ
ャフト94に連結され、このシャフト94は側壁部15
の回転シールを通って延びている。この回転シャフトは
室16の外側の可逆モータ95によって駆動される。Whichever conveyor is in the transfer line, the axis of one roller of that conveyor is connected by a magnetic device 90.92 to a shaft 94 which is connected to the side wall 15.
extending through the rotating seal. This rotating shaft is driven by a reversible motor 95 outside the chamber 16.
第4図は本発明の方法を示している。この図の各部分は
処理室100、保持室16およびロック室18を示して
いる。処理室は入ロバソファおよびオーバランバッファ
を備えるのがよい。処理室100および保持室16は第
1ゲート弁20によって相互に連結されている。処理室
16およびロック室18は第2ゲート弁24によって相
互に連結されている。ロック室18への加工片の出入り
は第3ゲート弁28によって行われる。処理室100は
第1コンベヤ101を収容しており、ロック室18は第
2コンベヤ102を収容している。FIG. 4 illustrates the method of the invention. Each part of this figure shows a processing chamber 100, a holding chamber 16, and a lock chamber 18. The processing chamber is preferably equipped with an input robot sofa and an overrun buffer. The processing chamber 100 and the holding chamber 16 are interconnected by a first gate valve 20. The processing chamber 16 and the lock chamber 18 are interconnected by a second gate valve 24 . The work piece is moved in and out of the lock chamber 18 by a third gate valve 28. The processing chamber 100 houses a first conveyor 101, and the lock chamber 18 houses a second conveyor 102.
前記のように、保持室16は加工片搬送装置50を収容
しており、この搬送装置50は2つのコンベヤを下レベ
ル52および上レベル54に有し、かつ各コンベヤを真
空処理装置を通る移送ライン48と整列させるエレベー
タを有している。As mentioned above, the holding chamber 16 houses a workpiece transport system 50 having two conveyors on a lower level 52 and an upper level 54 and each conveyor being connected to a workpiece transport system 50 for transport through the vacuum processing equipment. It has an elevator aligned with line 48.
第4a図では、弁20.24は閉じている。1つの加工
片110が室100で処理を受けていて、未処理加工片
112が保持室16に搬送装置の下レベルのコンベヤ5
4の上に待機している。弁20.24は閉じているので
、所望に応じて、室16を拡声ポンプによって真空にし
、処理室100内の圧力を別個に設定する。弁28は開
いており、第2未処理加工片114を第4bに示すよう
に積降し領域のコンベヤ104からロック室の中のコン
ベヤ102上に搬送する6次いで、弁28を閉じ、ロッ
ク室18を荒引きポンプにより真空にする。In FIG. 4a, valve 20.24 is closed. One workpiece 110 is undergoing processing in chamber 100 and an unprocessed workpiece 112 is transferred to holding chamber 16 on conveyor 5 at the lower level of the transport device.
Waiting on top of 4. Since valves 20.24 are closed, chamber 16 is evacuated by a loudspeaker pump and the pressure within process chamber 100 is separately set, if desired. The valve 28 is open and the second raw work piece 114 is conveyed from the conveyor 104 in the unloading area onto the conveyor 102 in the lock chamber as shown in 4b.Then the valve 28 is closed and the second raw work piece 114 is conveyed from the conveyor 104 in the unloading area onto the conveyor 102 in the lock chamber. 18 is evacuated using a roughing pump.
空のコンベヤ52が移送ラインにあるように搬送装置5
0を整列させる。加工片110の処理が終了するとき、
弁20を開き、加工片110を空の上コンベヤ52の上
に搬送する。次いで、搬送装置50は上方に移動し、従
って第4C図に示すように、下コンベヤ54が移送ライ
ンに位置し、未処理加工片112を処理室内のコンベヤ
101の上に搬送する。弁20を閉じると、加工片11
2の処理が進行する。弁24.28は閉じたままであり
、ロック室18のポンプ荒引きが続く。Transfer device 5 such that an empty conveyor 52 is in the transfer line
Align 0. When processing of the work piece 110 is completed,
The valve 20 is opened and the work piece 110 is conveyed onto the empty upper conveyor 52. The transport device 50 then moves upwards so that the lower conveyor 54 is located in the transfer line and transports the unprocessed workpiece 112 onto the conveyor 101 within the processing chamber, as shown in FIG. 4C. When the valve 20 is closed, the work piece 11
Process 2 proceeds. The valves 24,28 remain closed and rough pumping of the lock chamber 18 continues.
第4d図に示すように、弁24を開き、未処理加工片1
14を保持室16へ中へ装置50の下コンベヤ54の上
に搬送する。次いで、装置50を下方に移動させて、下
コンベヤ52を第4e図に示すように移送ラインに整列
させ、未処理加工片110を第4f図に示すように弁2
4からロック室18内のコンベヤ102の上に搬送する
。弁20は閉じたままであり、従って室100では加工
片112の処理が続く。ロック室J8を通気し、ゲート
弁28を開くと、処理された加工片110をロック室1
8からコンベヤ104の上に移送することができる。弁
24.20を閉じ、保持室16のポンプ作用および室1
00での処理を続ける。処理された加工片110をコン
ベヤから降し、未処理加工片と交換し、サイクルを続け
て第4a図で再び始める。As shown in FIG. 4d, the valve 24 is opened and the unprocessed piece 1 is opened.
14 into the holding chamber 16 onto the lower conveyor 54 of the device 50. The apparatus 50 is then moved downwardly so that the lower conveyor 52 is aligned with the transfer line as shown in FIG.
4 onto the conveyor 102 in the lock chamber 18. Valve 20 remains closed, so processing of workpiece 112 continues in chamber 100. When the lock chamber J8 is ventilated and the gate valve 28 is opened, the processed work piece 110 is transferred to the lock chamber 1.
8 onto a conveyor 104. Close valves 24.20 and pump action of holding chamber 16 and chamber 1.
Continue processing at 00. The treated workpiece 110 is removed from the conveyor and replaced with an untreated workpiece, and the cycle continues and begins again in FIG. 4a.
保持室の使用することにより、ブー1−20を開くとき
、処理室へのガスの噴入を減らすことができ、かつ第4
a図および第4f図に指示するように加工片をゲート2
8通して搬送するのに必要とする時間を除いて、ロック
室18のポンプ作用を可能にする。第4b図および第4
C図に指示するように、加工片を処理室100と保持室
16との間で搬送するのに必要とする短い時間を除いて
処理を続は得るので、処理室の効率的な利用が図かれる
。The use of the holding chamber reduces the injection of gas into the processing chamber when opening the boolean 1-20, and
Place the workpiece through gate 2 as indicated in Figures a and 4f.
8, allowing pumping of the lock chamber 18. Figures 4b and 4
As indicated in Figure C, processing continues except for the short time required to transport the workpiece between the processing chamber 100 and the holding chamber 16, resulting in efficient utilization of the processing chamber. It will be destroyed.
第4図と併せて説明すると、処理された加工片を上コン
ベヤ52に載せ、未処理加工片を下コンベヤ54に載せ
る。落下破片が問題であれば、処理された加工片を下コ
ンベヤ54に未処理加工片より下に載せるように方法を
変形することが好ましい。To explain this in conjunction with FIG. 4, processed pieces are placed on the upper conveyor 52, and unprocessed pieces are placed on the lower conveyor 54. If falling debris is a problem, it is preferable to modify the method so that the treated workpieces are loaded onto the lower conveyor 54 below the untreated workpieces.
本発明の精神から逸脱することなしに方法および装置に
種々の他の変形を行うことができる。Various other modifications may be made to the method and apparatus without departing from the spirit of the invention.
第1図は本発明を組込んだ真空被覆装置の概略側面図;
第2図は本発明による2レベル加工片搬送装置を組込ん
だ保持室の部分横断面側面図;第3a図は第2図の保持
室および加工片搬送装置の平面図;第3b図は第2図の
保持室および加工片搬送装置の部分横断面端面図;第4
図は本発明による方法を示す処理室、保持室および真空
ロック室を備える真空処理装置の概略図である。
lO・・・処理室、16・・・保持室、18・・・ロッ
ク室、20.24.28・・・ゲート弁、26.29・
・・アクチュエータ、30・・・拡散ポンプ、42・・
・ローラ、44・・・フレーム、48・・・移送ライン
、50・・・搬送装置、52.54・・・コンベヤ、6
0・・・フレーム、72・・・ホイール、80・・・ロ
ーラ。
開口の浄が内容に変更なし)
FIG、1
FIG、4
手続補正書(方式)
特許庁長官 宇 賀 道 部 殿 (し1
、事件の表示 昭和61年特許願第17685号2
、発明の名称 真空処理装置
3、補正をする者
事件との関係 出願人
名 称 ザ ピーオーシー グループインコーホレー
テッド
4、代理人
6、補正の対象 全図面FIG. 1 is a schematic side view of a vacuum coating device incorporating the present invention;
FIG. 2 is a partial cross-sectional side view of a holding chamber incorporating a two-level workpiece transfer device according to the invention; FIG. 3a is a plan view of the holding chamber and workpiece transfer device of FIG. 2; FIG. Partial cross-sectional end view of the holding chamber and workpiece conveyance device in Figure 2; 4th
The figure is a schematic diagram of a vacuum processing apparatus comprising a processing chamber, a holding chamber and a vacuum lock chamber, illustrating the method according to the invention. lO...processing chamber, 16...holding chamber, 18...lock chamber, 20.24.28...gate valve, 26.29.
...Actuator, 30...Diffusion pump, 42...
・Roller, 44... Frame, 48... Transfer line, 50... Conveying device, 52.54... Conveyor, 6
0...Frame, 72...Wheel, 80...Roller. There is no change in the contents of the opening) FIG, 1 FIG, 4 Procedural amendment (method) Mr. Michibe Uga, Commissioner of the Patent Office (Shi 1
, Incident Indication 1986 Patent Application No. 17685 2
, Title of the invention Vacuum processing apparatus 3, Relationship to the case of the person making the amendment Applicant name The POC Group, Inc. 4, Agent 6, Subject of amendment All drawings
Claims (1)
と; 第2室への出入りを行なわせるための第2ゲート弁; 第1室および第2室の外側の第2加工片コンベヤ; 共通のフレームで支持される第3加工片コンベヤおよび
第4加工片コンベヤよりなる第2室内の加工片搬送装置
と; 第1ゲート弁が開いているときには第1室と第2室との
間を、第2ゲート弁が開いているときには第2室と第コ
ンベヤとの間を加工片を搬送するために、フレームと第
3コンベヤおよび第4コンベヤの各々とを選択的に整列
させる装置と、を備えていることを特徴とする真空処理
装置。 2、真空引き可能な第3室をさらに備え、第2ゲート弁
は第2室および第3室を相互に連結することを特徴とす
る特許請求の範囲第1項に記載の真空処理装置。 3、第3コンベヤおよび第4コンベヤは平行であること
を特徴とする特許請求の範囲第1項に記載の真空処理装
置。 4、各コンベヤは多数の平行で実質的に水平なローラお
よびこれらのローラを同時に回転させる手段を備えてい
ることを特徴とする特許請求の範囲第3項に記載の真空
処理装置。 5、第3コンベヤおよび第4コンベヤは互いに上下に支
持され、コンベヤ整列装置はフレームを垂直方向に移動
させるエレベータよりなることを特徴とする特許請求の
範囲第4項に記載の真空処理装置。 6、加工片搬送装置は、フレームに設けられ、フレーム
の移動を案内するためのホィールをさらに備えているこ
とを特徴とする特許請求の範囲第5項に記載の真空処理
装置。 7、加工片を真空処理装置に搬入したり搬出したりする
方法において、 加工片を処理し; 処理した加工片を第1室内の第1コンベヤから第2室内
のマルチレバーコンベヤの第1レベルまで搬送し; マルチレバーコンベヤの第2レベルと第1コンベヤとを
整列させ; 初めの未処理加工片を第2レベルから第1コンベヤの上
に搬送し、次いで第1室を第2室に対して密封し; 2番目の未処理加工片を第2室の外側の第2コンベヤか
ら第2レベルに搬送し; 第1レベルと第2コンベヤとを整列させ; 処理した加工片を第1レベルから第2コンベヤまで搬送
し; 第2室を密封する、ことを特徴とする方法。 8、第2コンベヤが密封可能な第3室の中にあり、処理
した各加工片を装置外へ第2コンベヤから搬出し; 各未処理加工片を装置の外側から第3室の中へ第2コン
ベヤ上に搬送し; 第3室を密封しかつ真空引きすることをさらに含むこと
を特徴とする特許請求の範囲第7項に記載の方法。[Claims] 1. A first gate valve that interconnects the first chamber and the second chamber; a second gate valve that allows entry and exit into the second chamber; a second workpiece conveyor on the outside; a workpiece transport device in a second chamber comprising a third workpiece conveyor and a fourth workpiece conveyor supported on a common frame; and a second chamber, and between the second chamber and the second conveyor when the second gate valve is open, the frame and each of the third and fourth conveyors are selected. 1. A vacuum processing apparatus comprising: 2. The vacuum processing apparatus according to claim 1, further comprising a third chamber that can be evacuated, and the second gate valve interconnects the second chamber and the third chamber. 