JPS61216355A - 半導体素子のボンデイング用Ａｌ線 - Google Patents

半導体素子のボンデイング用Ａｌ線

Info

Publication number
JPS61216355A
JPS61216355A JP60058023A JP5802385A JPS61216355A JP S61216355 A JPS61216355 A JP S61216355A JP 60058023 A JP60058023 A JP 60058023A JP 5802385 A JP5802385 A JP 5802385A JP S61216355 A JPS61216355 A JP S61216355A
Authority
JP
Japan
Prior art keywords
iron
nickel
corrosion resistance
wire
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60058023A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325498B2 (cg-RX-API-DMAC10.html
Inventor
Yasuo Fukui
福井　康夫
Shinji Shirakawa
白川　信次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60058023A priority Critical patent/JPS61216355A/ja
Publication of JPS61216355A publication Critical patent/JPS61216355A/ja
Publication of JPH0325498B2 publication Critical patent/JPH0325498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07533—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP60058023A 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線 Granted JPS61216355A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60058023A JPS61216355A (ja) 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60058023A JPS61216355A (ja) 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS61216355A true JPS61216355A (ja) 1986-09-26
JPH0325498B2 JPH0325498B2 (cg-RX-API-DMAC10.html) 1991-04-08

Family

ID=13072354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60058023A Granted JPS61216355A (ja) 1985-03-20 1985-03-20 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS61216355A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320054A (ja) * 1989-06-16 1991-01-29 Matsushita Electric Ind Co Ltd 液晶デバイスの接合方法
CN121023316A (zh) * 2025-10-28 2025-11-28 烟台一诺电子材料有限公司 一种集成电路封装用键合铝丝及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320054A (ja) * 1989-06-16 1991-01-29 Matsushita Electric Ind Co Ltd 液晶デバイスの接合方法
CN121023316A (zh) * 2025-10-28 2025-11-28 烟台一诺电子材料有限公司 一种集成电路封装用键合铝丝及其制备方法

Also Published As

Publication number Publication date
JPH0325498B2 (cg-RX-API-DMAC10.html) 1991-04-08

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