JPS6184346A - ボンデイングワイヤ− - Google Patents
ボンデイングワイヤ−Info
- Publication number
- JPS6184346A JPS6184346A JP59204345A JP20434584A JPS6184346A JP S6184346 A JPS6184346 A JP S6184346A JP 59204345 A JP59204345 A JP 59204345A JP 20434584 A JP20434584 A JP 20434584A JP S6184346 A JPS6184346 A JP S6184346A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- weight
- bonding
- ball
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/5522—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59204345A JPS6184346A (ja) | 1984-09-28 | 1984-09-28 | ボンデイングワイヤ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59204345A JPS6184346A (ja) | 1984-09-28 | 1984-09-28 | ボンデイングワイヤ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6184346A true JPS6184346A (ja) | 1986-04-28 |
| JPH0425337B2 JPH0425337B2 (cg-RX-API-DMAC10.html) | 1992-04-30 |
Family
ID=16488964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59204345A Granted JPS6184346A (ja) | 1984-09-28 | 1984-09-28 | ボンデイングワイヤ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6184346A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007284787A (ja) * | 2006-03-24 | 2007-11-01 | Nippon Steel Materials Co Ltd | 半導体素子接続用金線 |
-
1984
- 1984-09-28 JP JP59204345A patent/JPS6184346A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007284787A (ja) * | 2006-03-24 | 2007-11-01 | Nippon Steel Materials Co Ltd | 半導体素子接続用金線 |
| US8415797B2 (en) | 2006-03-24 | 2013-04-09 | Nippon Steel & Sumikin Materials Co., Ltd. | Gold wire for semiconductor element connection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0425337B2 (cg-RX-API-DMAC10.html) | 1992-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |