JPS5649535A - Bonding wire for semiconductor device - Google Patents

Bonding wire for semiconductor device

Info

Publication number
JPS5649535A
JPS5649535A JP12494979A JP12494979A JPS5649535A JP S5649535 A JPS5649535 A JP S5649535A JP 12494979 A JP12494979 A JP 12494979A JP 12494979 A JP12494979 A JP 12494979A JP S5649535 A JPS5649535 A JP S5649535A
Authority
JP
Japan
Prior art keywords
bonding
semiconductor device
purity
bonding wire
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12494979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6223455B2 (cg-RX-API-DMAC10.html
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP12494979A priority Critical patent/JPS5649535A/ja
Publication of JPS5649535A publication Critical patent/JPS5649535A/ja
Publication of JPS6223455B2 publication Critical patent/JPS6223455B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP12494979A 1979-09-28 1979-09-28 Bonding wire for semiconductor device Granted JPS5649535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12494979A JPS5649535A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12494979A JPS5649535A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5649535A true JPS5649535A (en) 1981-05-06
JPS6223455B2 JPS6223455B2 (cg-RX-API-DMAC10.html) 1987-05-22

Family

ID=14898186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12494979A Granted JPS5649535A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5649535A (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628149A (en) * 1981-11-30 1986-12-09 Nippon Electric Co., Ltd. Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
JPH0291944A (ja) * 1988-09-29 1990-03-30 Mitsubishi Metal Corp 金バンプ用金合金細線
US5538685A (en) * 1990-06-04 1996-07-23 Tanaka Denshi Kogyo Kabushiki Kaisha Palladium bonding wire for semiconductor device
US6011305A (en) * 1997-02-21 2000-01-04 Nec Corporation Semiconductor device having metal alloy for electrodes
US6159420A (en) * 1996-05-28 2000-12-12 Tanaka Denshi Kogyo K.K. Gold alloy wire and method for making a bump

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628149A (en) * 1981-11-30 1986-12-09 Nippon Electric Co., Ltd. Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
US5071619A (en) * 1981-12-04 1991-12-10 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semiconductor device
JPH0291944A (ja) * 1988-09-29 1990-03-30 Mitsubishi Metal Corp 金バンプ用金合金細線
US5538685A (en) * 1990-06-04 1996-07-23 Tanaka Denshi Kogyo Kabushiki Kaisha Palladium bonding wire for semiconductor device
US6159420A (en) * 1996-05-28 2000-12-12 Tanaka Denshi Kogyo K.K. Gold alloy wire and method for making a bump
US6011305A (en) * 1997-02-21 2000-01-04 Nec Corporation Semiconductor device having metal alloy for electrodes

Also Published As

Publication number Publication date
JPS6223455B2 (cg-RX-API-DMAC10.html) 1987-05-22

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