3. The vacuum processing apparatus according to claim 1, wherein the third conveyor and the fourth conveyor are parallel. 4. A vacuum processing apparatus according to claim 3, wherein each conveyor comprises a number of parallel, substantially horizontal rollers and means for rotating the rollers simultaneously. 5. The vacuum processing apparatus according to claim 4, wherein the third conveyor and the fourth conveyor are supported above and below each other, and the conveyor alignment device comprises an elevator that moves the frame in a vertical direction. 6. The vacuum processing apparatus according to claim 5, wherein the workpiece conveyance device further includes a wheel provided on the frame for guiding movement of the frame. 7. A method for carrying workpieces into and out of a vacuum processing device, including processing the workpieces; transporting the processed workpieces from a first conveyor in a first chamber to a first level of a multi-lever conveyor in a second chamber; conveying; aligning the second level of the multi-lever conveyor with the first conveyor; conveying the first unprocessed piece from the second level onto the first conveyor and then the first chamber relative to the second chamber; sealing; transporting the second unprocessed workpiece from the second conveyor outside the second chamber to the second level; aligning the first level and the second conveyor; transporting the processed workpiece from the first level to the second level; A method characterized in that the second chamber is sealed. 8. A second conveyor is in a third sealable chamber, and transports each processed workpiece out of the apparatus from the second conveyor; transports each unprocessed workpiece from outside the apparatus into the third chamber; 8. The method of claim 7, further comprising conveying on two conveyors; sealing and evacuating a third chamber.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69683685A | 1985-01-31 | 1985-01-31 | |
US696836 | 1991-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61206722A true JPS61206722A (en) | 1986-09-13 |
JPH0336735B2 JPH0336735B2 (en) | 1991-06-03 |
Family
ID=24798750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61017685A Granted JPS61206722A (en) | 1985-01-31 | 1986-01-29 | Vacuum treater |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS61206722A (en) |
KR (1) | KR950003597B1 (en) |
AU (1) | AU572375B2 (en) |
CA (1) | CA1307759C (en) |
GB (1) | GB2171119B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005290558A (en) * | 2004-03-31 | 2005-10-20 | Applied Films Gmbh & Co Kg | Lock chamber device for vacuum treatment unit and process for its operation |
CN102152031A (en) * | 2011-01-26 | 2011-08-17 | 阮俊康 | Automatic welding production line of lighter |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4676884A (en) * | 1986-07-23 | 1987-06-30 | The Boc Group, Inc. | Wafer processing machine with evacuated wafer transporting and storage system |
DE3827343A1 (en) * | 1988-08-12 | 1990-02-15 | Leybold Ag | DEVICE ACCORDING TO THE CAROUSEL PRINCIPLE FOR COATING SUBSTRATES |
DE3731444A1 (en) * | 1987-09-18 | 1989-03-30 | Leybold Ag | DEVICE FOR COATING SUBSTRATES |
DE4111384C2 (en) * | 1991-04-09 | 1999-11-04 | Leybold Ag | Device for coating substrates |
US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
US5275709A (en) * | 1991-11-07 | 1994-01-04 | Leybold Aktiengesellschaft | Apparatus for coating substrates, preferably flat, more or less plate-like substrates |
DE4303462C2 (en) * | 1992-03-30 | 1994-03-31 | Leybold Ag | Multi-chamber coating system |
DE19500964A1 (en) * | 1995-01-14 | 1996-07-18 | Leybold Ag | Cathode sputtering appts. for coating flat substrates, esp. optical components |
