JPH0334912Y2 - - Google Patents

Info

Publication number
JPH0334912Y2
JPH0334912Y2 JP1984035771U JP3577184U JPH0334912Y2 JP H0334912 Y2 JPH0334912 Y2 JP H0334912Y2 JP 1984035771 U JP1984035771 U JP 1984035771U JP 3577184 U JP3577184 U JP 3577184U JP H0334912 Y2 JPH0334912 Y2 JP H0334912Y2
Authority
JP
Japan
Prior art keywords
bed
resin
back surface
conductive layer
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984035771U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60149137U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3577184U priority Critical patent/JPS60149137U/ja
Publication of JPS60149137U publication Critical patent/JPS60149137U/ja
Application granted granted Critical
Publication of JPH0334912Y2 publication Critical patent/JPH0334912Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP3577184U 1984-03-13 1984-03-13 樹脂封止型半導体装置 Granted JPS60149137U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3577184U JPS60149137U (ja) 1984-03-13 1984-03-13 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3577184U JPS60149137U (ja) 1984-03-13 1984-03-13 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS60149137U JPS60149137U (ja) 1985-10-03
JPH0334912Y2 true JPH0334912Y2 (enEXAMPLES) 1991-07-24

Family

ID=30540352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3577184U Granted JPS60149137U (ja) 1984-03-13 1984-03-13 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS60149137U (enEXAMPLES)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2552158Y2 (ja) * 1992-05-08 1997-10-27 株式会社三井ハイテック リードフレーム
JPH06295970A (ja) * 1993-04-08 1994-10-21 Seiko Epson Corp 半導体装置及び半導体装置製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040549Y2 (enEXAMPLES) * 1971-12-07 1975-11-19
JPS563966Y2 (enEXAMPLES) * 1976-07-12 1981-01-28

Also Published As

Publication number Publication date
JPS60149137U (ja) 1985-10-03

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