JPH0471975B2 - - Google Patents

Info

Publication number
JPH0471975B2
JPH0471975B2 JP62075731A JP7573187A JPH0471975B2 JP H0471975 B2 JPH0471975 B2 JP H0471975B2 JP 62075731 A JP62075731 A JP 62075731A JP 7573187 A JP7573187 A JP 7573187A JP H0471975 B2 JPH0471975 B2 JP H0471975B2
Authority
JP
Japan
Prior art keywords
weight
bonding
wire
unavoidable impurities
total
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62075731A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63145729A (ja
Inventor
Hideo Taneda
Kazuaki Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUTETSU MAIKURO METARU KK
Original Assignee
NITSUTETSU MAIKURO METARU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUTETSU MAIKURO METARU KK filed Critical NITSUTETSU MAIKURO METARU KK
Publication of JPS63145729A publication Critical patent/JPS63145729A/ja
Publication of JPH0471975B2 publication Critical patent/JPH0471975B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP62075731A 1986-03-28 1987-03-28 半導体素子ボンデイング用金線 Granted JPS63145729A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-70088 1986-03-28
JP7008886 1986-03-28

Publications (2)

Publication Number Publication Date
JPS63145729A JPS63145729A (ja) 1988-06-17
JPH0471975B2 true JPH0471975B2 (cg-RX-API-DMAC10.html) 1992-11-17

Family

ID=13421434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62075731A Granted JPS63145729A (ja) 1986-03-28 1987-03-28 半導体素子ボンデイング用金線

Country Status (1)

Country Link
JP (1) JPS63145729A (cg-RX-API-DMAC10.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613224B2 (ja) * 1987-09-29 1997-05-21 田中貴金属工業株式会社 金極細線用材料
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
JP2778093B2 (ja) * 1988-09-29 1998-07-23 三菱マテリアル株式会社 金バンプ用金合金細線
JPH02205641A (ja) * 1989-01-31 1990-08-15 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
JP2773202B2 (ja) * 1989-03-24 1998-07-09 三菱マテリアル株式会社 半導体素子ボンディング用Ａｕ合金極細線
JPH0339429A (ja) * 1989-07-07 1991-02-20 Tanaka Denshi Kogyo Kk 半導体素子のボンディング用金線
JPH04304335A (ja) * 1991-03-30 1992-10-27 Mitsubishi Materials Corp 貴金属カード用純金箔材
US5658664A (en) * 1993-04-08 1997-08-19 Nippon Steel Corporation Thin gold-alloy wire for semiconductor device
CN1038433C (zh) * 1993-04-08 1998-05-20 新日本制铁株式会社 半导体元件用金合金细线
JP2922388B2 (ja) * 1993-04-22 1999-07-19 新日本製鐵株式会社 ボンディング用金合金細線
JP3328135B2 (ja) * 1996-05-28 2002-09-24 田中電子工業株式会社 バンプ形成用金合金線及びバンプ形成方法
DE19753055B4 (de) * 1997-11-29 2005-09-15 W.C. Heraeus Gmbh Feinstdraht aus einer Gold-Legierung, Verfahren zu seiner Herstellung und seine Verwendung
KR100259210B1 (ko) * 1998-01-14 2000-06-15 이재호 순금색을 유지하면서 고강도를 갖는 장식재용 금합금
JP4713149B2 (ja) * 2004-12-28 2011-06-29 田中電子工業株式会社 半導体装置
JP5010495B2 (ja) * 2007-02-06 2012-08-29 新日鉄マテリアルズ株式会社 半導体素子接続用金線
JP4150752B1 (ja) * 2007-11-06 2008-09-17 田中電子工業株式会社 ボンディングワイヤ
EP2476583B1 (en) 2009-09-09 2014-07-23 Honda Motor Co., Ltd. Vehicle seat stowing device
CN102214630A (zh) * 2011-05-18 2011-10-12 苏州衡业新材料科技有限公司 银基微合金键合丝及其制备方法
EP3656245B1 (fr) * 2018-11-26 2022-04-06 Richemont International S.A. Alliage d'or comprenant au moins 990 pour mille en poids d'or, article d'horlogerie ou de joaillerie a base d'un alliage d'or comprenant au moins 990 pour mille en poids d'or, et procédé de fabrication dudit alliage
CN112226642B (zh) * 2020-09-18 2022-03-11 国金黄金股份有限公司 贵金属金材料及其制备方法、金器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61110735A (ja) * 1984-10-31 1986-05-29 Tatsuta Electric Wire & Cable Co Ltd 耐熱性に優れた金合金

Also Published As

Publication number Publication date
JPS63145729A (ja) 1988-06-17

Similar Documents

Publication Publication Date Title
JPH0471975B2 (cg-RX-API-DMAC10.html)
JPS6360105B2 (cg-RX-API-DMAC10.html)
JPH0547608B2 (cg-RX-API-DMAC10.html)
JPH0674479B2 (ja) リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JPH0212022B2 (cg-RX-API-DMAC10.html)
US5989364A (en) Gold-alloy bonding wire
JPS63211731A (ja) ボンデイング線
JPH0726167B2 (ja) 半導体装置のボンデイングワイヤ用Ａｕ合金極細線
JPH10172998A (ja) Ａｕボンディングワイヤー
JPH0555580B2 (cg-RX-API-DMAC10.html)
JPH03257129A (ja) 半導体装置のボンディング用金合金線
JPH0245336B2 (cg-RX-API-DMAC10.html)
JPS63949B2 (cg-RX-API-DMAC10.html)
JPH04184946A (ja) 半導体装置用銅合金極細線及び半導体装置
JPS6322062B2 (cg-RX-API-DMAC10.html)
JPS631749B2 (cg-RX-API-DMAC10.html)
KR101072506B1 (ko) 반도체 소자용 본딩 와이어
JP2779683B2 (ja) 半導体素子用ボンディングワイヤ
JPS6222448B2 (cg-RX-API-DMAC10.html)
JP2773202B2 (ja) 半導体素子ボンディング用Ａｕ合金極細線
JPH0717982B2 (ja) リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JP2661247B2 (ja) 半導体素子ボンディング用金合金細線
JPH0464121B2 (cg-RX-API-DMAC10.html)
JPS631750B2 (cg-RX-API-DMAC10.html)
JPS5826662B2 (ja) 半導体素子のボンデイング用金線

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071117

Year of fee payment: 15