JPH0325498B2 - - Google Patents

Info

Publication number
JPH0325498B2
JPH0325498B2 JP60058023A JP5802385A JPH0325498B2 JP H0325498 B2 JPH0325498 B2 JP H0325498B2 JP 60058023 A JP60058023 A JP 60058023A JP 5802385 A JP5802385 A JP 5802385A JP H0325498 B2 JPH0325498 B2 JP H0325498B2
Authority
JP
Japan
Prior art keywords
iron
wire
content
corrosion resistance
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60058023A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61216355A (ja
Inventor
Yasuo Fukui
Shinji Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60058023A priority Critical patent/JPS61216355A/ja
Publication of JPS61216355A publication Critical patent/JPS61216355A/ja
Publication of JPH0325498B2 publication Critical patent/JPH0325498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07533—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP60058023A 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線 Granted JPS61216355A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60058023A JPS61216355A (ja) 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60058023A JPS61216355A (ja) 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS61216355A JPS61216355A (ja) 1986-09-26
JPH0325498B2 true JPH0325498B2 (cg-RX-API-DMAC10.html) 1991-04-08

Family

ID=13072354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60058023A Granted JPS61216355A (ja) 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS61216355A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2715556B2 (ja) * 1989-06-16 1998-02-18 松下電器産業株式会社 液晶デバイスの接合方法
CN121023316B (zh) * 2025-10-28 2026-01-13 烟台一诺电子材料有限公司 一种集成电路封装用键合铝丝及其制备方法

Also Published As

Publication number Publication date
JPS61216355A (ja) 1986-09-26

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