JPH0425337B2 - - Google Patents

Info

Publication number
JPH0425337B2
JPH0425337B2 JP59204345A JP20434584A JPH0425337B2 JP H0425337 B2 JPH0425337 B2 JP H0425337B2 JP 59204345 A JP59204345 A JP 59204345A JP 20434584 A JP20434584 A JP 20434584A JP H0425337 B2 JPH0425337 B2 JP H0425337B2
Authority
JP
Japan
Prior art keywords
wire
weight
bonding
ball
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59204345A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6184346A (ja
Inventor
Hideto Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP59204345A priority Critical patent/JPS6184346A/ja
Publication of JPS6184346A publication Critical patent/JPS6184346A/ja
Publication of JPH0425337B2 publication Critical patent/JPH0425337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP59204345A 1984-09-28 1984-09-28 ボンデイングワイヤ− Granted JPS6184346A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59204345A JPS6184346A (ja) 1984-09-28 1984-09-28 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59204345A JPS6184346A (ja) 1984-09-28 1984-09-28 ボンデイングワイヤ−

Publications (2)

Publication Number Publication Date
JPS6184346A JPS6184346A (ja) 1986-04-28
JPH0425337B2 true JPH0425337B2 (cg-RX-API-DMAC10.html) 1992-04-30

Family

ID=16488964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59204345A Granted JPS6184346A (ja) 1984-09-28 1984-09-28 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6184346A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5166738B2 (ja) * 2006-03-24 2013-03-21 新日鉄住金マテリアルズ株式会社 半導体素子接続用金線

Also Published As

Publication number Publication date
JPS6184346A (ja) 1986-04-28

Similar Documents

Publication Publication Date Title
US5538685A (en) Palladium bonding wire for semiconductor device
JPS62278241A (ja) ボンデイングワイヤ
JPH0379416B2 (cg-RX-API-DMAC10.html)
JPH0425336B2 (cg-RX-API-DMAC10.html)
US5989364A (en) Gold-alloy bonding wire
JP3579493B2 (ja) 半導体素子用金合金細線
JPH0425337B2 (cg-RX-API-DMAC10.html)
JPS6223455B2 (cg-RX-API-DMAC10.html)
JPS6223454B2 (cg-RX-API-DMAC10.html)
US5491034A (en) Bonding wire for semiconductor element
JPS6222451B2 (cg-RX-API-DMAC10.html)
JP2745065B2 (ja) 半導体素子用ボンディングワイヤ
JPH07335686A (ja) ボンディング用金合金細線
JPH02250934A (ja) 半導体素子ボンディング用Ａｕ合金極細線
JP2766706B2 (ja) ボンデイングワイヤー
JPS61110735A (ja) 耐熱性に優れた金合金
JP3028458B2 (ja) 半導体素子用金合金線
JP3571793B2 (ja) 金合金細線および金合金バンプ
JPH0131691B2 (cg-RX-API-DMAC10.html)
JPH04146630A (ja) ボンデイングワイヤー
JP3615901B2 (ja) 半導体素子ボンディング用金合金線
JPH07305126A (ja) ボンディング用金合金線
JP2766701B2 (ja) ボンデイングワイヤー
JPH0479243A (ja) 半導体素子用ボンディング線
JPH0479241A (ja) 半導体素子用ボンディング線

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees