JPS6223455B2 - - Google Patents
Info
- Publication number
- JPS6223455B2 JPS6223455B2 JP54124949A JP12494979A JPS6223455B2 JP S6223455 B2 JPS6223455 B2 JP S6223455B2 JP 54124949 A JP54124949 A JP 54124949A JP 12494979 A JP12494979 A JP 12494979A JP S6223455 B2 JPS6223455 B2 JP S6223455B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- purity
- strength
- bonding wire
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/50—
-
- H10W72/5522—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12494979A JPS5649535A (en) | 1979-09-28 | 1979-09-28 | Bonding wire for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12494979A JPS5649535A (en) | 1979-09-28 | 1979-09-28 | Bonding wire for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5649535A JPS5649535A (en) | 1981-05-06 |
| JPS6223455B2 true JPS6223455B2 (cg-RX-API-DMAC10.html) | 1987-05-22 |
Family
ID=14898186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12494979A Granted JPS5649535A (en) | 1979-09-28 | 1979-09-28 | Bonding wire for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5649535A (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4628149A (en) * | 1981-11-30 | 1986-12-09 | Nippon Electric Co., Ltd. | Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals |
| GB2116208B (en) * | 1981-12-04 | 1985-12-04 | Mitsubishi Metal Corp | Fine gold alloy wire for bonding of a semiconductor device |
| JP2737953B2 (ja) * | 1988-09-29 | 1998-04-08 | 三菱マテリアル株式会社 | 金バンプ用金合金細線 |
| US5298219A (en) * | 1990-06-04 | 1994-03-29 | Tanaka Denshi Kogyo Kabushiki Kaisha | High purity gold bonding wire for semiconductor device |
| JP3328135B2 (ja) * | 1996-05-28 | 2002-09-24 | 田中電子工業株式会社 | バンプ形成用金合金線及びバンプ形成方法 |
| JPH10233408A (ja) * | 1997-02-21 | 1998-09-02 | Nec Corp | 金属接合構造及び半導体装置 |
-
1979
- 1979-09-28 JP JP12494979A patent/JPS5649535A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5649535A (en) | 1981-05-06 |
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