JPS6222448B2 - - Google Patents

Info

Publication number
JPS6222448B2
JPS6222448B2 JP54090126A JP9012679A JPS6222448B2 JP S6222448 B2 JPS6222448 B2 JP S6222448B2 JP 54090126 A JP54090126 A JP 54090126A JP 9012679 A JP9012679 A JP 9012679A JP S6222448 B2 JPS6222448 B2 JP S6222448B2
Authority
JP
Japan
Prior art keywords
high purity
contained
alloy
breaking strength
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54090126A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5613740A (en
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP9012679A priority Critical patent/JPS5613740A/ja
Publication of JPS5613740A publication Critical patent/JPS5613740A/ja
Publication of JPS6222448B2 publication Critical patent/JPS6222448B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP9012679A 1979-07-16 1979-07-16 Bonding wire for semiconductor element Granted JPS5613740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9012679A JPS5613740A (en) 1979-07-16 1979-07-16 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9012679A JPS5613740A (en) 1979-07-16 1979-07-16 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5613740A JPS5613740A (en) 1981-02-10
JPS6222448B2 true JPS6222448B2 (cg-RX-API-DMAC10.html) 1987-05-18

Family

ID=13989804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9012679A Granted JPS5613740A (en) 1979-07-16 1979-07-16 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5613740A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
KR100426939B1 (ko) * 1995-06-19 2004-07-19 피가로 기켄 가부시키가이샤 가스센서
AT407830B (de) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh Hochgoldhaltige, gelbe dentallegierung
JP5010495B2 (ja) * 2007-02-06 2012-08-29 新日鉄マテリアルズ株式会社 半導体素子接続用金線

Also Published As

Publication number Publication date
JPS5613740A (en) 1981-02-10

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