KR100269097B1 (en) * | 1996-08-05 | 2000-12-01 | 엔도 마코토 | Wafer process apparatus |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
US6235634B1 (en) | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
US6000905A (en) * | 1998-03-13 | 1999-12-14 | Toro-Lira; Guillermo L. | High speed in-vacuum flat panel display handler |
US6213704B1 (en) * | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
US6206176B1 (en) | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6517303B1 (en) | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6217272B1 (en) * | 1998-10-01 | 2001-04-17 | Applied Science And Technology, Inc. | In-line sputter deposition system |
US7241993B2 (en) * | 2000-06-27 | 2007-07-10 | Ebara Corporation | Inspection system by charged particle beam and method of manufacturing devices using the system |
US6821912B2 (en) | 2000-07-27 | 2004-11-23 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6682288B2 (en) | 2000-07-27 | 2004-01-27 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6530733B2 (en) | 2000-07-27 | 2003-03-11 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6855929B2 (en) | 2000-12-01 | 2005-02-15 | Ebara Corporation | Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former |
DE502006004376D1 (en) * | 2006-06-22 | 2009-09-10 | Applied Materials Gmbh & Co Kg | Vacuum coating system |
DE502007004989D1 (en) | 2007-02-09 | 2010-10-21 | Applied Materials Inc | Plant with a transport device for the treatment of substrates |
EP1973154B1 (en) | 2007-03-13 | 2012-04-25 | Applied Materials, Inc. | Device for moving a carrier in a vacuum chamber |
DE102007058052B4 (en) * | 2007-11-30 | 2013-12-05 | Von Ardenne Anlagentechnik Gmbh | Vacuum coating system |
CN111477582A (en) * | 2020-05-28 | 2020-07-31 | 深圳市捷佳伟创新能源装备股份有限公司 | Silicon wafer process cavity, silicon wafer processing equipment and silicon wafer processing method |
CN113584453B (en) * | 2021-07-22 | 2023-01-17 | 深圳天成真空技术有限公司 | Magnetic force driven vacuum coating conveying device and conveying method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3945903A (en) * | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Sputter-coating of glass sheets or other substrates |
US4047624A (en) * | 1975-10-21 | 1977-09-13 | Airco, Inc. | Workpiece handling system for vacuum processing |
US4144960A (en) * | 1977-06-16 | 1979-03-20 | The Allen Group, Inc. | Apparatus and methods for automatically transferring articles from a continuously movable conveyor to a work station |
US4405435A (en) * | 1980-08-27 | 1983-09-20 | Hitachi, Ltd. | Apparatus for performing continuous treatment in vacuum |
-
1986
- 1986-01-21 AU AU52537/86A patent/AU572375B2/en not_active Ceased
- 1986-01-27 GB GB08601905A patent/GB2171119B/en not_active Expired
- 1986-01-29 JP JP61017685A patent/JPS61206722A/en active Granted
- 1986-01-30 CA CA000500743A patent/CA1307759C/en not_active Expired - Lifetime
- 1986-01-30 KR KR1019860000614A patent/KR950003597B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005290558A (en) * | 2004-03-31 | 2005-10-20 | Applied Films Gmbh & Co Kg | Lock chamber device for vacuum treatment unit and process for its operation |
CN102152031A (en) * | 2011-01-26 | 2011-08-17 | 阮俊康 | Automatic welding production line of lighter |
Also Published As
Publication number | Publication date |
---|---|
GB8601905D0 (en) | 1986-03-05 |
AU572375B2 (en) | 1988-05-05 |
AU5253786A (en) | 1986-08-28 |
KR950003597B1 (en) | 1995-04-14 |
GB2171119B (en) | 1989-01-18 |
CA1307759C (en) | 1992-09-22 |
KR860005739A (en) | 1986-08-11 |
GB2171119A (en) | 1986-08-20 |
JPH0336735B2 (en) | 1991-06-03 |
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