JPS6487734A - Material for gold extra fine wire - Google Patents

Material for gold extra fine wire

Info

Publication number
JPS6487734A
JPS6487734A JP62245254A JP24525487A JPS6487734A JP S6487734 A JPS6487734 A JP S6487734A JP 62245254 A JP62245254 A JP 62245254A JP 24525487 A JP24525487 A JP 24525487A JP S6487734 A JPS6487734 A JP S6487734A
Authority
JP
Japan
Prior art keywords
fine wire
extra fine
wire
obtd
excellent mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62245254A
Other languages
Japanese (ja)
Other versions
JP2613224B2 (en
Inventor
Yukihiro Murakishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP62245254A priority Critical patent/JP2613224B2/en
Publication of JPS6487734A publication Critical patent/JPS6487734A/en
Application granted granted Critical
Publication of JP2613224B2 publication Critical patent/JP2613224B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01044—Ruthenium [Ru]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

PURPOSE:To obtain the titled material having no wire cutting and having excellent mechanical characteristics by adding specific amounts of Cu, Al, Y, Ni, Co, Ti, W, Si, Zr, Ca, Pd, Ru, Ir, Pt, Ag, Os, etc., to Au. CONSTITUTION:Total 500-3,000wt. ppm of at least one kind among Cu, Al, Y, Ni, Co, Ti, W, Si, Zr, Ca, Pd, Ru, Ir, Pt, Ag and Os to Al. By this method, the titled material having high tensile strength and elongation and having excellent mechanical characteristics in which wire cutting is not generated during wire drawing can be obtd. A metallic fine wire for various sensors and medical instruments, etc., can be obtd.
JP62245254A 1987-09-29 1987-09-29 Gold fine wire material Expired - Lifetime JP2613224B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62245254A JP2613224B2 (en) 1987-09-29 1987-09-29 Gold fine wire material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62245254A JP2613224B2 (en) 1987-09-29 1987-09-29 Gold fine wire material

Publications (2)

Publication Number Publication Date
JPS6487734A true JPS6487734A (en) 1989-03-31
JP2613224B2 JP2613224B2 (en) 1997-05-21

Family

ID=17130944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62245254A Expired - Lifetime JP2613224B2 (en) 1987-09-29 1987-09-29 Gold fine wire material

Country Status (1)

Country Link
JP (1) JP2613224B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205641A (en) * 1989-01-31 1990-08-15 Tatsuta Electric Wire & Cable Co Ltd Gold alloy thin wire for bonding
JPH03264628A (en) * 1990-03-13 1991-11-25 Nippon Steel Corp Bonding wire for semiconductor device
JPH0436430A (en) * 1990-05-31 1992-02-06 Sumitomo Metal Mining Co Ltd Bonding wire
WO1995007367A1 (en) * 1993-09-06 1995-03-16 Mitsubishi Materials Corporation Golden ornament material hardened by alloying with minor components
DE19753055A1 (en) * 1997-11-29 1999-06-10 Heraeus Gmbh W C Ultra-fine bonding wire of a gold alloy containing platinum and/or palladium
AT407830B (en) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh HIGH GOLDEN YELLOW DENTAL ALLOY
WO2008132919A1 (en) * 2007-04-17 2008-11-06 Tanaka Denshi Kogyo K.K. Highly reliable gold alloy bonding wire and semiconductor device
DE112011100491T5 (en) 2011-06-10 2013-06-13 Tanaka Denshi Kogyo K.K. Bonding wire made of Au alloy with high strength and high elongation rate
CN114207165A (en) * 2019-09-26 2022-03-18 田中贵金属工业株式会社 Medical Au-Pt-Pd alloy

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816041A (en) * 1981-07-17 1983-01-29 Mitsubishi Metal Corp High-tensile fine au alloy wire
JPS6179741A (en) * 1984-09-27 1986-04-23 Sumitomo Metal Mining Co Ltd Bonding wire
JPS61110735A (en) * 1984-10-31 1986-05-29 Tatsuta Electric Wire & Cable Co Ltd Cold alloy having superior heat resistance
JPS61163226A (en) * 1985-01-09 1986-07-23 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor device
JPS62228440A (en) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk Gold wire for semiconductor device bonding
JPS63145729A (en) * 1986-03-28 1988-06-17 Nittetsu Micro Metal:Kk Gold wire for bonding semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816041A (en) * 1981-07-17 1983-01-29 Mitsubishi Metal Corp High-tensile fine au alloy wire
JPS6179741A (en) * 1984-09-27 1986-04-23 Sumitomo Metal Mining Co Ltd Bonding wire
JPS61110735A (en) * 1984-10-31 1986-05-29 Tatsuta Electric Wire & Cable Co Ltd Cold alloy having superior heat resistance
JPS61163226A (en) * 1985-01-09 1986-07-23 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor device
JPS62228440A (en) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk Gold wire for semiconductor device bonding
JPS63145729A (en) * 1986-03-28 1988-06-17 Nittetsu Micro Metal:Kk Gold wire for bonding semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205641A (en) * 1989-01-31 1990-08-15 Tatsuta Electric Wire & Cable Co Ltd Gold alloy thin wire for bonding
JPH03264628A (en) * 1990-03-13 1991-11-25 Nippon Steel Corp Bonding wire for semiconductor device
JPH0436430A (en) * 1990-05-31 1992-02-06 Sumitomo Metal Mining Co Ltd Bonding wire
WO1995007367A1 (en) * 1993-09-06 1995-03-16 Mitsubishi Materials Corporation Golden ornament material hardened by alloying with minor components
DE19753055A1 (en) * 1997-11-29 1999-06-10 Heraeus Gmbh W C Ultra-fine bonding wire of a gold alloy containing platinum and/or palladium
DE19753055B4 (en) * 1997-11-29 2005-09-15 W.C. Heraeus Gmbh Fine wire of a gold alloy, process for its preparation and its use
AT407830B (en) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh HIGH GOLDEN YELLOW DENTAL ALLOY
WO2008132919A1 (en) * 2007-04-17 2008-11-06 Tanaka Denshi Kogyo K.K. Highly reliable gold alloy bonding wire and semiconductor device
DE112011100491T5 (en) 2011-06-10 2013-06-13 Tanaka Denshi Kogyo K.K. Bonding wire made of Au alloy with high strength and high elongation rate
CN114207165A (en) * 2019-09-26 2022-03-18 田中贵金属工业株式会社 Medical Au-Pt-Pd alloy

Also Published As

Publication number Publication date
JP2613224B2 (en) 1997-05-21

Similar Documents

Publication Publication Date Title
JPS6487734A (en) Material for gold extra fine wire
EP0354696A3 (en) Semiconductor device assembly comprising a lead frame structure
SG77142A1 (en) Gold alloy wire for wedge bonding and use thereof in wedge bonding
JPS6439335A (en) Material for pure platinum extra fine wire
JPS6487736A (en) Material for silver extra thin wire
JPS6487735A (en) Material for palladium extra thin wire
GB1519578A (en) Low intrinsic value alloys
JPS5621354A (en) Bonding wire for semiconductor element
JPS5676556A (en) Bonding gold wire for semiconductor element
AU5036690A (en) Palladium alloy containing gold, silver, gallium, germanium and/or lithium and dental restorations utilizing same
JPS5613740A (en) Bonding wire for semiconductor element
Serkowski Al sub 2 O sub 3/Nickel Laminar Composites
DE59009704D1 (en) High gold alloy for jewelry purposes.
GB2229859A (en) Roll surface cutting method
EP0327805A3 (en) Dental filling material and process for its preparation
Doc et al. DOC L
DE2620733B1 (en) USE OF COPPER BASED ALLOYS FOR DENTAL TECHNICAL PURPOSES
Khachin et al. Special elastic properties of B 2 titanium compounds with an unstable lattice(Osobye uprugie svoistva B 2-soedinenii titana s nestabil'noi reshetkoi)
Piippo On the asexual reproduction of Plagiochila pluma Steph.
Shevchenko et al. The Stress--Strain Condition of Small Components During the Formation of Welded Joints
Bacinschi et al. The Determination of the Technological Factors Which Influence the Precious Metal Losses When Obtaining PtRh Thin Wires
Sun et al. Stabilization Mechanism of Thermoelastic Martensite in Cu-Zn-Al Alloy
Susz Eighteen Carat White Gold Alloys
JPS5696844A (en) Semiconductor element
Bazelyuk Changes in the Creep Properties of the(Aluminum) Alloy AK 4-1 Resulting From a Prior Thermal Ultrasonic Treatment