JPS5613740A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPS5613740A
JPS5613740A JP9012679A JP9012679A JPS5613740A JP S5613740 A JPS5613740 A JP S5613740A JP 9012679 A JP9012679 A JP 9012679A JP 9012679 A JP9012679 A JP 9012679A JP S5613740 A JPS5613740 A JP S5613740A
Authority
JP
Japan
Prior art keywords
contained
high purity
alloy
elements
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9012679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222448B2 (cg-RX-API-DMAC10.html
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP9012679A priority Critical patent/JPS5613740A/ja
Publication of JPS5613740A publication Critical patent/JPS5613740A/ja
Publication of JPS6222448B2 publication Critical patent/JPS6222448B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP9012679A 1979-07-16 1979-07-16 Bonding wire for semiconductor element Granted JPS5613740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9012679A JPS5613740A (en) 1979-07-16 1979-07-16 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9012679A JPS5613740A (en) 1979-07-16 1979-07-16 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5613740A true JPS5613740A (en) 1981-02-10
JPS6222448B2 JPS6222448B2 (cg-RX-API-DMAC10.html) 1987-05-18

Family

ID=13989804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9012679A Granted JPS5613740A (en) 1979-07-16 1979-07-16 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5613740A (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
AT407830B (de) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh Hochgoldhaltige, gelbe dentallegierung
JP2008218994A (ja) * 2007-02-06 2008-09-18 Nippon Steel Materials Co Ltd 半導体素子接続用金線
DE19611964B4 (de) * 1995-06-19 2009-01-22 Figaro Engineering Inc., Minoo Gasmeßfühler

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
US5071619A (en) * 1981-12-04 1991-12-10 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semiconductor device
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
DE19611964B4 (de) * 1995-06-19 2009-01-22 Figaro Engineering Inc., Minoo Gasmeßfühler
AT407830B (de) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh Hochgoldhaltige, gelbe dentallegierung
JP2008218994A (ja) * 2007-02-06 2008-09-18 Nippon Steel Materials Co Ltd 半導体素子接続用金線

Also Published As

Publication number Publication date
JPS6222448B2 (cg-RX-API-DMAC10.html) 1987-05-18

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