JPS6487736A - Material for silver extra thin wire - Google Patents

Material for silver extra thin wire

Info

Publication number
JPS6487736A
JPS6487736A JP62245255A JP24525587A JPS6487736A JP S6487736 A JPS6487736 A JP S6487736A JP 62245255 A JP62245255 A JP 62245255A JP 24525587 A JP24525587 A JP 24525587A JP S6487736 A JPS6487736 A JP S6487736A
Authority
JP
Japan
Prior art keywords
silver
thin wire
obtd
extra thin
excellent mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62245255A
Other languages
Japanese (ja)
Inventor
Yukihiro Murakishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP62245255A priority Critical patent/JPS6487736A/en
Publication of JPS6487736A publication Critical patent/JPS6487736A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To obtain the titled material having excellent mechanical characte ristics by adding specific amounts of Cu, Al, Y, Ni, Co, Ti, W, Si, Zr, Ca, Pd, Rh, Ru, Ir, Au, Pt, Os, etc., to Ag. CONSTITUTION:Total 500-3,000wt. ppm of at least one kind among Cu, Al, Y, Ni, Co, Ti, W, Si, Zr, Ca, Pd, Rh, Ru, Ir, Au, Pt and Os is added to Ag. By this method, the titled material having high tensile strength and excellent mechanical characteristics in which crystal structure is fined and wire cutting is not generated during wire drawing can be obtd. A silver extra fine wire for sensors and medical instruments can be obtd. without lowering the purity of silver too much by using said material.
JP62245255A 1987-09-29 1987-09-29 Material for silver extra thin wire Pending JPS6487736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62245255A JPS6487736A (en) 1987-09-29 1987-09-29 Material for silver extra thin wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62245255A JPS6487736A (en) 1987-09-29 1987-09-29 Material for silver extra thin wire

Publications (1)

Publication Number Publication Date
JPS6487736A true JPS6487736A (en) 1989-03-31

Family

ID=17130958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62245255A Pending JPS6487736A (en) 1987-09-29 1987-09-29 Material for silver extra thin wire

Country Status (1)

Country Link
JP (1) JPS6487736A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01108330A (en) * 1987-10-22 1989-04-25 Tokuriki Honten Co Ltd Hard ag alloy
US5374873A (en) * 1991-06-14 1994-12-20 Kabushiki Kaisha Toshiba Gyrotron apparatus having vibration absorbing means
JP2010167490A (en) * 2009-01-23 2010-08-05 Junde Li Method for producing alloy wire and product of the alloy wire
JP2014053610A (en) * 2012-09-04 2014-03-20 Heraeus Materials Technology Gmbh & Co Kg Silver alloy wire for bonding application
JP5507730B1 (en) * 2013-04-02 2014-05-28 田中電子工業株式会社 Noble metal dilute silver alloy wire for ball bonding

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129119A (en) * 1977-04-18 1978-11-10 Tanaka Precious Metal Ind Silver alloy ornament
JPS60162741A (en) * 1984-01-31 1985-08-24 Sumitomo Metal Mining Co Ltd Bonding wire

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129119A (en) * 1977-04-18 1978-11-10 Tanaka Precious Metal Ind Silver alloy ornament
JPS60162741A (en) * 1984-01-31 1985-08-24 Sumitomo Metal Mining Co Ltd Bonding wire

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01108330A (en) * 1987-10-22 1989-04-25 Tokuriki Honten Co Ltd Hard ag alloy
US5374873A (en) * 1991-06-14 1994-12-20 Kabushiki Kaisha Toshiba Gyrotron apparatus having vibration absorbing means
JP2010167490A (en) * 2009-01-23 2010-08-05 Junde Li Method for producing alloy wire and product of the alloy wire
JP2014053610A (en) * 2012-09-04 2014-03-20 Heraeus Materials Technology Gmbh & Co Kg Silver alloy wire for bonding application
JP5507730B1 (en) * 2013-04-02 2014-05-28 田中電子工業株式会社 Noble metal dilute silver alloy wire for ball bonding

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