JPS63153270A - Mechanism for exchanging substrate in vacuum vessel - Google Patents

Mechanism for exchanging substrate in vacuum vessel

Info

Publication number
JPS63153270A
JPS63153270A JP29835286A JP29835286A JPS63153270A JP S63153270 A JPS63153270 A JP S63153270A JP 29835286 A JP29835286 A JP 29835286A JP 29835286 A JP29835286 A JP 29835286A JP S63153270 A JPS63153270 A JP S63153270A
Authority
JP
Japan
Prior art keywords
substrate
chamber
support
above
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29835286A
Other versions
JPH0660397B2 (en
Inventor
Tomohiko Kaneko
Izumi Nakayama
Hiroyuki Nawa
Akitoshi Suzuki
Original Assignee
Ulvac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Corp filed Critical Ulvac Corp
Priority to JP61298352A priority Critical patent/JPH0660397B2/en
Publication of JPS63153270A publication Critical patent/JPS63153270A/en
Publication of JPH0660397B2 publication Critical patent/JPH0660397B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber

Abstract

PURPOSE:To shorten the waiting time in a reaction chamber and to improve productivity by taking the next substrate into a substrate exchanging chamber during the treatment of a substrate in the CVD reaction chamber and completing vacuum evacuation before the end of said treatment. CONSTITUTION:A substrate 47, 47' support 24 is provided in the substrate 47, 47' exchanging chamber 5 in which a vacuum state is maintained by closing gate valves 10, 11 in both side wall parts and opening a gate valve 6 with a binder chamber 3. The untreated substrate 47 is held imposed in an upper supporting part 58 thereof. The treated substrate 47' is then imposed in the vacuum state to the lower supporting part 59 of the support 24 by the combination of the forward and backward motion of a fork 8 in the above-mentioned chamber 3 and the vertical motion of a driving shaft 24 which moves the support 24 vertically in such a manner that said support can be stopped in prescribed plural positions. The substrate 47 is ejected in this state to the above-mentioned chamber 3 by the fork 8 and thereafter, the above-mentioned valves 10, 11, 6 are opened and closed to maintain the atm. pressure in the chamber 5. The substrate 47' is ejected by a belt 14 to a cassette 15 and the substrate 47 in a cassette 13 is carried into the supporting part 58 by a belt 12, etc. The inside of the chamber 5 is then evacuated and the above-mentioned operations are repeated.
JP61298352A 1986-12-15 1986-12-15 Substrate exchanging device in the vacuum chamber Expired - Lifetime JPH0660397B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61298352A JPH0660397B2 (en) 1986-12-15 1986-12-15 Substrate exchanging device in the vacuum chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61298352A JPH0660397B2 (en) 1986-12-15 1986-12-15 Substrate exchanging device in the vacuum chamber

Publications (2)

Publication Number Publication Date
JPS63153270A true JPS63153270A (en) 1988-06-25
JPH0660397B2 JPH0660397B2 (en) 1994-08-10

Family

ID=17858570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61298352A Expired - Lifetime JPH0660397B2 (en) 1986-12-15 1986-12-15 Substrate exchanging device in the vacuum chamber

Country Status (1)

Country Link
JP (1) JPH0660397B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0475604B1 (en) * 1990-08-29 1998-02-04 Hitachi, Ltd. Vacuum processing apparatus and cleaning method therefor
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39756E1 (en) 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147069U (en) * 1984-08-25 1986-03-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147069U (en) * 1984-08-25 1986-03-29

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634116B2 (en) 1990-08-09 2003-10-21 Hitachi, Ltd. Vacuum processing apparatus
EP0475604B1 (en) * 1990-08-29 1998-02-04 Hitachi, Ltd. Vacuum processing apparatus and cleaning method therefor
US6108929A (en) * 1990-08-29 2000-08-29 Hitachi, Ltd. Vacuum processing apparatus
US6112431A (en) * 1990-08-29 2000-09-05 Hitachi, Ltd. Vacuum processing and operating method
US6263588B1 (en) 1990-08-29 2001-07-24 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301802B1 (en) 1990-08-29 2001-10-16 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301801B1 (en) 1990-08-29 2001-10-16 Shigekazu Kato Vacuum processing apparatus and operating method therefor
US6330755B1 (en) 1990-08-29 2001-12-18 Hitachi, Ltd. Vacuum processing and operating method
US6330756B1 (en) 1990-08-29 2001-12-18 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6332280B2 (en) 1990-08-29 2001-12-25 Hitachi, Ltd. Vacuum processing apparatus
US6446353B2 (en) 1990-08-29 2002-09-10 Hitachi, Ltd. Vacuum processing apparatus
US6457253B2 (en) 1990-08-29 2002-10-01 Hitachi, Ltd. Vacuum processing apparatus
US6460270B2 (en) 1990-08-29 2002-10-08 Hitachi, Ltd. Vacuum processing apparatus
US6463676B1 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6463678B2 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Substrate changing-over mechanism in a vaccum tank
US6467187B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6467186B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Transferring device for a vacuum processing apparatus and operating method therefor
US6470596B2 (en) 1990-08-29 2002-10-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6473989B2 (en) 1990-08-29 2002-11-05 Hitachi, Ltd. Conveying system for a vacuum processing apparatus
US6484415B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6484414B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6487793B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6487791B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus
US6487794B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Substrate changing-over mechanism in vacuum tank
US6490810B2 (en) 1990-08-29 2002-12-10 Hitachi, Ltd. Vacuum processing apparatus
US6499229B2 (en) 1990-08-29 2002-12-31 Hitachi, Ltd. Vacuum processing apparatus
US6505415B2 (en) 1990-08-29 2003-01-14 Hitachi, Ltd. Vacuum processing apparatus
US6588121B2 (en) 1990-08-29 2003-07-08 Hitachi, Ltd. Vacuum processing apparatus
US6625899B2 (en) 1990-08-29 2003-09-30 Hitachi, Ltd. Vacuum processing apparatus
US6070341A (en) * 1990-08-29 2000-06-06 Hitachi, Ltd. Vacuum processing and operating method with wafers, substrates and/or semiconductors
US6655044B2 (en) 1990-08-29 2003-12-02 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6662465B2 (en) 1990-08-29 2003-12-16 Hitachi, Ltd. Vacuum processing apparatus
US6880264B2 (en) 1990-08-29 2005-04-19 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6886272B2 (en) 1990-08-29 2005-05-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6904699B2 (en) 1990-08-29 2005-06-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6968630B2 (en) 1990-08-29 2005-11-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39756E1 (en) 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39775E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39824E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39823E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US7367135B2 (en) 1990-08-29 2008-05-06 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor

Also Published As

Publication number Publication date
JPH0660397B2 (en) 1994-08-10

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