JPS6222451B2 - - Google Patents
Info
- Publication number
- JPS6222451B2 JPS6222451B2 JP54094743A JP9474379A JPS6222451B2 JP S6222451 B2 JPS6222451 B2 JP S6222451B2 JP 54094743 A JP54094743 A JP 54094743A JP 9474379 A JP9474379 A JP 9474379A JP S6222451 B2 JPS6222451 B2 JP S6222451B2
- Authority
- JP
- Japan
- Prior art keywords
- strength
- purity
- bonding wire
- bonding
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/50—
-
- H10W72/5522—
-
- H10W72/59—
-
- H10W72/952—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9474379A JPS5619629A (en) | 1979-07-25 | 1979-07-25 | Bonding wire for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9474379A JPS5619629A (en) | 1979-07-25 | 1979-07-25 | Bonding wire for semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5619629A JPS5619629A (en) | 1981-02-24 |
| JPS6222451B2 true JPS6222451B2 (cg-RX-API-DMAC10.html) | 1987-05-18 |
Family
ID=14118597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9474379A Granted JPS5619629A (en) | 1979-07-25 | 1979-07-25 | Bonding wire for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5619629A (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2116208B (en) * | 1981-12-04 | 1985-12-04 | Mitsubishi Metal Corp | Fine gold alloy wire for bonding of a semiconductor device |
| US4775512A (en) * | 1985-10-01 | 1988-10-04 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold line for bonding semiconductor element |
| JPH01146336A (ja) * | 1987-12-03 | 1989-06-08 | Mitsubishi Metal Corp | 半導体素子ボンディング用Ａｕ合金極細線 |
| DE69009814T2 (de) * | 1989-03-24 | 1994-11-17 | Mitsubishi Materials Corp | Silberlegierungsblatt zur Verbindung von Sonnenzellen. |
| US6139652A (en) * | 1997-01-23 | 2000-10-31 | Stern-Leach | Tarnish-resistant hardenable fine silver alloys |
| JP2007142271A (ja) * | 2005-11-21 | 2007-06-07 | Tanaka Electronics Ind Co Ltd | バンプ材料および接合構造 |
-
1979
- 1979-07-25 JP JP9474379A patent/JPS5619629A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5619629A (en) | 1981-02-24 |
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