JPS631750B2 - - Google Patents
Info
- Publication number
- JPS631750B2 JPS631750B2 JP54171732A JP17173279A JPS631750B2 JP S631750 B2 JPS631750 B2 JP S631750B2 JP 54171732 A JP54171732 A JP 54171732A JP 17173279 A JP17173279 A JP 17173279A JP S631750 B2 JPS631750 B2 JP S631750B2
- Authority
- JP
- Japan
- Prior art keywords
- ppm
- weight
- bonding
- gold
- element group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/50—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45644—Gold (Au) as principal constituent
-
- H10W72/5522—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17173279A JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17173279A JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5696844A JPS5696844A (en) | 1981-08-05 |
| JPS631750B2 true JPS631750B2 (cg-RX-API-DMAC10.html) | 1988-01-13 |
Family
ID=15928645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17173279A Granted JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5696844A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2231336B (en) * | 1989-04-28 | 1993-09-22 | Tanaka Electronics Ind | Gold wire for the bonding of a semiconductor device |
| US5384089A (en) * | 1994-05-02 | 1995-01-24 | Diamond; Lawrence H. | Yellow karat gold casting alloys |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
| JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
-
1979
- 1979-12-29 JP JP17173279A patent/JPS5696844A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5696844A (en) | 1981-08-05 |