JPS631752B2 - - Google Patents
Info
- Publication number
- JPS631752B2 JPS631752B2 JP55018316A JP1831680A JPS631752B2 JP S631752 B2 JPS631752 B2 JP S631752B2 JP 55018316 A JP55018316 A JP 55018316A JP 1831680 A JP1831680 A JP 1831680A JP S631752 B2 JPS631752 B2 JP S631752B2
- Authority
- JP
- Japan
- Prior art keywords
- ppm
- weight
- element group
- bonding
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- H10W72/50—
-
- H10W72/5522—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1831680A JPS56115544A (en) | 1980-02-15 | 1980-02-15 | Gold wire for bonding semiconductor element and semiconductor element |
| US06/160,302 US4330329A (en) | 1979-11-28 | 1980-06-17 | Gold bonding wire for semiconductor elements and the semiconductor element |
| DE3023623A DE3023623C2 (de) | 1979-11-28 | 1980-06-24 | Gold-Verbindungsdraht für Halbleiterelemente und dessen Verwendung für Verbindungsstellen einer Silicium-Chip-Elektrode in Halbleiterelementen |
| GB8021205A GB2063913B (en) | 1979-11-28 | 1980-06-27 | Gold wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1831680A JPS56115544A (en) | 1980-02-15 | 1980-02-15 | Gold wire for bonding semiconductor element and semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56115544A JPS56115544A (en) | 1981-09-10 |
| JPS631752B2 true JPS631752B2 (cg-RX-API-DMAC10.html) | 1988-01-13 |
Family
ID=11968202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1831680A Granted JPS56115544A (en) | 1979-11-28 | 1980-02-15 | Gold wire for bonding semiconductor element and semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56115544A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4513440B2 (ja) * | 2004-07-15 | 2010-07-28 | 住友ベークライト株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
| JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
-
1980
- 1980-02-15 JP JP1831680A patent/JPS56115544A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56115544A (en) | 1981-09-10 |
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